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31. 发明授权

US08456756B2 Zoom lens barrel assembly 有权
标题翻译：变焦镜头组件
公开(公告)号：US08456756B2
公开(公告)日：2013-06-04
申请号：US13301923
申请日：2011-11-22
申请人： Chan-ho Lee , Young-eun Kim , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
发明人： Chan-ho Lee , Young-eun Kim , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
IPC分类号： G02B15/14 , G03B17/00
CPC分类号： G02B7/10
摘要： A zoom lens barrel assembly includes: a zoom ring having a cylindrical shape, and comprising an inlet portion formed in a boundary of one end thereof and a first protrusion; a guide ring disposed around the zoom ring, and comprising a first guide hole through which the first protrusion passes, and movably supporting the zoom ring in an axial direction, and a second guide hole; and a cylinder disposed in the zoom ring, for moving and rotating between a position where the cylinder is accommodated in the zoom ring and a position where the cylinder moves away from the zoom ring in the axial direction, and comprising a second protrusion that passes through the second guide hole, accommodated in the inlet portion at the position where the cylinder is accommodated, and pressing one end of the inlet portion when the cylinder moves away from the zoom ring.
摘要翻译：变焦镜筒组件包括：具有圆柱形形状的变焦环，并且包括形成在其一端的边界和第一突起的入口部分; 导向环，设置在变焦环周围，并且包括第一突起穿过的第一引导孔和沿轴向可移动地支撑变焦环和第二引导孔; 以及设置在所述变焦环中的气缸，用于在所述气缸容纳在所述变焦环中的位置与所述气缸沿所述轴向方向远离所述变焦环的位置之间移动和旋转，并且包括穿过所述变焦环的第二突起所述第二引导孔容纳在容纳所述气缸的位置处的所述入口部分中，并且当所述气缸远离所述变焦环移动时按压所述入口部分的一端。

32. 发明申请

US20120206821A1 ZOOM LENS BARREL ASSEMBLY 有权
标题翻译：变焦镜头棒组件
公开(公告)号：US20120206821A1
公开(公告)日：2012-08-16
申请号：US13301923
申请日：2011-11-22
申请人： Chan-ho Lee , Young-eun Kim , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
发明人： Chan-ho Lee , Young-eun Kim , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
IPC分类号： G02B7/04
CPC分类号： G02B7/10
摘要： A zoom lens barrel assembly includes: a zoom ring having a cylindrical shape, and comprising an inlet portion formed in a boundary of one end thereof and a first protrusion; a guide ring disposed around the zoom ring, and comprising a first guide hole through which the first protrusion passes, and movably supporting the zoom ring in an axial direction, and a second guide hole; and a cylinder disposed in the zoom ring, for moving and rotating between a position where the cylinder is accommodated in the zoom ring and a position where the cylinder moves away from the zoom ring in the axial direction, and comprising a second protrusion that passes through the second guide hole, accommodated in the inlet portion at the position where the cylinder is accommodated, and pressing one end of the inlet portion when the cylinder moves away from the zoom ring.
摘要翻译：变焦镜筒组件包括：具有圆柱形形状的变焦环，并且包括形成在其一端的边界和第一突起的入口部分; 导向环，设置在变焦环周围，并且包括第一突起穿过的第一引导孔和沿轴向可移动地支撑变焦环和第二引导孔; 以及设置在所述变焦环中的气缸，用于在所述气缸容纳在所述变焦环中的位置与所述气缸沿所述轴向方向远离所述变焦环的位置之间移动和旋转，并且包括穿过所述变焦环的第二突起所述第二引导孔容纳在容纳所述气缸的位置处的所述入口部分中，并且当所述气缸远离所述变焦环移动时按压所述入口部分的一端。

33. 发明申请

US20120154028A1 BIAS CIRCUIT AND ANALOG INTEGRATED CIRCUIT COMPRISING THE SAME 有权
标题翻译：偏置电路和包含该电路的模拟集成电路
公开(公告)号：US20120154028A1
公开(公告)日：2012-06-21
申请号：US13243955
申请日：2011-09-23
申请人： Yi-Gyeong Kim , Bong Chan Kim , Min-Hyung Cho , Jong-Kee Kwon
发明人： Yi-Gyeong Kim , Bong Chan Kim , Min-Hyung Cho , Jong-Kee Kwon
IPC分类号： G05F1/10
CPC分类号： H03F3/45475 , H03F2203/45248 , H03F2203/45514 , H03F2203/45541 , H03F2203/45551
摘要： Disclosed is a bias circuit which includes a bias voltage generating part configured to generate a bias voltage using a reference current and a variable current; a reference current source part configured to provide the reference current to the bias voltage generating part; and a current adjusting part configured to provide the variable current to the bias voltage generating part and to adjust the amount of the variable current according to voltage levels of at least two input signals. The bias circuit prevents an increase in power consumption and improves a slew rate at the same time.
摘要翻译：公开了一种偏置电路，其包括被配置为使用参考电流和可变电流产生偏置电压的偏置电压产生部件; 参考电流源部，被配置为将所述参考电流提供给所述偏置电压产生部; 以及电流调节部，被配置为向所述偏置电压生成部提供所述可变电流，并且根据至少两个输入信号的电压电平来调整所述可变电流的量。偏置电路可以防止功耗的增加，同时提高转换速率。

34. 发明授权

US07869836B2 Power saving devices and power saving methods for mobile access point, and wireless network systems 有权
标题翻译：省电设备和移动接入点的省电方法，以及无线网络系统
公开(公告)号：US07869836B2
公开(公告)日：2011-01-11
申请号：US11605967
申请日：2006-11-30
申请人： Bong-Chan Kim
发明人： Bong-Chan Kim
IPC分类号： H04M1/00 , H04B1/38
CPC分类号： H04W52/0216 , H04W84/12 , Y02D70/00 , Y02D70/142
摘要： In a power saving device and power saving method for a mobile access point, the power saving device sets a minimum power saving interval among power saving intervals of at least one first station coupled to the mobile access point as a power saving interval of the mobile access point. The power saving device prevents a power supply voltage from being supplied to at least one first wireless interface wirelessly communicating with the first station(s) during the power saving interval of the mobile access point when a minimum remaining power saving interval of at least one second station working in a power saving mode is longer than the power saving interval of the mobile access point.
摘要翻译：在用于移动接入点的省电装置和省电方法中，节电装置将耦合到移动接入点的至少一个第一站的功率节省间隔中的最小省电间隔设置为移动接入的功率节省间隔点。省电装置防止在移动接入点的省电间隔期间向至少一个与第一站无线通信的至少一个第一无线接口提供电源电压，当至少一秒钟的最小剩余功率节省间隔工作在省电模式的工作站比移动接入点的节电时间长。

35. 发明授权

US07847386B1 Reduced size stacked semiconductor package and method of making the same 有权
标题翻译：堆叠半导体封装的尺寸减小，制造方法也是如此
公开(公告)号：US07847386B1
公开(公告)日：2010-12-07
申请号：US11935314
申请日：2007-11-05
申请人： Bong Chan Kim , Jae Young Na , Jae Kyu Song
发明人： Bong Chan Kim , Jae Young Na , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L21/76898 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/94 , H01L2224/0401 , H01L2224/0557 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48599 , H01L2224/73204 , H01L2224/73257 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2924/00015
摘要： In accordance with the present invention, there is provided multiple embodiments of a reduced size stackable semiconductor package. In a basic embodiment of the present invention, the semiconductor package comprises a bulk layer having at least one first bond pad formed therein. At least one active layer is formed on the bulk layer and electrically coupled to the first bond pad. Additionally, at least one second bond pad is formed on the active layer and is electrically coupled thereto. A protection layer is formed on that surface of the active layer having the second bond pad formed thereon, the protection layer also partially encapsulating the second bond pad. In other embodiments of the present invention, the above-described semiconductor package is provided in a stacked arrangement and in a prescribed pattern of electrical communication with one or more additional, identically configured semiconductor packages. In these stacked arrangements, one or more interposers and/or solder balls may optionally integrated into such semiconductor package stacks. In other embodiments of the present invention, a semiconductor package is provided wherein a semiconductor package stack is itself electrically connected to a substrate and covered with an encapsulant material which ultimately hardens into a package body.
摘要翻译：根据本发明，提供了可缩小尺寸的可堆叠半导体封装的多个实施例。在本发明的基本实施例中，半导体封装包括其中形成有至少一个第一接合焊盘的主体层。至少一个活性层形成在本体层上并电耦合到第一接合焊盘。另外，至少一个第二接合焊盘形成在有源层上并与其电耦合。在其上形成有第二接合焊盘的有源层的表面上形成保护层，保护层也部分地封装第二接合焊盘。在本发明的其他实施例中，上述半导体封装以堆叠的布置和与一个或多个附加的相同配置的半导体封装的规定的电气通信模式提供。在这些堆叠布置中，一个或多个插入件和/或焊球可以可选地集成到这种半导体封装堆叠中。在本发明的其他实施例中，提供半导体封装，其中半导体封装堆叠本身电连接到衬底并被最终硬化成封装体的密封剂材料覆盖。

36. 发明授权

US07408254B1 Stack land grid array package and method for manufacturing the same 有权
标题翻译：堆叠焊盘阵列封装及其制造方法
公开(公告)号：US07408254B1
公开(公告)日：2008-08-05
申请号：US11212979
申请日：2005-08-26
申请人： Bong Chan Kim , Yoon Joo Kim , Youn Sang Kim
发明人： Bong Chan Kim , Yoon Joo Kim , Youn Sang Kim
IPC分类号： H01L23/02
CPC分类号： H01L23/3121 , H01L21/561 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.
摘要翻译：半导体器件具有具有第一，第二和第三表面的衬底。在第一表面上形成导电图案。半导体管芯具有形成在其第一表面上的接合焊盘。半导体管芯的第二表面耦合到衬底的第一表面。第一连接构件将接合焊盘和导电图案电耦合。第一块土地有第一，第二和第三面。第一焊盘的第二表面耦合到第一导电图案。第一密封剂封装第一半导体管芯，第一连接构件和第一焊盘，使得第一焊盘的第一表面露出。

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