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21. 发明申请

US20140162433A1 Methods and Apparatus for Transfer of Films Among Substrates 有权
标题翻译：基片转移方法及装置
公开(公告)号：US20140162433A1
公开(公告)日：2014-06-12
申请号：US14099032
申请日：2013-12-06
申请人： Graphene Frontiers
发明人： Bruce Ira Willner
IPC分类号： H01L21/02 , H01L21/67
CPC分类号： B32B37/24 , B32B38/08 , B32B38/10 , B32B2037/243 , B32B2037/246 , C01B32/184 , C01B32/194 , H01L21/0201 , H01L21/67092 , H01L21/67132
摘要： A method is disclosed which includes: forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in contact with the first substrate thereby defining an interface; attaching a second substrate to a second surface of the at least one layer of material; forming bubbles at the interface; and applying mechanical force; whereby the second substrate and the at least one layer of material are jointly separated from the first substrate. Related arrangements are also described.
摘要翻译：公开了一种方法，其包括：在第一衬底的表面的至少一部分上形成至少一层材料，其中所述至少一层材料的第一表面与所述第一衬底接触，从而限定界面; 将第二衬底附接到所述至少一层材料的第二表面; 在界面处形成气泡; 并施加机械力; 由此所述第二基板和所述至少一个材料层与所述第一基板共同分离。还描述了相关的布置。

22. 发明申请

US20140134439A1 SOLVENT-LESS ADHESIVE BONDING 有权
标题翻译：无溶剂粘合剂
公开(公告)号：US20140134439A1
公开(公告)日：2014-05-15
申请号：US14077957
申请日：2013-11-12
申请人： The Research Foundation for the State University of New York
发明人： Magnus Bergkvist
IPC分类号： C09J7/02
CPC分类号： C09J5/00 , B32B27/08 , B32B37/12 , B32B2037/246 , B32B2309/02 , B32B2309/04 , B32B2309/12 , B32B2310/0831 , B32B2457/14 , C09J2400/226 , Y10T428/30 , Y10T428/31507 , Y10T428/31533 , Y10T428/31667 , Y10T428/31692 , Y10T428/31721 , Y10T428/31797 , Y10T428/31913
摘要： A method for solvent-less adhesive bonding is provided comprising depositing thin, functional, polymeric films on one or more substrates and bonding the substrates to each other or to other substrates. Depositing the polymeric films, including, for example, chemically reactive polymers and thermoplastics with adhesive qualities, may be accomplished using an initiated chemical vapor deposition technique compatible with a variety of monomers, including monomers with chemically functional moieties such as amine and epoxy groups. The technique allows for deposition of polymeric films on a wide variety of substrates/devices and provides an alternative for other coating/deposition methods that are incompatible with certain substrates/devices and/or do not provide adequate control over the resulting polymeric film. The provided method is advantageous in that it is applicable to fabrication of hybrid devices and is compatible with microfabrication technology, including that in clean-room settings.
摘要翻译：提供了一种无溶剂粘合剂的方法，包括在一个或多个基材上沉积薄的，功能性的聚合物膜，并将基材彼此粘合或粘合到其它基材上。可以使用与多种单体相容的起始化学气相沉积技术，包括例如具有化学反应性聚合物和具有粘合剂质量的热塑性塑料来沉积聚合物膜，包括具有化学功能部分如胺和环氧基团的单体。该技术允许将聚合物膜沉积在各种各样的基底/装置上，并提供与某些基底/装置不相容的其它涂覆/沉积方法的替代方案和/或不能对所得聚合物膜提供适当的控制。所提供的方法的优点在于其可应用于混合设备的制造，并且与微细加工技术相兼容，包括在洁净室设置中。

23. 发明授权

US08691367B2 Micro channel structure body and method of manufacturing micro channel structure body 有权
标题翻译：微通道结构体及微通道结构体制造方法
公开(公告)号：US08691367B2
公开(公告)日：2014-04-08
申请号：US12173926
申请日：2008-07-16
申请人： Hiroyuki Goto , Haruo Murayama , Susumu Kimijima , Masahiko Ichishima
发明人： Hiroyuki Goto , Haruo Murayama , Susumu Kimijima , Masahiko Ichishima
IPC分类号： B32B3/20 , B32B3/00 , B32B3/28 , B32B3/30
CPC分类号： B32B38/06 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0887 , B32B38/145 , B32B2037/246 , B32B2309/02 , B32B2309/10 , Y10T156/1064 , Y10T428/24562 , Y10T428/2457 , Y10T428/24744
摘要： A micro channel structure body 10 in which a micro channel 3 having a predetermined cross-sectional shape is formed in a laminate where substrates 1a, 1b, and 1c having formed thereon electrodes 2a, 2b, and 2c made of a thin film are laminated sequentially. The above-mentioned micro channel 3 is formed in a perpendicular direction β perpendicular to a lamination direction α of the above-mentioned laminate. Inner surfaces 3a and 3b of the above-mentioned micro channel 3 have an acute angle θ with respect to the lamination direction α of the above-mentioned laminate. The above-mentioned plurality of electrodes 2a, 2b, and 2c are formed and exposed in the lamination direction α of the inner surfaces 3a and 3b of the above-mentioned micro channel 3.
摘要翻译：在其中形成有具有预定横截面形状的微通道3的微通道结构体10形成在层压体中，其中形成有由薄膜制成的电极2a，2b和2c的基板1a，1b和1c顺序地层叠。上述微通道3沿垂直方向形成，垂直于上述层叠体的层叠方向α。上述微通道3的内表面3a和3b具有锐角和角度; 相对于上述层叠体的层叠方向α。上述多个电极2a，2b和2c以上述微通道3的内表面3a和3b的层叠方向α形成和暴露。

24. 发明授权

US08420181B2 Method of producing microfluidic devices based on a polymer 有权
标题翻译：基于聚合物生产微流体装置的方法
公开(公告)号：US08420181B2
公开(公告)日：2013-04-16
申请号：US13017591
申请日：2011-01-31
申请人： Sang Kyung Kim
发明人： Sang Kyung Kim
IPC分类号： G01N15/06 , G01N33/00 , G01N33/48
CPC分类号： B32B38/06 , B01L3/502707 , B01L2300/0816 , B01L2300/0887 , B01L2300/161 , B32B37/12 , B32B2037/246 , B32B2309/02 , B32B2309/105 , B32B2310/0831 , B32B2535/00 , B82Y30/00
摘要： Disclosed is a method for producing a polymer-based microfluidic device, including: forming a microstructure on a lower polymer matrix; coating the lower polymer matrix with TiO2 to perform patterning of TiO2; bonding the lower polymer matrix with an upper polymer matrix; and radiating UV lights thereto to convert TiO2-coated regions into hydrophilic regions. Disclosed also is a polymer-based microfluidic device obtained by the method. The method enables development of a microfluidic device having high stability and long-term durability.
摘要翻译：公开了一种生产基于聚合物的微流体装置的方法，包括：在低聚合物基质上形成微结构; 用TiO 2涂覆下聚合物基体以进行TiO 2的图案化; 将较低聚合物基体与上部聚合物基体结合; 并向其辐射UV光以将TiO 2涂覆的区域转化为亲水区域。还公开了通过该方法获得的基于聚合物的微流体装置。该方法能够开发具有高稳定性和长期耐久性的微流体装置。

25. 发明授权

US08394507B2 Metal-clad polymer article 有权
标题翻译：金属包覆聚合物制品
公开(公告)号：US08394507B2
公开(公告)日：2013-03-12
申请号：US12476455
申请日：2009-06-02
申请人： Klaus Tomantschger , Jonathan McCrea , Nandakumar Nagarajan , Francisco Gonzalez , Gino Palumbo , Konstantinos Panagiotopoulos , Herath Katugaha
发明人： Klaus Tomantschger , Jonathan McCrea , Nandakumar Nagarajan , Francisco Gonzalez , Gino Palumbo , Konstantinos Panagiotopoulos , Herath Katugaha
IPC分类号： B32B15/04 , B32B15/08 , B32B37/00 , C23C30/00 , C25D5/56 , C25D3/12
CPC分类号： B32B7/04 , B32B1/08 , B32B7/12 , B32B15/043 , B32B15/08 , B32B37/1284 , B32B2037/246 , B32B2307/202 , B32B2311/00 , C08J7/123 , C23C18/1641 , C23C18/165 , C25D7/00 , Y10T156/10 , Y10T428/12028 , Y10T428/12049 , Y10T428/12389 , Y10T428/12451 , Y10T428/12472 , Y10T428/12569 , Y10T428/12632 , Y10T428/12896 , Y10T428/12944 , Y10T428/131 , Y10T428/1352 , Y10T428/1355 , Y10T428/1359 , Y10T428/24545 , Y10T428/24612 , Y10T428/2495 , Y10T428/26 , Y10T428/263 , Y10T428/269 , Y10T428/31678
摘要： Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
摘要翻译：公开了包含分散在其中的任选地含有固体颗粒的结构细晶粒和/或非晶金属涂层/层的金属包层聚合物制品。细晶粒和/或非晶金属涂层特别适用于强而轻的制品，精密模具，运动用品，暴露于热循环的汽车部件和部件，尽管金属层的CLTE和基板之一不匹配。金属层和聚合物之间的界面适当地经过预处理以承受热循环而不失败。

26. 发明申请

US20120288698A1 METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION 审中-公开
标题翻译：金属基材制造方法，装置结构和包含金刚石的基材用于热释放
公开(公告)号：US20120288698A1
公开(公告)日：2012-11-15
申请号：US13424180
申请日：2012-03-19
申请人： Nicolaie A. MOLDOVAN , John Arthur Carlisle , Hongjun Zeng
发明人： Nicolaie A. MOLDOVAN , John Arthur Carlisle , Hongjun Zeng
IPC分类号： H01L23/373 , H01L21/50 , B32B33/00 , C25D1/00 , B32B7/12 , B32B9/04
CPC分类号： C09K5/14 , B32B37/26 , B32B2037/246 , B32B2037/268 , B32B2309/105 , B32B2311/00 , B32B2313/04 , C01B32/28 , C23C16/01 , C23C16/0281 , C23C16/042 , C23C16/27 , C25D1/00 , C25D1/04 , C25D1/08 , C25D3/38 , C25D3/46 , C25D3/58 , C25D3/64 , C25D5/10 , C25D5/48 , H01L21/4878 , H01L21/4882 , H01L23/142 , H01L23/3732 , H01L24/81 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/12042 , H01L2924/15747 , Y10T428/24355 , Y10T428/24942 , Y10T428/24975 , Y10T428/31678 , H01L2924/00
摘要： A method of fabrication, a device structure and a submount comprising high thermal conductivity (HTC) diamond on a HTC metal substrate, for thermal dissipation, are disclosed. The surface roughness of the diamond layer is controlled by depositing diamond on a sacrificial substrate, such as a polished silicon wafer, having a specific surface roughness. Following deposition of the diamond layer, an adhesion layer, e.g. comprising a refractory metal, such as tantalum, and at least one layer of HTC metal is provided. The HTC metal substrate is preferably copper or silver, and may be provided by electroforming metal onto a thin sputtered base layer, and optionally bonding another metal layer. The electrically non-conductive diamond layer has a smooth exposed surface, preferably ≦10 nm RMS, suitable for patterning of contact metallization and/or bonding to a semiconductor device. Methods are also disclosed for patterning the diamond on metal substrate to facilitate dicing.
摘要翻译：公开了一种在HTC金属基底上包含高导热性（HTC）金刚石的制造方法，器件结构和底座，用于散热。金刚石层的表面粗糙度通过在具有特定表面粗糙度的牺牲衬底（例如抛光硅晶片）上沉积金刚石来控制。在金刚石层沉积之后，粘附层例如包括诸如钽的难熔金属，并且提供至少一层HTC金属。 HTC金属基底优选为铜或银，并且可以通过电铸金属提供到薄的溅射基底层上，并且可选地粘合另一金属层。非导电金刚石层具有平滑的暴露表面，优选地为10nm RMS，适于图案化与半导体器件的接触金属化和/或结合。还公开了用于在金属基底上图案化金刚石以便于切割的方法。

27. 发明申请

US20120219810A1 REFLECTIVE BARRIER 审中-公开
标题翻译：反射障碍
公开(公告)号：US20120219810A1
公开(公告)日：2012-08-30
申请号：US13405937
申请日：2012-02-27
申请人： Brian T. Wickhorst
发明人： Brian T. Wickhorst
IPC分类号： B32B15/08 , B32B37/10 , B32B37/12 , B32B37/06 , B32B37/14 , B32B37/02
CPC分类号： B32B33/00 , B32B7/12 , B32B27/08 , B32B27/36 , B32B37/12 , B32B2037/243 , B32B2037/246 , B32B2038/0092 , B32B2255/10 , B32B2255/205 , B32B2307/416 , B32B2311/24 , B32B2327/06 , B32B2367/00 , Y10T156/10 , Y10T428/31692
摘要： Disclosed herein is a flexible composite laminate barrier for placement near the interior of a window to control the passage of heat therethrough. The barrier comprises a first exterior-directed layer, an intermediate layer, and a third interior-directed layer. The first layer comprises a sheet having an exterior-directed surface and an interior-directed surface, and a coating disposed on the exterior-directed surface of the sheet. The intermediate layer comprises a sheet having an exterior-directed surface and an interior-directed surface, and an aluminum layer adhered to the exterior-directed surface of the intermediate layer. The third layer comprises a sheet of similar or same material as that of the first sheet. An adhesive is disposed between both the adjacent layers and the layers are calendered together to form the composite laminate barrier.
摘要翻译：本文公开了一种用于放置在窗户内部附近以控制热通过其中的柔性复合层压板。屏障包括第一外部定向层，中间层和第三内部定向层。第一层包括具有外部指向表面和内部指向表面的片材，以及设置在片材的外部指向表面上的涂层。中间层包括具有外部指向表面和内部指向表面的片材，以及粘附到中间层的外部指示表面的铝层。第三层包括与第一片相似或相同材料的片材。粘合剂设置在两个相邻层之间，并且层压在一起以形成复合层压板屏障。

28. 发明授权

US08112922B2 Reflective material for signage, buildings and vehicles 失效
标题翻译：标牌，建筑物和车辆的反光材料
公开(公告)号：US08112922B2
公开(公告)日：2012-02-14
申请号：US12256686
申请日：2008-10-23
申请人： Stanley Keil
发明人： Stanley Keil
IPC分类号： G09F19/00
CPC分类号： B32B38/06 , B32B38/10 , B32B2037/246 , B32B2038/0092 , B32B2307/416 , G02B5/136 , G09F13/16 , Y10T156/1031
摘要： A reflective sheet material for use on exterior signs and exposed surfaces includes a sheet member having a series of adjacent, parallel primary grooves extending across at least one surface. Each group is defined by first and second elongate facets forming an angle of at least 90 degrees in a plane perpendicular to the surface and to the length of the facets. A thin opaque, reflective layer extends over the surface in the region of the grooves and conforms to the series of grooves so as to form a series of associated angular grooves. A transparent material extends over and substantially fills these angular grooves, thereby forming a substantially smooth outer surface which is located at or close to the top edges of the grooves. The sheet material can be flexible or rigid.
摘要翻译：用于外部标志和暴露表面的反射片材包括具有延伸穿过至少一个表面延伸的一系列相邻的平行主槽的片状构件。每个组由在垂直于表面的平面和小平面的长度上形成至少90度的角度的第一和第二细长小面限定。薄的不透明的反射层在凹槽的区域中在表面上延伸并且与一系列的凹槽相配合，以便形成一系列相关联的角槽。透明材料延伸并基本上填充这些角槽，从而形成位于或接近槽的顶部边缘的基本上光滑的外表面。片材可以是柔性的或刚性的。

29. 发明申请

US20110299166A1 Thermally Tunable Optical Filter with Single Crystalline Spacer Fabricated by Fusion Bonding 审中-公开
标题翻译：通过熔融粘合制造的单晶间隔器的热可调光学滤波器
公开(公告)号：US20110299166A1
公开(公告)日：2011-12-08
申请号：US13154262
申请日：2011-06-06
申请人： Rong Sun
发明人： Rong Sun
IPC分类号： G02B26/00 , B32B37/00
CPC分类号： B32B37/02 , B32B2037/246 , B32B2551/00 , G02B5/28 , G02B26/001
摘要： A thermally tunable Fabry-Perot optical filter includes a single crystalline sheet resistance heater layer. A single crystalline semiconductor spacer layer is positioned proximate to and in thermal communication with the single crystalline sheet resistance heater layer. A first distributed Bragg reflector is positioned proximate to a first surface of the single crystalline semiconductor spacer layer. A second distributed Bragg reflector is positioned proximate to a second surface of the single crystalline semiconductor spacer layer.
摘要翻译：热可调法布里 - 珀罗滤光器包括单晶片电阻加热器层。单晶半导体间隔层位于与单晶片电阻加热器层接近并且与其结合的位置。第一分布布拉格反射器位于单晶半导体间隔层的第一表面附近。第二分布布拉格反射器位于单晶半导体间隔层的第二表面附近。

30. 发明授权

US07967185B2 Method of forming bonded body and bonded body 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US07967185B2
公开(公告)日：2011-06-28
申请号：US12358531
申请日：2009-01-23
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B23K31/02
CPC分类号： B32B37/12 , B32B37/24 , B32B2037/1223 , B32B2037/246 , B32B2309/02 , B32B2309/04 , B32B2309/105 , B32B2309/12 , B32B2457/00 , Y10T428/12882
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜主要由铜构成。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

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