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21. 发明授权

US08100314B2 Carbon nanotubes solder composite for high performance interconnect 有权
标题翻译：碳纳米管焊料复合材料用于高性能互连
公开(公告)号：US08100314B2
公开(公告)日：2012-01-24
申请号：US12690052
申请日：2010-01-19
申请人： Daewoong Suh
发明人： Daewoong Suh
IPC分类号： A47J36/02 , B23K31/00 , B23K35/12 , B23K31/02 , B23K1/00 , B23K35/34 , F01N13/18 , H01L21/44
CPC分类号： H05K3/3484 , B82Y10/00 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13393 , H01L2224/81011 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K2201/026 , H05K2201/0323 , H01L2924/00 , H01L2924/00014
摘要： An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.
摘要翻译：本发明的实施例是互连技术。制备碳纳米管（CNT）。形成含有预定体积分数的CNT和焊料的CNT-焊料复合浆料。

22. 发明授权

US08070047B1 Flux composition and method of soldering 有权
标题翻译：焊剂组成和焊接方法
公开(公告)号：US08070047B1
公开(公告)日：2011-12-06
申请号：US12958495
申请日：2010-12-02
申请人： David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle
发明人： David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle
IPC分类号： B23K31/02 , B23K35/34
CPC分类号： B23K35/3615 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/42
摘要： A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译：提供助熔剂组合物，其包含作为初始组分的由式I表示的助熔剂：其中R 1，R 2，R 3和R 4独立地选自氢，取代的C 1-8烷基，未取代的C 1-80烷基基团，取代的C7-80芳烷基和未取代的C7-80芳烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢。还提供了使用助焊剂组合物焊接电接触的方法。

23. 发明授权

US08070046B1 Amine flux composition and method of soldering 有权
标题翻译：胺助焊剂组成及焊接方法
公开(公告)号：US08070046B1
公开(公告)日：2011-12-06
申请号：US12958493
申请日：2010-12-02
申请人： David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle , Asghar Akber Peera , Glenn N. Robinson , Ian Tomlinson
发明人： David D. Fleming , Mike K. Gallagher , Kim Sang Ho , Xiang-Qian Liu , Mark R. Winkle , Asghar Akber Peera , Glenn N. Robinson , Ian Tomlinson
IPC分类号： B23K31/02 , B23K35/34
CPC分类号： B23K35/3615 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/38 , B23K2101/42 , C07C215/18 , C07C215/28 , C07C217/28
摘要： An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; and, wherein R9 is selected from a hydrogen, a C1-30 alkyl group, a substituted C1-30 alkyl group, a C6-30 aryl group and a substituted C6-30 aryl group. Also provided is a method of soldering an electrical contact using the amine flux composition.
摘要翻译：提供了一种胺助剂组合物，其包含作为初始组分的：由式I表示的胺助熔剂：其中R 1，R 2，R 3和R 4独立地选自氢，取代的C 1-80烷基，未取代的C1- 80烷基，取代的C7-80芳烷基和未取代的C7-80芳烷基; 其中R 7和R 8独立地选自C 1-20烷基，取代的C 1-20烷基，C 6-20芳基和取代的C 6-20芳基，或者其中R 7和R 8与它们连接，形成任选被C 1-6烷基取代的C 3-20环烷基环; 其中R 10和R 11独立地选自C 1-20烷基，取代的C 1-20烷基，C 6-20芳基和取代的C 6-20芳基，或其中R 10和R 11与它们连接，形成任选被C 1-6烷基取代的C 3-20环烷基环; 并且其中R9选自氢，C1-30烷基，取代的C1-30烷基，C6-30芳基和取代的C6-30芳基。还提供了使用胺通量组合物焊接电接触的方法。

24. 发明申请

US20110274937A1 LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS 审中-公开
标题翻译：无铅焊接合金，含有焊料合金的耐疲劳耐火材料和使用焊接材料加工的产品
公开(公告)号：US20110274937A1
公开(公告)日：2011-11-10
申请号：US13145163
申请日：2010-01-18
申请人： Kenichiro Sugimori , Seiji Yamada , Satoshi Kawakubo , Atsushi Irisawa
发明人： Kenichiro Sugimori , Seiji Yamada , Satoshi Kawakubo , Atsushi Irisawa
IPC分类号： B32B15/04 , B23K35/34 , C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K2101/36 , Y10T428/31678
摘要： [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material.[MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core.[SELECTED FIGURE] FIG. 2
摘要翻译： [待解决的问题]为了提供耐湿性优异且耐热疲劳性优异的低银无铅焊料合金，耐疲劳性优异的焊锡膏焊料和树脂焊剂芯焊料，以及通过使用焊接材料的接合产品。 [用于溶解] 0.1〜1.5重量％的Cu，0.01重量％以上且小于0.05重量％的Co，0.05〜0.25重量％的Ag，0.001〜0.008重量％的Ge，余数为Sn。这种低银无铅焊料合金与糊状焊剂混合，或者通过使用固体或糊状焊剂作为核心以衬垫形式模制。 [选择的图] 2

25. 发明授权

US07767032B2 No-clean low-residue solder paste for semiconductor device applications 有权
标题翻译：用于半导体器件应用的无清洁低残留焊膏
公开(公告)号：US07767032B2
公开(公告)日：2010-08-03
申请号：US11479374
申请日：2006-06-30
申请人： Quan Sheng , Muriel Thomas , Jens Nachreiner
发明人： Quan Sheng , Muriel Thomas , Jens Nachreiner
IPC分类号： B23K35/34
CPC分类号： B23K35/025 , B23K35/3612 , B23K35/362
摘要： A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.
摘要翻译：描述了用于半导体器件的芯片附着分配或精细间距印刷的不干净的低残留焊膏。焊膏具有均匀的一致性，没有粘贴分离的倾向。最终剩余的残余物是透明的并且晶体样，并且与进一步的处理步骤相容，而无需用溶剂预先清洁以除去助熔剂残余物。焊膏包含相对低量的松香与粘稠溶剂体系，触变剂，活化剂，添加剂和任选的增塑剂组合。

26. 发明申请

US20100175790A1 New Flux Composition and Process For Use Thereof 有权
标题翻译：新型助焊剂组合物及其使用方法
公开(公告)号：US20100175790A1
公开(公告)日：2010-07-15
申请号：US12731369
申请日：2010-03-25
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B23K35/34 , B23K35/36
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译：本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。溶剂包括粘性溶剂与非粘性溶剂的混合物。本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。最后一步包括将叠加的区域相互连接。该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。本发明还包括通过前述方法或方法生产的产品。

27. 发明申请

US20100147567A1 Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board 审中-公开
标题翻译：热固性树脂组合物及其制造方法和电路板
公开(公告)号：US20100147567A1
公开(公告)日：2010-06-17
申请号：US12226872
申请日：2007-08-28
申请人： Hirohisa Hino , Taro Fukui , Hidenori Miyakawa , Atsushi Yamaguchi , Takayuki Higuchi
发明人： Hirohisa Hino , Taro Fukui , Hidenori Miyakawa , Atsushi Yamaguchi , Takayuki Higuchi
IPC分类号： H05K1/09 , B23K35/34
CPC分类号： C08K13/02 , C08K5/09 , C22C12/00 , C22C28/00 , H05K3/3442 , H05K3/3484 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y10T428/31511 , C08L63/00
摘要： The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness.The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.
摘要翻译：本发明的目的是提供一种热固性树脂组合物，其在包含不能耐高温的组分的电子电路中使用低熔点焊料颗粒，从而能够批量降低并且能够包装具有优异的强度和韧性的组分。本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。电子并且能够与金属配位。

28. 发明授权

US07727339B2 Submerged arc flux 有权
标题翻译：埋弧焊
公开(公告)号：US07727339B2
公开(公告)日：2010-06-01
申请号：US11144423
申请日：2005-06-06
申请人： Ashish Kapoor , Teresa A. Melfi
发明人： Ashish Kapoor , Teresa A. Melfi
IPC分类号： B23K35/34 , B23K35/24
CPC分类号： B23K35/362 , B23K35/36 , B23K35/3601 , B23K35/3605 , B23K35/3607
摘要： A highly basic particle flux for submerged arc welding that produces less than 7 ml/100 gr of diffusible hydrogen in the weld metal, which flux comprises a carbon dioxide containing compound with an effective amount of heat releasable carbon dioxide in the range of 0.5-3.5% by weight of the flux over 10% by weight of a low melting point compound and a binder.
摘要翻译：用于埋弧焊的高度基本的颗粒通量，其在焊缝金属中产生小于7ml / 100gr的可扩散氢，该焊剂包含含二氧化碳的化合物，其中有效量的可热释放的二氧化碳的范围为0.5-3.5 通量超过10重量％的低熔点化合物和粘合剂的重量％。

29. 发明申请

US20100126631A1 CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT 有权
标题翻译：碳纳米管用于高性能互连的复合材料
公开(公告)号：US20100126631A1
公开(公告)日：2010-05-27
申请号：US12690052
申请日：2010-01-19
申请人： Daewoong Suh
发明人： Daewoong Suh
IPC分类号： B23K35/34
CPC分类号： H05K3/3484 , B82Y10/00 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13393 , H01L2224/81011 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K2201/026 , H05K2201/0323 , H01L2924/00 , H01L2924/00014
摘要： An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.
摘要翻译：本发明的实施例是互连技术。制备碳纳米管（CNT）。形成含有预定体积分数的CNT和焊料的CNT-焊料复合浆料。

30. 发明申请

US20100119859A1 COMPONENT AND A SOLDER 审中-公开
标题翻译：组件和焊工
公开(公告)号：US20100119859A1
公开(公告)日：2010-05-13
申请号：US12528715
申请日：2008-02-15
申请人： Karl-Heinz Manier , Michael Ott
发明人： Karl-Heinz Manier , Michael Ott
IPC分类号： B23K35/02 , B23K35/34 , B22F1/00
CPC分类号： B23K1/0018 , B23K35/0244 , B23K35/3033 , B23K2101/001 , B23K2103/26 , F23R2900/00019 , Y10T428/12222
摘要： A component and a solder are provided. The solder is used to repair the component including a base material with a directional microstructure. The solder used includes two constituents, a first constituent and a second constituent, including different grain size distributions. The first constituent of the solder includes a composition that corresponds to or is similar to the base material.
摘要翻译：提供组件和焊料。焊料用于修复包括具有定向微结构的基材的部件。所使用的焊料包括两种成分，第一组分和第二组分，包括不同的晶粒尺寸分布。焊料的第一组分包括与基材相对应或相似的组合物。

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