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    • 32. 发明申请
    • METHOD OF FABRICATING T-GATE
    • 制造T型门的方法
    • US20090075463A1
    • 2009-03-19
    • US12270016
    • 2008-11-13
    • Jae Yoeb SHIMHyung Sup YOONDong Min KANGJu Yeon HONGKyung Ho LEE
    • Jae Yoeb SHIMHyung Sup YOONDong Min KANGJu Yeon HONGKyung Ho LEE
    • H01L21/44
    • H01L21/0331H01L21/28587
    • A method of fabricating a T-gate is provided. The method includes the steps of: forming a photoresist layer on a substrate; patterning the photoresist layer formed on the substrate and forming a first opening; forming a first insulating layer on the photoresist layer and the substrate; removing the first insulating layer and forming a second opening to expose the substrate; forming a second insulating layer on the first insulating layer; removing the second insulating layer and forming a third opening to expose the substrate; forming a metal layer on the second insulating layer on which the photoresist layer and the third opening are formed; and removing the metal layer formed on the photoresist layer. Accordingly, a uniform and elaborate opening defining the length of a gate may be formed by deposition of the insulating layer and a blanket dry etching process, and thus a more elaborate micro T-gate electrode may be fabricated.
    • 提供一种制造T型栅极的方法。 该方法包括以下步骤:在衬底上形成光致抗蚀剂层; 图案化形成在基板上的光致抗蚀剂层并形成第一开口; 在所述光致抗蚀剂层和所述基板上形成第一绝缘层; 去除所述第一绝缘层并形成第二开口以暴露所述衬底; 在所述第一绝缘层上形成第二绝缘层; 去除所述第二绝缘层并形成第三开口以暴露所述衬底; 在其上形成有光致抗蚀剂层和第三开口的第二绝缘层上形成金属层; 并除去形成在光致抗蚀剂层上的金属层。 因此,可以通过沉积绝缘层和橡皮干蚀刻工艺来形成限定栅极长度的均匀且精细的开口,因此可以制造更精细的微型T型栅电极。
    • 36. 发明授权
    • Microwave power amplifier
    • 微波功率放大器
    • US06940354B2
    • 2005-09-06
    • US10735037
    • 2003-12-11
    • Dong Min KangHyung Sup YoonHea Cheon KimKyoung Ik Cho
    • Dong Min KangHyung Sup YoonHea Cheon KimKyoung Ik Cho
    • H03F3/189H03F3/60H03F3/68H03F3/191
    • H03F3/605
    • A microwave power amplifier comprising a drive amplifying stage includes power elements, gate and drain bias circuits of the power elements, a RC parallel circuit connected between input port and gates of said power elements, a shunt resistor connected between ground terminal and said gates of power elements, and a negative feedback circuit connected in series with resistors and capacitors and in parallel with the power elements. An interstage matching circuit is connected in series with the drive amplifying stage; and a power amplifying stage including power elements connected in parallel with a power divider and a power coupler, gate and drain bias circuits of said power elements, a RC parallel circuit connected between the gates of power elements and the interstage matching circuit, and a shunt resistor connected between a ground and the gates of power elements.
    • 包括驱动放大级的微波功率放大器包括功率元件,功率元件的栅极和漏极偏置电路,连接在所述功率元件的输入端口和栅极之间的RC并联电路,连接在接地端子和所述功率门之间的分流电阻器 元件和与电阻器和电容器串联连接并与功率元件并联的负反馈电路。 级间匹配电路与驱动放大级串联; 以及功率放大级,包括与功率分配器和功率耦合器并联连接的功率元件,所述功率元件的栅极和漏极偏置电路,连接在功率元件的栅极和级间匹配电路之间的RC并联电路,以及分流器 电阻连接在地和功率元件的门之间。