专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20160164189A1 COPLANAR WAVEGUIDE IMPLEMENTING LAUNCHER AND WAVEGUIDE CHANNEL SECTION IN IC PACKAGE SUBSTRATE 有权
标题翻译：共振波导在IC封装基板中实现发射器和波导通道部分
公开(公告)号：US20160164189A1
公开(公告)日：2016-06-09
申请号：US14217684
申请日：2014-03-18
申请人： Peraso Technologies, Inc.
发明人： Saman Jafarlou , Mohammad Fakharzadeh
IPC分类号： H01Q21/00 , H01Q13/02
CPC分类号： H01Q13/0283 , H01P5/08 , H01P5/107 , H01Q13/02
摘要： A coplanar waveguide (CPW) apparatus comprises a substrate having a first surface and an opposing second surface. The substrate comprises a metal layer proximate to the first surface. The metal layer comprises a conductive trace comprising a signal line coupled to a launcher element at a first end of the signal line, and a ground plane co-planar with the conductive trace. The ground plane defines a substantially rectangular first region surrounding the launcher element and defining a second region surrounding the signal line, the first and second regions substantially devoid of conductive material. The launcher element has a substantially rectangular shape with a width greater than a width of the signal line at the first end.
摘要翻译：共面波导（CPW）装置包括具有第一表面和相对的第二表面的基底。衬底包括靠近第一表面的金属层。金属层包括导电迹线，该导电迹线包括耦合到信号线的第一端处的发射元件的信号线以及与导电迹线共面的接地平面。接地平面限定围绕发射器元件的基本上矩形的第一区域，并限定围绕信号线的第二区域，第一和第二区域基本上不含导电材料。发射元件具有大于矩形形状，其宽度大于第一端处的信号线的宽度。

22. 发明授权

US09356352B2 Waveguide coupler 有权
标题翻译：波导耦合器
公开(公告)号：US09356352B2
公开(公告)日：2016-05-31
申请号：US13657615
申请日：2012-10-22
申请人： Texas Instruments Incorporated
发明人： Eunyoung Seok , Srinath Ramaswamy , Brian B. Ginsburg , Vijay B. Rentala , Baher Haroun
IPC分类号： H01Q9/04 , H01P5/107
CPC分类号： H01P11/001 , H01P5/08 , H01P5/107 , H01Q9/04 , H01Q9/0407 , H05K3/20 , H05K3/4038 , H05K3/4644 , Y10T29/49016
摘要： An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.
摘要翻译：提供了一种装置。在该装置中，存在天线封装和集成电路（IC）。电路迹线组件固定到IC。耦合器（具有天线组件和高阻抗表面（HIS））固定到电路迹线组件。天线组件具有窗口区域，基本上围绕窗口区域的导电区域，与IC连通的圆形贴片天线以及位于窗口区域内的椭圆形贴片天线，其延伸至少一个圆形贴片天线的一部分，并且与圆形贴片天线通信。 HIS基本上围绕天线组件。

23. 发明授权

US09325050B2 Compact microstrip to waveguide dual coupler transition with a transition probe and first and second coupler probes 有权
标题翻译：紧凑型微带至波导双耦合器转换，具有过渡探针和第一和第二耦合器探针
公开(公告)号：US09325050B2
公开(公告)日：2016-04-26
申请号：US14076093
申请日：2013-11-08
申请人： ZTE (USA) Inc.
发明人： Peng Gao , Ying Shen
IPC分类号： H01P5/107 , H01P5/08 , H01P5/12 , H01P5/02
CPC分类号： H01P5/107 , H01P5/028 , H01P5/08 , H01P5/12
摘要： A compact microstrip to waveguide dual coupler transition includes a multilayer printed circuit board configured with a rectangular region on an upper surface of the multilayer printed circuit board, wherein the rectangular region has a pair of long edges and a pair of short edges; a transition probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the transition probe extends into the rectangular region through a long edge of the rectangular region, and another terminal of the transition probe is electrically connected to a power amplifier; a first coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the first coupler probe extends into the rectangular region; and a second coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the second coupler probe extends into the rectangular region.
摘要翻译：紧凑型微带至波导双耦合器转换包括在多层印刷电路板的上表面上配置有矩形区域的多层印刷电路板，其中矩形区域具有一对长边缘和一对短边缘; 配置在所述多层印刷电路板的上表面上的过渡探针，其中所述过渡探针的端子通过所述矩形区域的长边缘延伸到所述矩形区域中，并且所述过渡探针的另一端子电连接到功率放大器 ; 构造在所述多层印刷电路板的上表面上的第一耦合器探针，其中所述第一耦合器探针的端子延伸到所述矩形区域中; 以及构造在所述多层印刷电路板的上表面上的第二耦合器探针，其中所述第二耦合器探针的端子延伸到所述矩形区域中。

24. 发明授权

US09257735B2 Reconfigurable waveguide interface assembly for transmit and receive orientations 有权
标题翻译：用于发射和接收取向的可重构波导接口组件
公开(公告)号：US09257735B2
公开(公告)日：2016-02-09
申请号：US13870465
申请日：2013-04-25
申请人： Mohammad Fakharzadeh , Mihai Tazlauanu , Bradley R. Lynch , Behzad Biglarbegian
发明人： Mohammad Fakharzadeh , Mihai Tazlauanu , Bradley R. Lynch , Behzad Biglarbegian
IPC分类号： H01P5/08 , H01P11/00 , H01P5/107 , H01Q21/00 , H01Q13/02
CPC分类号： H01P5/08 , H01P5/107 , H01P11/00 , H01P11/001 , H01Q13/02 , H01Q21/0075 , Y10T29/49016
摘要： An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.
摘要翻译：天线装置包括下部组件和上部组件，它们一起形成容纳RF电路装置的空腔。上部组件包括在上部组件的外表面处的波导凸缘接口。波导法兰接口包括从外表面延伸到形成空腔表面的内表面的波导通道。在内表面处的波导通道的开口基本上围绕与外表面平行的上部组件的第一中心线居中，并且与上表面的第二中心线平行于外表面偏移，由此第二中心线垂直于第一个中心线上部组件以第一取向或第二取向可拆卸地附接到下部组件，由此第二取向表示上部组件相对于第一取向的180度旋转。

25. 发明申请

US20150263403A1 TRANSMISSION LINE INTERCONNECT 有权
标题翻译：传输线互连
公开(公告)号：US20150263403A1
公开(公告)日：2015-09-17
申请号：US14205029
申请日：2014-03-11
申请人： NXP B.V.
发明人： Maristella Spella , Raf Lodewijk Jan Roovers
IPC分类号： H01P5/08 , H01Q1/50 , H01P11/00
CPC分类号： H01P5/08 , G02B6/4201 , H01L23/66 , H01L24/19 , H01L2223/6627 , H01L2223/6655 , H01L2223/6677 , H01L2224/12105 , H01L2224/14 , H01L2224/24137 , H01L2924/1815 , H01P11/00 , H01Q1/2283 , H01Q1/50 , Y10T29/49016 , Y10T29/49018
摘要： One example discloses a transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. Another example discloses a method of manufacture, for a transmission line interconnect, comprising: forming a dielectric molding compound; defining an antenna coupling surface on the dielectric molding compound; and defining a transmission line coupling surface on the dielectric molding compound whereby millimeter wave frequencies received at the antenna coupling surface are electromagnetically coupled to the transmission line coupling surface.
摘要翻译：一个实例公开了一种传输线互连，包括：天线耦合表面; 传输线耦合表面; 以及将天线耦合表面电耦合到传输线耦合表面的电介质模塑复合体。另一个实例公开了一种用于传输线互连的制造方法，包括：形成电介质模塑料; 在所述电介质模塑料上限定天线耦合表面; 并且在电介质模塑料上限定传输线耦合表面，由此在天线耦合表面处接收的毫米波频率电磁耦合到传输线耦合表面。

26. 发明申请

US20150255848A1 DEVICE FOR COUPLING RF POWER INTO A WAVEGUIDE 有权
标题翻译：用于将射频功率耦合到波形中的装置
公开(公告)号：US20150255848A1
公开(公告)日：2015-09-10
申请号：US14430318
申请日：2012-09-26
申请人： Siemens Aktiengesellschaft
发明人： Oliver Heid , Timothy Hughes
IPC分类号： H01P5/00 , H01P3/12 , H01P1/207 , H01P1/212
CPC分类号： H01P5/00 , H01P1/207 , H01P1/212 , H01P3/12 , H01P5/08 , H01P5/082 , H03F3/45183 , H03F2203/45481
摘要： A device for coupling RF power into a waveguide includes a push-pull output stage that includes an input and an output, a filter arrangement that is connected to the output of the push-pull output stage, and an induction loop that is connected to the filter arrangement is provided.
摘要翻译：用于将RF功率耦合到波导中的装置包括推挽输出级，其包括输入和输出，连接到推挽输出级的输出的滤波器装置，以及连接到提供过滤器布置。

27. 发明申请

US20150109068A1 CONNECTION STRUCTURE CONNECTING HIGH FREQUENCY CIRCUIT AND WAVEGUIDE AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：连接结构连接高频电路和波形及其制造方法
公开(公告)号：US20150109068A1
公开(公告)日：2015-04-23
申请号：US14397048
申请日：2013-04-23
申请人： NEC Corporation
发明人： Muneyasu Kawata
IPC分类号： H01P5/107 , H01P11/00
CPC分类号： H01P5/107 , H01P1/042 , H01P5/08 , H01P11/002 , H01P11/003 , Y10T29/49018
摘要： Provided are a new connection structure connecting a high frequency circuit and a waveguide which allows a substrate opening size to be made common without causing deterioration of a transmission line conversion characteristic, and a manufacturing method of the connection structure.The connection structure includes a module substrate (1) on which the high frequency circuit (11) is mounted and a transmission line conversion means (9, 7) is provided between the high frequency circuit and the waveguide (3), a waveguide conductor (8) in which the waveguide is formed, and a mother substrate (2) which is provided on the waveguide conductor and includes an opening having a size larger than an opening size (d) of the waveguide, and the module substrate is fixed to the mother substrate so as to cover the opening of the mother substrate and a choke is formed utilizing a space among the module substrate, the mother substrate, and the waveguide conductor.
摘要翻译：提供连接高频电路和波导的新的连接结构，其允许使基板开口尺寸普通，而不会导致传输线转换特性的劣化，以及连接结构的制造方法。连接结构包括安装有高频电路（11）的模块基板（1），并且在高频电路和波导管（3）之间设置有传输线转换装置（9,7），波导管（ 8），以及设置在波导管上并具有比波导的开口尺寸（d）大的开口部的母体基板（2），将该模块基板固定于母基板以覆盖母基板的开口，并且利用模块基板，母基板和波导导体之间的空间形成扼流圈。

28. 发明授权

US09013891B2 3-D integrated package 有权
标题翻译： 3-D集成包装
公开(公告)号：US09013891B2
公开(公告)日：2015-04-21
申请号：US13417103
申请日：2012-03-09
申请人： Yunpeng Song , Yongsheng Liu , Hongyu Deng
发明人： Yunpeng Song , Yongsheng Liu , Hongyu Deng
IPC分类号： H05K7/00 , H05K1/00 , H05K1/18 , H05K1/14 , H05K1/11 , H01R9/00 , H01P1/04 , H01P3/00 , H01P5/08 , H05K1/02
CPC分类号： H01P5/08 , H01P1/047 , H01P3/003 , H01P3/08 , H05K1/0227 , H05K1/0243 , H05K1/0251 , H05K1/112 , H05K2201/09236
摘要： An electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.
摘要翻译：电子封装包括一个或多个绝缘层和导电传输线。导电传输线包括基本上平行于一个或多个绝缘层设置的信号迹线。导电传输线还包括电耦合到信号迹线的一个或多个信号通孔。一个或多个信号通孔被配置成穿过一个或多个绝缘层的至少一部分。电子封装还包括基本上平行于一个或多个绝缘层的一个或多个导电接地平面。地平面包括一个或多个通过地面切割的信号。通过接地切口的一个或多个信号在一个或多个信号通孔和一个或多个接地平面之间提供间隙。

29. 发明授权

US08912862B2 Impedance matching between a bare-die integrated circuit and a transmission line on a laminated PCB 有权
标题翻译：裸片集成电路与叠层PCB上的传输线之间的阻抗匹配
公开(公告)号：US08912862B2
公开(公告)日：2014-12-16
申请号：US13031291
申请日：2011-02-21
申请人： Yonatan Biran , Elad Dayan , Yigal Leiba , Baruch Schwarz , Amir Shmuel
发明人： Yonatan Biran , Elad Dayan , Yigal Leiba , Baruch Schwarz , Amir Shmuel
IPC分类号： H01P5/08 , H01P5/107 , H01P3/12 , H01P11/00
CPC分类号： H01P5/107 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H01P3/121 , H01P5/08 , H01P11/002 , H01L2924/00014
摘要： A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.
摘要翻译：用于匹配裸片集成电路和接合线的阻抗的系统。裸片集成电路被配置为以三个导电触点的Z3的阻抗输出或输入毫米波信号。印刷在印刷电路板（PCB）的层叠之一上的三个导电焊盘分别通过三个接合线连接到三个导电触点，接合线具有Z1的特性阻抗，其中Z1> Z3。导电焊盘中的一个延伸以形成长度为L的传输线信号迹线，传输线信号迹线具有导致Z2的特性阻抗的第一宽度，其中Z2> Z3。在长度L之后，传输线信号迹线扩大到高于第一宽度的第二宽度，在传输线信号迹线的特征阻抗在长度L和之后将其基本上减小到Z3。

30. 发明申请

US20140285383A1 RECONFIGURABLE WAVEGUIDE INTERFACE ASSEMBLY FOR TRANSMIT AND RECEIVE ORIENTATIONS 有权
标题翻译：用于发送和接收方向的可重构波导接口组件
公开(公告)号：US20140285383A1
公开(公告)日：2014-09-25
申请号：US13870465
申请日：2013-04-25
申请人： Mohammad Fakharzadeh , Mihai Tazlauanu , Bradley R. Lynch , Behzad Biglarbegian
发明人： Mohammad Fakharzadeh , Mihai Tazlauanu , Bradley R. Lynch , Behzad Biglarbegian
IPC分类号： H01Q1/24 , H01P11/00
CPC分类号： H01P5/08 , H01P5/107 , H01P11/00 , H01P11/001 , H01Q13/02 , H01Q21/0075 , Y10T29/49016
摘要： An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.
摘要翻译：天线装置包括下部组件和上部组件，它们一起形成容纳RF电路装置的空腔。上部组件包括在上部组件的外表面处的波导凸缘接口。波导法兰接口包括从外表面延伸到形成空腔表面的内表面的波导通道。在内表面处的波导通道的开口基本上围绕与外表面平行的上部组件的第一中心线居中，并且与上表面的第二中心线平行于外表面偏移，由此第二中心线垂直于第一个中心线上部组件以第一取向或第二取向可拆卸地附接到下部组件，由此第二取向表示上部组件相对于第一取向的180度旋转。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式