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    • 25. 发明申请
    • Pressure Sensor
    • 压力传感器
    • US20080245154A1
    • 2008-10-09
    • US11630015
    • 2005-06-13
    • Masashi SekineHidefumi Harada
    • Masashi SekineHidefumi Harada
    • G01L9/12
    • G01L9/0073
    • There is provided a pressure sensor having: a sensor chip (30) which detects a pressure; a base plate (20 (21, 22)) which supports the sensor chip (30); and a support diaphragm (50) which is bonded to the base plate (20 (21, 22)) and supports the base plate (20 (21, 22)), wherein the pressure sensor (1) has a structure in which the support diaphragm (50) is joined to a package (10), and the sensor chip (30) and the base plate (20 (21, 22)) are supported in the package through the support diaphragm (50) alone, thereby constantly and accurately detecting a pressure without being affected by a heat stress caused due to heat from the outside.
    • 提供了一种压力传感器,其具有:检测压力的传感器芯片(30); 支撑所述传感器芯片(30)的基板(20(21,22))。 以及支撑隔膜(50),其接合到所述基板(20(21,22))并支撑所述基板(20,22,22)),其中,所述压力传感器(1)具有这样的结构, 膜片(50)与包装体(10)接合,传感器芯片(30)和基板(20,22,21)通过支撑膜片(50)单独地支撑在包装体中,从而不断地和准确地 检测压力而不受由于来自外部的热量引起的热应力的影响。
    • 27. 发明授权
    • Resin composition
    • 树脂组成
    • US5543474A
    • 1996-08-06
    • US318833
    • 1994-10-17
    • Takao KawakiAkikazu AmagaiToshiaki YamadaHidefumi HaradaHajime BanYuji TakedaKoji Yamamoto
    • Takao KawakiAkikazu AmagaiToshiaki YamadaHidefumi HaradaHajime BanYuji TakedaKoji Yamamoto
    • C08L67/02C08L79/08C08L81/02C08L59/02
    • C08L67/02C08L79/08C08L81/02
    • There is provided a resin composition having well balanced moldability, heat resistance and mechanical strength, which comprises (A) all aromatic polyamideimide resin and (B) a Polyester resin, (C) a polyphenylene sulfide resin or (D) a resin capable of forming an anisotropic molten phase, said aromatic polyamideimide resin containing 5 to 95 mol % of a recurring unit of the formula (1) and 5 to 95 mol % of at least one of a recurring unit of the formula (2) and a recurring unit of the formula (3). Said aromatic polyamideimide resin is prepared by conducting a polymerization reaction of an aromatic tricarboxylic acid anhydride and at least any one of all aromatic dicarboxylic acid and an aliphatic dicarboxylic acid with a diisocyanate compound in plural steps in which in the first step the polymerization reaction is conducted in a temperature range of 50.degree. to 110.degree. C. and in the second and subsequent steps the polymerization reaction is conducted in a temperature range of higher than 110.degree. C. but not higher than 200.degree. C. ##STR1## wherein Ar denotes a trivalent aromatic group, Ar.sub.1 denotes a divalent aromatic group, R.sub.1 denotes a divalent aliphatic group, and R denotes a divalent aromatic or aliphatic group.
    • PCT No.PCT / JP94 / 00232 Sec。 371日期:1994年10月17日 102(e)日期1994年10月17日PCT 1994年2月16日PCT PCT。 出版物WO94 / 19410 日本1994年9月1日提供了具有良好平衡的成型性,耐热性和机械强度的树脂组合物,其包含(A)全芳香族聚酰胺酰亚胺树脂和(B)聚酯树脂,(C)聚苯硫醚树脂或(D) 能够形成各向异性熔融相的树脂,所述芳香族聚酰胺酰亚胺树脂含有5〜95摩尔%的式(1)的重复单元和5〜95摩尔%的式(2)的重复单元中的至少一种, 和式(3)的重复单元。 所述芳香族聚酰胺酰亚胺树脂通过芳族三羧酸酐和至少任意一种芳族二羧酸和脂族二羧酸与二异氰酸酯化合物进行多步反应来制备,其中在第一步中进行聚合反应 在50〜110℃的温度范围内,在第二和随后的步骤中,聚合反应在高于110℃但不高于200℃的温度范围内进行。 (3)其中Ar表示三价芳族基团,Ar 1表示二价芳族基团,R 1表示二价脂肪族基团,R表示二价芳香族或脂肪族基团。