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21. 发明授权

US09516755B2 Multi-channel memory module 有权
标题翻译：多通道内存模块
公开(公告)号：US09516755B2
公开(公告)日：2016-12-06
申请号：US13730505
申请日：2012-12-28
申请人： Intel Corporation
发明人： Hue V. Lam , Loc V. Doan
IPC分类号： H05K1/14 , G11C5/04 , G06F21/86 , H05K1/11 , H05K3/36
CPC分类号： H05K1/141 , G06F21/86 , G11C5/04 , H05K1/117 , H05K3/368 , H05K2201/041 , H05K2201/10098 , H05K2201/10159 , H05K2201/10409
摘要： Embodiments of the invention describe a motherboard PCB having a memory bus to receive signal data from a channel of memory chips/devices of a memory module. Electrical contacts, communicatively coupled to the memory bus, securely couple the PCB to the memory chips/devices of the memory module. Embodiments of the invention further include a receiving housing that includes said electrical contacts and has a height less or equal to the height of the memory module. Embodiments of the invention further describe a memory module having a memory card housing, first and second pluralities of memory chips/devices included in the housing, and first and second pluralities of memory module electrical EO terminals for coupling the first and second pluralities of memory chips/devices to PCB, respectively. In embodiments of the invention, the above described first and second pluralities electrical EO connectors are disposed on different sides of the housing.
摘要翻译：本发明的实施例描述了具有存储器总线以从存储器模块的存储器芯片/器件的通道接收信号数据的母板PCB。通信地耦合到存储器总线的电触点将PCB牢固地耦合到存储器模块的存储器芯片/器件。本发明的实施例还包括容纳壳体，其包括所述电触头并且具有小于或等于存储器模块的高度的高度。本发明的实施例进一步描述了具有存储卡外壳，包括在外壳中的第一和第二多个存储器芯片/器件的存储器模块以及用于耦合第一和第二多个存储器芯片的第一和第二多个存储器模块电EO端子 /设备到PCB。在本发明的实施例中，上述第一和第二多个电EO连接器设置在壳体的不同侧。

22. 发明授权

US09510462B2 Method for fabricating circuit board structure 有权
标题翻译：电路板结构的制造方法
公开(公告)号：US09510462B2
公开(公告)日：2016-11-29
申请号：US14565738
申请日：2014-12-10
申请人： Quanta Computer Inc.
发明人： Tung-Lin Chuang , Chi-Yi Yen
IPC分类号： H05K3/36 , B23K1/00 , H05K1/14 , H05K3/34
CPC分类号： H05K3/368 , B23K1/0008 , H05K1/141 , H05K3/3436 , H05K2203/041
摘要： A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area of the second circuit board is less than the area of the first circuit board. The first circuit board and the second circuit board are combined by a surface mount technology to form the circuit board structure having a portion with a different number of layers.
摘要翻译：提供一种制造电路板结构的方法。该方法包括提供第一电路板和第二电路板，其中第二电路板的面积小于第一电路板的面积。第一电路板和第二电路板通过表面贴装技术组合以形成具有不同层数的部分的电路板结构。

23. 发明授权

US09480172B2 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board 有权
标题翻译：用于制造由至少两个印刷电路板区域和印刷电路板组成的印刷电路板的方法
公开(公告)号：US09480172B2
公开(公告)日：2016-10-25
申请号：US14368623
申请日：2012-12-28
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Volodymyr Karpovych , Johannes Stahr
IPC分类号： H05K1/18 , H05K3/36 , H05K3/46 , H05K3/40 , H05K1/14 , H05K1/11
CPC分类号： H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
摘要： A printed circuit board and a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. At least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface.
摘要翻译：一种印刷电路板和由至少两个印刷电路板区域组成的印刷电路板的制造方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域在彼此连接的情况下，在每种情况下，至少一个彼此直接相邻的侧面的区域通过机械联接彼此连接。导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧表面处彼此导电耦合。

24. 发明授权

US09468098B2 Face-up substrate integration with solder ball connection in semiconductor package 有权
标题翻译：半导体封装中与焊球连接的正面衬底集成
公开(公告)号：US09468098B2
公开(公告)日：2016-10-11
申请号：US14220913
申请日：2014-03-20
申请人： QUALCOMM Incorporated
发明人： Daeik Daniel Kim , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka
IPC分类号： H01L23/538 , H05K1/11 , H05K1/03 , H05K1/18 , H05K3/30 , H05K3/40 , H01L23/48 , H01L23/64 , H05K1/02 , H05K3/36 , H05K1/14 , H05K1/16 , H05K3/34
CPC分类号： H05K3/303 , H01L23/48 , H01L23/5385 , H01L23/645 , H01L2924/0002 , H01L2924/19101 , H05K1/0243 , H05K1/0306 , H05K1/111 , H05K1/141 , H05K1/144 , H05K1/165 , H05K1/18 , H05K3/3436 , H05K3/368 , H05K3/4007 , H05K3/4015 , H05K2201/1003 , H05K2201/10477 , H05K2201/10719 , H05K2201/10734 , H05K2201/10977 , H05K2203/041 , H05K2203/1316 , Y10T29/4902 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate.
摘要翻译：系统和方法涉及包括第一衬底或2D无源玻璃（POG）结构的半导体封装，其具有无源部件和形成在玻璃衬底的表面上的一个或多个封装焊盘的第一组。半导体封装还包括具有第二组一个或多个封装焊盘的第二或层压衬底，其形成在第二层压衬底的表面上。焊球被落下，被配置为使第一组一个或多个封装焊盘与第二组一个或多个封装焊盘接触，其中第一基板或2D POG结构朝上放置在第二或层压板的表面上基质。印刷电路板（PCB）可以耦合到第二或层压基板的底侧。

25. 发明申请

US20160252887A1 Substrate Unit, Timepiece, And Substrate Bonding Method 有权
标题翻译：基板单元，钟表和基板接合方法
公开(公告)号：US20160252887A1
公开(公告)日：2016-09-01
申请号：US15009422
申请日：2016-01-28
申请人： CASIO COMPUTER CO., LTD.
发明人： Koji NAMIKI
IPC分类号： G04G21/00 , B23K1/00 , H05K1/11 , G04G17/04
CPC分类号： H05K1/115 , G04G17/04 , G04G17/06 , H05K1/113 , H05K1/117 , H05K1/141 , H05K3/368 , H05K2201/09027 , H05K2201/09181
摘要： A substrate unit includes a first substrate and a second substrate, the second substrate including a superimposed portion superimposed on at least part of the first substrate, and bonding portions located in a plurality of positions at least defining a plane in the superimposed portion, the bonding portions bonded to the first substrate.
摘要翻译：基板单元包括第一基板和第二基板，第二基板包括重叠在第一基板的至少一部分上的叠加部分，以及位于多个位置的接合部分，该多个位置至少在重叠部分中限定平面，结合到第一基底的部分。

26. 发明授权

US09419359B2 Plug and printed circuit board assembly 有权
标题翻译：插头和印刷电路板组件
公开(公告)号：US09419359B2
公开(公告)日：2016-08-16
申请号：US14547408
申请日：2014-11-19
申请人： Huawei Device Co., Ltd.
发明人： Jin Tu , Yu Chen , Haisen Bao
IPC分类号： H01R12/00 , H01R12/70 , H01R13/04 , H01R12/72 , H01R12/73 , G07C5/08 , H01R12/58 , H05K3/36 , H05K1/14 , H05K1/18
CPC分类号： H01R12/7082 , G07C5/0808 , H01R12/58 , H01R12/724 , H01R12/73 , H01R13/04 , H05K1/144 , H05K1/184 , H05K3/368 , H05K2201/042 , H05K2201/10189
摘要： A plug and a printed circuit board (PCB) assembly are provided that relate to the field of vehicle testing and reduce a volume of the PCB assembly. The plug includes a plug body, where a first row of slots and a second row of slots are disposed on the plug body; and the plug further includes first pins in one-to-one correspondence with the first row of slots and second pins in one-to-one correspondence with the second row of slots; the first pin is L-shaped, and the other end is configured to connect to a first PCB; and the second pin is stair-shaped, one end of the second pin is embedded in a slot, in a corresponding position, of the second row of slots, and the other end is configured to connect to the first PCB, is parallel to the end.
摘要翻译：提供了与车辆测试领域相关的插头和印刷电路板（PCB）组件，并减少了PCB组件的体积。插头包括插头主体，其中第一排插槽和第二排插槽设置在插头主体上; 并且所述插头还包括与所述第一排槽一一对应的第一销和与所述第二排槽一一对应的第二销; 第一销为L形，另一端配置成连接到第一PCB; 并且所述第二销为阶梯状，所述第二销的一端嵌入在所述第二排槽的相应位置的槽中，并且所述另一端被配置为连接到所述第一PCB，结束。

27. 发明申请

US20160100481A1 ANISOTROPIC CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开
标题翻译：各向异性导电膜，其制造方法和使用该印刷电路板的印刷电路板
公开(公告)号：US20160100481A1
公开(公告)日：2016-04-07
申请号：US14755947
申请日：2015-06-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Soon KIM
IPC分类号： H05K1/03 , H01B1/20 , H05K1/02 , B29C39/00
CPC分类号： H01B1/20 , B29C39/003 , B29K2995/0005 , B29L2007/008 , H05K3/321 , H05K3/368 , H05K2201/0329
摘要： There are provided an anisotropic conductive film, a method of manufacturing the same, and a printed circuit board using the same. More specifically, the anisotropic conductive film according to an exemplary embodiment of the present disclosure includes an insulating mattress containing a non-conductive polymer, and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer. Further, the printed circuit board using the anisotropic conductive film of the present disclosure may prevent open or short between upper circuit patterns and lower circuit patterns, and allow a fine pitch between the circuit patterns, due to the structure of the anisotropic conductive film formed between the substrates.
摘要翻译：提供各向异性导电膜，其制造方法和使用其的印刷电路板。更具体地，根据本公开的示例性实施方案的各向异性导电膜包括含有非导电聚合物的绝缘床垫和沿从绝缘床垫的上表面到下表面的方向形成的多个导电圆柱体，含有导电聚合物。此外，使用本公开的各向异性导电膜的印刷电路板可以防止上电路图案和下电路图案之间的开路或短路，并且由于各向异性导电膜之间形成的结构，允许电路图案之间的微小间距底物。

28. 发明申请

US20160066436A1 METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE 有权
标题翻译：制造电路板结构的方法
公开(公告)号：US20160066436A1
公开(公告)日：2016-03-03
申请号：US14565738
申请日：2014-12-10
申请人： Quanta Computer Inc.
发明人： Tung-Lin Chuang , Chi-Yi Yen
IPC分类号： H05K3/36 , B23K1/00 , H05K3/30
CPC分类号： H05K3/368 , B23K1/0008 , H05K1/141 , H05K3/3436 , H05K2203/041
摘要： A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area of the second circuit board is less than the area of the first circuit board. The first circuit board and the second circuit board are combined by a surface mount technology to form the circuit board structure having a portion with a different number of layers.
摘要翻译：提供一种制造电路板结构的方法。该方法包括提供第一电路板和第二电路板，其中第二电路板的面积小于第一电路板的面积。第一电路板和第二电路板通过表面贴装技术组合以形成具有不同层数的部分的电路板结构。

29. 发明授权

US09277650B2 Combined wiring board and method for manufacturing the same 有权
标题翻译：组合线路板及其制造方法
公开(公告)号：US09277650B2
公开(公告)日：2016-03-01
申请号：US14542753
申请日：2014-11-17
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/11 , H05K1/14 , H05K1/02 , H05K3/36 , H05K3/00
CPC分类号： H05K1/142 , H05K1/0228 , H05K1/0271 , H05K1/144 , H05K3/0052 , H05K3/0097 , H05K3/368 , H05K2201/068 , H05K2201/2018 , H05K2201/2072 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
摘要翻译：组合布线板包括多个布线板，以及具有多个金属框架和一个或多个连接部分的连接的金属框架，使得金属框架通过连接部分或连接部分彼此连接，并具有容纳布线的容纳开口部分板。

30. 发明申请

US20160049741A1 COMPLIANT STAPLE PIN FOR CONNECTING MULTIPLE PRINTED CIRCUIT BOARDS 有权
标题翻译：用于连接多个打印的电路板的合适的针脚
公开(公告)号：US20160049741A1
公开(公告)日：2016-02-18
申请号：US14459481
申请日：2014-08-14
申请人： Continental Automotive Systems, Inc.
发明人： Jake P. Cassin , Thomas Brey
IPC分类号： H01R11/01 , H05K3/36
CPC分类号： H05K3/36 , H01R9/096 , H01R12/52 , H01R12/585 , H01R12/732 , H05K1/142 , H05K3/368 , H05K2201/10363
摘要： Circuit boards are mechanically connected to each other by a U-shaped pin, the legs of which are forcibly inserted into holes along edges of the circuit boards. The holes are conventional through-holes having metal linings that are electrically connected to circuit board traces that extend to components on the circuit boards. The U-shaped pin thus electrically connects components on the two circuit boards to each other.
摘要翻译：电路板通过U形销钉相互机械连接，U形销的腿部被强制插入电路板边缘的孔中。这些孔是具有金属衬里的常规通孔，其电连接到电路板迹线，电路板迹线延伸到电路板上的部件。因此，U形销将两个电路板上的部件彼此电连接。

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