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    • 21. 发明授权
    • Encapsulation method for packaging semiconductor components with external leads
    • 用外部引线封装半导体元件的封装方法
    • US07943424B1
    • 2011-05-17
    • US12592597
    • 2009-11-30
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • H01L21/56
    • H01L21/561H01L21/4842H01L23/3107H01L24/97H01L2924/01033H01L2924/01079H01L2924/01082H01L2924/014
    • This invention discloses a method for packaging a semiconductor device with leads extending outside its encapsulation. The method comprises the following steps: Step 1, providing a lead frame comprising a plurality of lead frame units arranged in two dimensional array, each lead frame unit comprising a die pad and a plurality of leads located along two opposite sides of the die pad, attaching a semiconductor chip onto the die pad and electrically connecting the electrodes on each chip to its corresponding leads; Step 2, Encapsulating the chips, the die pads, and the leads with molding material into a plurality of one dimensional plastic encapsulation bars with the leads of each lead frame unit extending out along two opposite sides of the plastic encapsulation bars connecting to a plurality of tie bars substantially parallel to the plastic encapsulation bars; Step 3, Trimming off the tie bars therefore cutting off the connections between the leads to the tie bars while preserving a portion of the leads extending out of the plastic encapsulation bars; and Step 4, Sawing through the plastic encapsulation bars to form a plurality of individual semiconductor components with leads extending outside its encapsulation.
    • 本发明公开了一种用于封装半导体器件的方法,该半导体器件具有在其封装之外延伸的引线。 该方法包括以下步骤:步骤1,提供包括以二维阵列排列的多个引线框单元的引线框架,每个引线框架单元包括管芯焊盘和位于管芯焊盘的两个相对侧的多个引线, 将半导体芯片附接到芯片焊盘上并将每个芯片上的电极电连接到其对应的引线; 步骤2,通过模塑材料将芯片,芯片焊盘和引线封装成多个一维塑料封装棒,每个引线框架单元的引线沿塑料封装条的两个相对侧延伸,连接到多个 连接条基本上平行于塑料封装条; 步骤3,修剪连接杆,从而切断导线到连接杆之间的连接,同时保留从塑料封装棒伸出的一部分引线; 和步骤4,通过塑料封装条锯切以形成多个单独的半导体部件,其引线延伸到其封装外部。
    • 22. 发明申请
    • ENCAPSULATION METHOD FOR PACKAGING SEMICONDUCTOR COMPONENTS WITH EXTERNAL LEADS
    • 用于封装具有外部引线的半导体元件的封装方法
    • US20110129962A1
    • 2011-06-02
    • US12592597
    • 2009-11-30
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • H01L21/78
    • H01L21/561H01L21/4842H01L23/3107H01L24/97H01L2924/01033H01L2924/01079H01L2924/01082H01L2924/014
    • This invention discloses a method for packaging a semiconductor device with leads extending outside its encapsulation. The method comprises the following steps: Step 1, providing a lead frame comprising a plurality of lead frame units arranged in two dimensional array, each lead frame unit comprising a die pad and a plurality of leads located along two opposite sides of the die pad, attaching a semiconductor chip onto the die pad and electrically connecting the electrodes on each chip to its corresponding leads; Step 2, Encapsulating the chips, the die pads, and the leads with molding material into a plurality of one dimensional plastic encapsulation bars with the leads of each lead frame unit extending out along two opposite sides of the plastic encapsulation bars connecting to a plurality of tie bars substantially parallel to the plastic encapsulation bars; Step 3, Trimming off the tie bars therefore cutting off the connections between the leads to the tie bars while preserving a portion of the leads extending out of the plastic encapsulation bars; and Step 4, Sawing through the plastic encapsulation bars to form a plurality of individual semiconductor components with leads extending outside its encapsulation.
    • 本发明公开了一种用于封装半导体器件的方法,该半导体器件具有在其封装之外延伸的引线。 该方法包括以下步骤:步骤1,提供包括以二维阵列排列的多个引线框单元的引线框架,每个引线框架单元包括管芯焊盘和位于管芯焊盘的两个相对侧的多个引线, 将半导体芯片附接到芯片焊盘上并将每个芯片上的电极电连接到其对应的引线; 步骤2,通过模塑材料将芯片,芯片焊盘和引线封装成多个一维塑料封装棒,每个引线框架单元的引线沿塑料封装条的两个相对侧延伸,连接到多个 连接条基本上平行于塑料封装条; 步骤3,修剪连接杆,从而切断导线到连接杆之间的连接,同时保留从塑料封装棒伸出的一部分引线; 和步骤4,通过塑料封装条锯切以形成多个单独的半导体部件,其引线延伸到其封装外部。
    • 24. 发明授权
    • Flow tank
    • 流水箱
    • US09205466B2
    • 2015-12-08
    • US13989034
    • 2011-11-23
    • Liang Zhao
    • Liang Zhao
    • B08B3/06B08B3/04H05K3/26
    • B08B3/06B08B3/048H05K3/26
    • A cleaning system comprising a tank having a wash area arranged to receive an article for cleaning; an inlet assembly mounted to a first end of the tank, through which a cleaning medium flows into the wash area; an outlet assembly having a flow control plate mounted to a second end of the tank; the flow control plate having a plurality of apertures and arranged such that the cleaning medium flows from the wash area through the apertures; the flow control plate arranged such that a total outlet area of the tank is equal to a sum of areas of the apertures; wherein the proportion of the total outlet area about the flow control plate is inversely proportional to a depth of the tank.
    • 一种清洁系统,包括具有布置成接收用于清洁的物品的洗涤区域的罐; 入口组件,其安装到所述罐的第一端,清洁介质通过所述入口组件流入所述洗涤区域; 出口组件,其具有安装到所述罐的第二端的流量控制板; 所述流量控制板具有多个孔,并且被布置成使得所述清洁介质从所述洗涤区域流过所述孔; 所述流量控制板被布置成使得所述罐的总出口面积等于所述孔的面积的总和; 其中围绕流动控制板的总出口面积的比例与罐的深度成反比。
    • 26. 发明申请
    • Porous Medium Screen
    • 多孔中等屏幕
    • US20140034570A1
    • 2014-02-06
    • US13994030
    • 2012-05-29
    • Jean-Marc LopezLiang ZhaoLuke William Holderman
    • Jean-Marc LopezLiang ZhaoLuke William Holderman
    • B01D35/28
    • B01D35/28E21B41/00E21B43/082
    • Certain aspects and embodiments of the present invention are directed to a porous medium screen that can be disposed in a wellbore through a fluid-producing formation. The porous medium screen can include a porous medium and a retaining structure. The porous medium can be a material having one or more pores. The one or more pores can be adapted to allow a fluid to flow through the porous medium and to prevent one or more particles from flowing through the porous medium. The retaining structure can be adapted to retain the porous medium in a position circumferentially surrounding a section of a tubing string and to prevent expansion of the porous medium. The retaining structure can include a shroud and one or more stoppers. The shroud can be adapted to circumferentially surround the porous medium. Each stopper can be adapted to circumferentially surround the section of a tubing string at an edge of the porous medium.
    • 本发明的某些方面和实施例涉及可通过流体产生层布置在井筒中的多孔介质筛网。 多孔介质筛网可以包括多孔介质和保持结构。 多孔介质可以是具有一个或多个孔的材料。 一个或多个孔可以适于允许流体流过多孔介质并防止一个或多个颗粒流过多孔介质。 保持结构可以适于将多孔介质保持在周向围绕管柱的一部分的位置并且防止多孔介质的膨胀。 保持结构可以包括护罩和一个或多个止动件。 护罩可以适于周向地围绕多孔介质。 每个止动器可以适于在多孔介质的边缘周向地围绕管柱的部分。
    • 29. 发明授权
    • Wireless and passive tablet for inputting to computer
    • 无线和被动平板电脑输入到电脑
    • US07623120B2
    • 2009-11-24
    • US10506467
    • 2003-04-18
    • Yingjian LiuHonggang WangLiang Zhao
    • Yingjian LiuHonggang WangLiang Zhao
    • G06F3/045
    • G06F3/046
    • This invention refers to peripheral equipment of a computer and is a wireless and passive tablet for inputting to the computer that converts the track of handwriting to digital X, Y coordinates and then inputs it to the computer and then displays the track on screen of the computer. The characteristic of the wireless and passive tablet is using the coil of X, Y direction in transmitting and receiving. A square wave is generated and input to a transmitting circuit. A transmitted electromagnetic wave is inputted to a circuit of a pen to form resonance that will be outputted to a receiving circuit. The receiving circuit connects to an amplifying circuit to amplify the signal and input the amplified signal into a phase angle detecting circuit and an amplitude detecting circuit respectively to control the phase angle and amplitude. And then the signal is inputted to a primary CPU to realize the writing function of the wireless pen.
    • 本发明涉及一种计算机的外围设备,是一种无线和无源平板电脑,用于向计算机输入将手写轨迹转换为数字X,Y坐标,然后将其输入到计算机,然后在计算机屏幕上显示轨迹 。 无线和无源平板电脑的特点是使用X,Y方向的线圈进行发送和接收。 生成方波并将其输入到发送电路。 传输的电磁波被输入到笔的电路,以形成将被输出到接收电路的谐振。 接收电路连接到放大电路以放大信号并分别将放大的信号输入相位角检测电路和振幅检测电路以控制相位角和振幅。 然后将信号输入到主CPU,以实现无线笔的写入功能。