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    • 21. 发明授权
    • Split laser scribe
    • 分割激光刻章
    • US08519298B2
    • 2013-08-27
    • US12731798
    • 2010-03-25
    • Jianmin WangCraig MetznerGregory W. Schuh
    • Jianmin WangCraig MetznerGregory W. Schuh
    • B23K26/00B23K26/14B23K26/02
    • B23K26/0676B23K26/40B23K2101/40B23K2103/50G02B27/283
    • A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.
    • 双光束激光切割系统使用激光束偏振来输出两个相同的激光束。 与单激光切割系统相比,双重相同的激光束被适当地间隔开以同时切割水,从而增加激光切割系统的吞吐量。 在一个实施方案中,双光束激光切割系统100利用光束扩展器220,两个半波片224,238,偏振分束器228,反射镜236和两个透镜234,242来提供两个相同的激光束202 ,204来自单个激光源214.相同的激光束202,204被调谐为具有相同的功率,横截面直径和偏振方向。 半波片224中的一个旋转以产生具有相同功率的激光束。 旋转另一个半波片238以产生具有相同偏振方向的激光束。
    • 26. 发明申请
    • ENHANCED WAFER CARRIER
    • 增强型拖车
    • US20120040097A1
    • 2012-02-16
    • US12855739
    • 2010-08-13
    • Boris VolfYuliy Rashkovsky
    • Boris VolfYuliy Rashkovsky
    • C23C16/458C23C16/00
    • H01L21/68764C23C16/4586H01L21/68728H01L21/68771
    • A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with locks for restraining wafers against upward movement away from the support surfaces. Constraining the wafers against upward movement limits the effect of wafer distortion on the spacing between the wafer and the floor surfaces, and thus limits the effects of wafer distortion on heat transfer. The carrier may include a main portion and minor portions having higher thermal conductivity than the main portion, the minor portions being disposed below the pockets.
    • 用于晶片处理(例如化学气相沉积)中的晶片载体具有用于保持晶片和支撑表面的口袋,以支撑位于口袋的地板上方的晶片。 载体设有用于限制晶片的锁,以防止远离支撑表面的向上移动。 限制晶片对向上移动限制晶片失真对晶片和地板表面之间的间隔的影响,从而限制晶片失真对热传递的影响。 载体可以包括主要部分和具有比主要部分更高的热导率的次要部分,次要部分设置在口袋下方。
    • 29. 发明申请
    • SPLIT LASER SCRIBE
    • 分体激光扫描
    • US20110233176A1
    • 2011-09-29
    • US12731798
    • 2010-03-25
    • Jianmin WangCraig MetznerGregory W. Schuh
    • Jianmin WangCraig MetznerGregory W. Schuh
    • B23K26/00G02B5/30G02B27/28
    • B23K26/0676B23K26/40B23K2101/40B23K2103/50G02B27/283
    • A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.
    • 双光束激光切割系统使用激光束偏振来输出两个相同的激光束。 与单激光切割系统相比,双重相同的激光束被适当地间隔开以同时切割水,从而增加激光切割系统的吞吐量。 在一个实施方案中,双光束激光切割系统100利用光束扩展器220,两个半波片224,238,偏振分束器228,反射镜236和两个透镜234,242来提供两个相同的激光束202 ,204来自单个激光源214.相同的激光束202,204被调谐为具有相同的功率,横截面直径和偏振方向。 半波片224中的一个旋转以产生具有相同功率的激光束。 旋转另一个半波片238以产生具有相同偏振方向的激光束。
    • 30. 发明授权
    • Real-time scanner-nonlinearity error correction for HDVSI
    • HDVSI的实时扫描仪 - 非线性误差校正
    • US07898672B1
    • 2011-03-01
    • US12082846
    • 2008-04-15
    • Dong Chen
    • Dong Chen
    • G01B11/02
    • G01B9/02079G01B9/02071G01B9/02083G01B9/0209G01B11/2441
    • An error correction for scanner position is implemented by adjusting the filter parameters of the quadrature demodulation module of an HDVSI algorithm using a reference signal from an independent position measurement device (PMD). The step size generated by the PMD at each scanner step is substituted for the nominal scanner step in the quadrature demodulation algorithm calculating phase and in the coherent envelope algorithm calculating peak. This substitution eliminates all errors produced by scanner nonlinearities. Furthermore, over the large number of steps carried out during a normal scanning range, random scanner-position errors (such as produced by vibration and other system noise) are automatically corrected by integration over their normal distribution around the noise-free position value. Therefore, a complete correction of scanner-position error may be achieved using the reference signal.
    • 通过使用来自独立位置测量装置(PMD)的参考信号调整HDVSI算法的正交解调模块的滤波器参数来实现扫描器位置的纠错。 由PMD在每个扫描步骤产生的步长代替正交解调算法计算阶段中的标称扫描步长,以及相干包络算法计算峰值。 此替代消除了扫描仪非线性产生的所有错误。 此外,在正常扫描范围内执行的大量步骤中,通过在其无噪声位置值周围的正态分布上的积分自动校正随机扫描仪位置误差(例如由振动和其他系统噪声产生的)误差。 因此,可以使用参考信号来实现扫描仪位置误差的完全校正。