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21. 发明授权

US09863616B2 Circuit board for LED applications 有权
公开(公告)号：US09863616B2
公开(公告)日：2018-01-09
申请号：US13705897
申请日：2012-12-05
申请人： Bridgelux, Inc.
发明人： Michael N. Gershowitz
IPC分类号： H05K1/02 , H05K1/18 , F21V21/00 , F21V23/00 , H05K1/05
CPC分类号： F21V21/00 , F21V23/004 , H05K1/0209 , H05K1/0256 , H05K1/056 , H05K1/18 , H05K2201/09027 , H05K2201/09063 , H05K2201/09781 , H05K2201/10106
摘要： Circuit boards are designed and configured for mounting light emitting devices (LEDs), such as for LED light bulb and LED light tube applications, and are capable of passing a non-isolated, mains powered, electrical strength test.

22. 发明授权

US09841180B1 Combined type single stud illuminating building block 有权
公开(公告)号：US09841180B1
公开(公告)日：2017-12-12
申请号：US15401129
申请日：2017-01-09
申请人： LONGMEN GETMORE POLYURETHANE CO., LTD.
发明人： Chia-Yen Lin , Yaping Feng
IPC分类号： F21V33/00 , H05K1/18 , F21V15/01
CPC分类号： F21V33/008 , A63H33/042 , A63H33/086 , F21V15/01 , H05K1/181 , H05K2201/09027 , H05K2201/09145 , H05K2201/10106 , H05K2201/10113
摘要： A combined type single stud illuminating building block includes a circuit board, an illuminating member and an outer housing. The circuit board includes a top side and a bottom side opposite to each other. The circuit board is extended to form at least one first connection portion. The bottom side includes an electrode circuit. The illuminating member is mounted on the top side and electrically connected with the electrode circuit. The outer housing includes a connection hole to receive the circuit board and the illuminating member. The outer housing is hollow and light transmittable. The outer housing includes at least one second connection portion connected with the at least one first connection portion, respectively. Thus, the combined type single stud illuminating building block can be connected with the building block having various numbers of engaging studs to enhance degrees of freedom and variability of connection.

23. 发明申请

US20170351143A1 LIGHTING DEVICE AND DISPLAY DEVICE 审中-公开
公开(公告)号：US20170351143A1
公开(公告)日：2017-12-07
申请号：US15539322
申请日：2015-12-18
申请人： Sharp Kabushiki Kaisha
发明人： SHINYA KADOWAKI , RYUZO YUKI , MITSUHIRO MURATA , TAKESHI ISHIDA , TAKESHI MASUDA , HISASHI WATANABE
IPC分类号： G02F1/1335 , F21V8/00
CPC分类号： G02F1/133603 , F21V23/001 , F21V23/0442 , F21Y2103/33 , G02B6/002 , G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0081 , G02B6/0083 , G02B6/0088 , G02B6/009 , G02B6/0093 , G02F1/133615 , G02F2201/56 , G04G9/0005 , G04G17/045 , H05K1/028 , H05K1/181 , H05K2201/0133 , H05K2201/09027 , H05K2201/10106
摘要： A backlight device 12 includes at least: a plurality of LEDs 17 arranged in an annular and curved shape; a light guide plate 14 surrounded by the plurality of LEDs 17 having am outer shape along the arrangement of the plurality of LEDs 17, and guiding light from the plurality of LEDs 17; and an LED board (light source board) 18 on which the plurality of LEDs 17 are mounted and wiring portions 18c for feeding power to the plurality of LEDs 17 are formed. The LED board 18 extends along the arrangement of the plurality of LEDs 17, and has a terminated annular shape or an endless annular shape, and includes a no-wiring formed region NWA in a part with respect to the circumferential direction thereof, where the wiring portions 18c are not formed.

24. 发明申请

US20170271308A1 STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20170271308A1
公开(公告)日：2017-09-21
申请号：US15174465
申请日：2016-06-06
申请人： SK hynix Inc.
发明人： Jin Ho BAEK , Il PARK , Ho Kyoon LEE , Young Pyo JOO
IPC分类号： H01L25/065 , H01L25/00
CPC分类号： H01L25/0657 , H01L25/50 , H01L2225/06517 , H01L2225/06527 , H01L2225/06562 , H05K1/181 , H05K2201/09027 , H05K2201/10515
摘要： A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.

25. 发明申请

US20170185102A1 Techniques for providing an interface component for a wearable device 审中-公开
公开(公告)号：US20170185102A1
公开(公告)日：2017-06-29
申请号：US14998067
申请日：2015-12-24
申请人： Khang Choong Yong , Shu Young Cheah , Wil Choon Song , Jackson Chung Peng Kong , Howard Heck
发明人： Khang Choong Yong , Shu Young Cheah , Wil Choon Song , Jackson Chung Peng Kong , Howard Heck
IPC分类号： G06F1/16 , H01R13/10 , H01R13/426 , H01R12/70
CPC分类号： G06F1/163 , A41D1/005 , G06F1/1656 , H01R4/58 , H01R12/7011 , H01R12/718 , H05K1/11 , H05K3/4007 , H05K2201/09027
摘要： Various embodiments are generally directed to an apparatus, method and other techniques to provide a interface component including a housing comprising a first shell portion and a second shell portion, the first shell portion forming an extended portion for the housing and comprising a retention track engageable a counterpart retention track. The interface component to include a printed circuit board disposed within the housing, the printed circuit board comprising a plurality of contact pins each comprising a contact hole and a retention bump and a socket to couple with a stud.

26. 发明申请

US20170094792A1 Electronic Component 审中-公开
公开(公告)号：US20170094792A1
公开(公告)日：2017-03-30
申请号：US15276547
申请日：2016-09-26
申请人： TBS Avionics Co. Ltd.
发明人： Christoph Dunkel , Remo Masina , Raphael Pirker
IPC分类号： H05K1/14 , A63H27/00 , A63H29/22 , H05K1/18
CPC分类号： H05K1/144 , A63H27/02 , A63H27/12 , A63H29/22 , H05K1/181 , H05K2201/042 , H05K2201/09027 , H05K2201/09063 , H05K2201/10295 , H05K2201/10409 , H05K2201/2036
摘要： The invention concerns an electronic component that comprises a printed circuit board stack with multiple printed circuit boards arranged one on top of the other and that is used, in particular, for model aircraft or commercially utilized unmanned aircraft. The printed circuit boards are held at a distance from one another by spacers. The fastening elements that are provided here are electrically conductive in design, and the printed circuit boards are connected to one another in an electrically conductive manner and also mechanically by these fastening elements.

27. 发明授权

US09593831B2 Artificial LED lighted Christmas tree 有权
标题翻译：人造LED灯圣诞树
公开(公告)号：US09593831B2
公开(公告)日：2017-03-14
申请号：US14485406
申请日：2014-09-12
申请人： 1 ENERGY SOLUTIONS, INC.
发明人： Jing Jing Yu
IPC分类号： H05B37/02 , F21V23/06 , F21V23/00 , A47G33/06 , F21V23/02 , H05B33/08 , F21W121/04 , H05K1/18 , F21Y101/00
CPC分类号： F21V23/004 , A47G33/06 , F21S4/10 , F21V23/006 , F21V23/02 , F21V23/06 , F21W2121/04 , F21Y2101/00 , F21Y2115/10 , H05B33/0806 , H05K1/18 , H05K2201/09027 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913
摘要： Disclosed are various embodiments of an artificial tree that is lit by LEDs. Individual trunk modules are provided on trunk sections that provide individual control of LED strings disposed on branches on each of the trunk sections. Remote control devices and smart devices connected to the Internet can control the trunk modules. Spring-loaded flat connectors between the trunk sections, and also between the branches in the trunks, provide a solid electrical connection, which has a low susceptibility to failure. Plastic injection molded branches having injected molded sockets are provided for connecting LEDs that can be plugged directly into sockets on the trunk sections. The LEDs can be driven with an AC or DC electrical power supply.
摘要翻译：公开了由LED照亮的人造树的各种实施例。在主干部分上提供单独的中继线模块，其提供设置在每个干线部分上的分支上的LED串的单独控制。连接到互联网的遥控设备和智能设备可以控制中继模块。主干部分之间以及中继线之间的分支之间的弹簧式扁平连接器提供了一种牢固的电连接，其具有低的故障敏感性。提供具有注射模制插座的塑料注塑分支，用于连接可直接插入到主干部分上的插座中的LED。 LED可以用AC或DC电源驱动。

28. 发明授权

US09582085B2 Electronic devices with molded insulator and via structures 有权
标题翻译：具有模制绝缘体和通孔结构的电子设备
公开(公告)号：US09582085B2
公开(公告)日：2017-02-28
申请号：US14502949
申请日：2014-09-30
申请人： Apple Inc.
发明人： Aidan N. Zimmerman , Bruce E. Berg , Glenn Aune , Kevin C. Armendariz , Ryan P. Brooks
IPC分类号： G06F3/0354 , G06F3/046 , H01Q1/24 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/40 , G06F3/044 , H05K3/28
CPC分类号： G06F3/03545 , G06F3/044 , H01L2223/6677 , H01L2224/16227 , H01L2924/3025 , H01Q1/243 , H05K1/0274 , H05K1/115 , H05K3/0014 , H05K3/284 , H05K3/4038 , H05K2201/09027 , H05K2201/09545
摘要： An electronic device may have printed circuits to which electrical components are mounted. Plastic may be molded over a printed circuit. Vias may be formed in the printed circuit that connect metal traces on the surface of the molded plastic to metal traces on the printed circuit. The vias may be formed by drilling or by covering the metal traces on the printed circuit with mold pins in a molding tool during plastic molding operations. Plated metal traces or other metal traces may extend onto the interior surface of via holes. Vias may also be filled with conductive material such as solder or conductive adhesive. Metal members that are soldered or otherwise connected to printed circuit traces may be used in coupling surface metal traces to printed circuit traces. Antenna structure, shielding structures, and electrodes for a stylus may be formed using the metal traces on the molded plastic.
摘要翻译：电子设备可以具有安装电气部件的印刷电路。塑料可以在印刷电路上模制。可以在印刷电路中形成通孔，其将模制塑料表面上的金属迹线连接到印刷电路上的金属迹线。可以通过在塑料模制操作期间通过钻孔或通过在模制工具中的模具销覆盖印刷电路上的金属迹线来形成通孔。镀金属痕迹或其他金属迹线可延伸到通孔的内表面。通孔也可以填充导电材料，例如焊料或导电粘合剂。焊接或以其他方式连接到印刷电路迹线的金属构件可用于将表面金属迹线耦合到印刷电路迹线。用于触针的天线结构，屏蔽结构和电极可以使用模制塑料上的金属迹线形成。

29. 发明授权

US09549460B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09549460B2
公开(公告)日：2017-01-17
申请号：US14717456
申请日：2015-05-20
申请人： FUJIKURA LTD
发明人： Hirohito Watanabe , Taiji Ogawa
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H01P3/08
CPC分类号： H05K1/0216 , H01P3/085 , H05K1/0225 , H05K1/0237 , H05K1/025 , H05K1/0393 , H05K2201/0715 , H05K2201/09027 , H05K2201/09681 , H05K2201/09727
摘要： To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31A) that constitutes differential signal lines formed on the insulating substrate (10) and includes a curved portion; a second signal line (L31B) provided along the first signal line (L31A) and side by side inside the curved portion; and a ground layer (30) formed for the first signal line (L31A) and the second signal line (L31B) via an insulating material (10). The ground layer (30) includes a first ground layer (G31A) corresponding to a first region (D1) and a second ground layer (G31B) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31A) and has a first predetermined width (W31A). The second region (D2) is defined based on the second signal line (L31B) and has a second predetermined width (W31B). The first ground layer (G31A) has a remaining ratio lower than a remaining ratio of the second ground layer (G31B).
摘要翻译：为了抑制由于信号线之间的长度差导致的传输时间差的发生，提供了一种印刷线路板，其具有：绝缘基板（10）; 第一信号线（L31A），其构成形成在绝缘基板（10）上并包括弯曲部分的差分信号线; 沿着第一信号线（L31A）设置并并列在弯曲部分内的第二信号线（L31B）; 以及经由绝缘材料（10）为第一信号线（L31A）和第二信号线（L31B）形成的接地层（30）。接地层（30）包括对应于第一区域（D1）的第一接地层（G31A）和对应于第二区域（D2）的第二接地层（G31B）。第一区域（D1）基于第一信号线（L31A）定义并具有第一预定宽度（W31A）。第二区域（D2）基于第二信号线（L31B）被定义并且具有第二预定宽度（W31B）。第一接地层（G31A）的剩余比率比第二接地层（G31B）的剩余率低。

30. 发明授权

US09380698B1 Stretchable electronic patch having a foldable circuit layer 有权
公开(公告)号：US09380698B1
公开(公告)日：2016-06-28
申请号：US14644183
申请日：2015-03-10
申请人： VivaLnk Limited (Cayman Islands)
发明人： Jiang Li , Junfeng Mei
IPC分类号： G06K7/08 , G06K19/02 , G06K19/06 , H05K1/02 , H05K1/03 , H05K1/18 , H05K1/14 , A61B5/00 , H04B1/3827 , H04B5/00
CPC分类号： H05K1/0283 , A61B5/6823 , A61B5/6824 , A61B5/6825 , A61B5/6828 , A61B5/6829 , A61B5/6833 , A61B2562/046 , H04B1/385 , H04B2001/3866 , H05K1/148 , H05K1/189 , H05K3/0014 , H05K3/30 , H05K2201/0133 , H05K2201/09027 , H05K2201/09263 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/1316
摘要： An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

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