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    • 23. 发明申请
    • Semiconductor memory device having a three-dimensional cell array structure
    • 具有三维单元阵列结构的半导体存储器件
    • US20080112209A1
    • 2008-05-15
    • US11755329
    • 2007-05-30
    • Woo-Yeong ChoSang-Beom KangDu-Eung Kim
    • Woo-Yeong ChoSang-Beom KangDu-Eung Kim
    • G11C11/00
    • G11C13/0023G11C11/1655G11C11/1657G11C13/0004G11C2213/71G11C2213/72
    • A semiconductor memory device includes a plurality of cell array layers including a plurality of word lines extending in a first direction, a plurality of bit lines extending in a second direction that intersects the first direction, and a plurality of memory cells disposed at intersections of the word lines and the bit lines. Each of the word lines has a word line position, each of the bit lines has a bit line position, and each of the memory cells includes a variable resistance device in series with a diode. The cell array layers are arranged in layers in a third direction that is perpendicular to the first and second directions. The bit lines of each of the cell array layers having a same bit line position are connected to a common column selector transistor, or the word lines of the cell array layers having a same word line position are connected to a common word line driver.
    • 半导体存储器件包括多个单元阵列层,包括沿第一方向延伸的多个字线,沿与第一方向相交的第二方向延伸的多个位线,以及设置在第一方向的交点处的多个存储单元 字线和位线。 每个字线具有字线位置,每个位线具有位线位置,并且每个存储单元包括与二极管串联的可变电阻器件。 单元阵列层在垂直于第一和第二方向的第三方向上排列成层。 具有相同位线位置的每个单元阵列层的位线连接到公共列选择晶体管,或者具有相同字线位置的单元阵列层的字线连接到公共字线驱动器。
    • 28. 发明授权
    • Resistance semiconductor memory device having three-dimensional stack and word line decoding method thereof
    • 具有三维堆叠和字线解码方法的电阻半导体存储器件
    • US07907467B2
    • 2011-03-15
    • US12873836
    • 2010-09-01
    • Joon-Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • Joon-Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • G11C8/00
    • G11C8/08G11C8/14G11C11/16G11C13/00G11C13/0004G11C13/0023G11C13/0028G11C2213/71G11C2213/72
    • A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.
    • 提供三维堆栈结构的电阻半导体存储器件及其字线解码方法。 在三维堆叠结构的电阻半导体存储器件中,其中多个字线层和多个位线层交替和垂直地布置,并且其中多个存储单元层设置在字线 层和位线层; 电阻半导体存储器件包括沿着第一方向设置在每个位线层上的多个位线作为长度方向; 在与第一方向相交的长度方向的第二方向上设置在每个字线层上的多个子字线; 设置在所述存储单元层上的多个存储单元; 以及多个主字线分别设置在主字线层上,特别适用于位线层和字线层,在第二方向上作为长度方向,多个主字线中的每一条由 预定数量的子字线。 可以实现足够高集成度的有效的字线解码。
    • 29. 发明申请
    • Resistance Semiconductor Memory Device Having Three-Dimensional Stack and Word Line Decoding Method Thereof
    • 具有三维堆栈和字线解码方法的电阻半导体存储器件
    • US20100329070A1
    • 2010-12-30
    • US12873836
    • 2010-09-01
    • Joon Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • Joon Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • G11C8/10
    • G11C8/08G11C8/14G11C11/16G11C13/00G11C13/0004G11C13/0023G11C13/0028G11C2213/71G11C2213/72
    • A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.
    • 提供三维堆栈结构的电阻半导体存储器件及其字线解码方法。 在三维堆叠结构的电阻半导体存储器件中,其中多个字线层和多个位线层交替和垂直地布置,并且其中多个存储单元层设置在字线 层和位线层; 电阻半导体存储器件包括沿着第一方向设置在每个位线层上的多个位线作为长度方向; 在与第一方向相交的长度方向的第二方向上配置在每个字线层上的多个子字线; 设置在所述存储单元层上的多个存储单元; 以及多个主字线分别设置在主字线层上,特别适用于位线层和字线层,在第二方向上作为长度方向,多个主字线中的每一条由 预定数量的子字线。 可以实现足够高集成度的有效的字线解码。