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21. 发明授权

US06687633B2 Inspection system, inspection apparatus, inspection program, and production method of semiconductor devices 失效
标题翻译：检测系统，检验仪器，检验程序和半导体器件的生产方法
公开(公告)号：US06687633B2
公开(公告)日：2004-02-03
申请号：US10079518
申请日：2002-02-22
申请人： Makoto Ono , Hisafumi Iwata
发明人： Makoto Ono , Hisafumi Iwata
IPC分类号： G01N3700
CPC分类号： H01L21/67288
摘要： In the wafer production process of a semiconductor integrated circuit, an inspection system and an inspection apparatus that convert and output a yield loss at high accuracy from the result of a defect inspection, such as a dark-field inspection and a bright-field inspection without waiting for the result of the final probing test. Defect map data read processing and kill ratio computation data read processing are performed. Subsequently, kill ratio computation processing every defect computes a kill ratio every defect using defect map data and kill ratio computation data. Subsequently, kill ratio computation processing every chip computes a kill ratio every LSI chip using the kill ratio every defect. Subsequently, yield loss computation processing computes a yield loss of the defect map data using the kill ratio every chip and yield loss output processing outputs the computation result.
摘要翻译：在半导体集成电路的晶片生产过程中，检查系统和检查装置从缺陷检查的结果（例如暗场检查和明场检查）转换并输出高精度的屈服损失而没有等待最终探测测试的结果。执行缺陷地图数据读取处理和杀死比计算数据读取处理。随后，每个缺陷的杀伤比计算处理使用缺陷图数据和杀死比计算数据计算每个缺陷的杀伤比。随后，每个芯片的杀死率计算处理使用每个缺陷的杀死率来计算每个LSI芯片的杀死率。随后，屈服损失计算处理使用每个芯片的杀死率来计算缺陷图数据的屈服损失，并且屈服损失输出处理输出计算结果。

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