专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07066633B2 Illuminated displays for alphanumeric and special characters 有权
标题翻译：照明显示字母数字和特殊字符
公开(公告)号：US07066633B2
公开(公告)日：2006-06-27
申请号：US10820342
申请日：2004-04-07
申请人： Kee Yean Ng , Heng Yow Cheng , Chee Wai Chia
发明人： Kee Yean Ng , Heng Yow Cheng , Chee Wai Chia
IPC分类号： F21V5/00
CPC分类号： G09F13/22 , G09F13/0404 , Y10S362/812
摘要： An illuminated display is disclosed which allows characters to be displayed with near type-set like appearance. This is accomplished by using an appropriately formed and placed rib to connect the optically opaque inner member with the optically opaque base.
摘要翻译：公开了一种照明显示器，其允许以类似外观的近似类型显示字符。这通过使用适当地形成和放置的肋来将光学不透明的内部构件与光学不透明的基底连接来实现。

22. 发明授权

US06921927B2 System and method for enhanced LED thermal conductivity 有权
标题翻译：增强LED导热系数和方法
公开(公告)号：US06921927B2
公开(公告)日：2005-07-26
申请号：US10650892
申请日：2003-08-28
申请人： Kee Yean Ng , Sundar A. L. N. Yoganandan
发明人： Kee Yean Ng , Sundar A. L. N. Yoganandan
IPC分类号： H01L23/36 , H01L27/15 , H01L33/56 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/647 , H01L24/73 , H01L33/56 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.
摘要翻译：发光器件组件包括发光二极管（LED）芯片，具有两个端子的衬底，至少一个封装层和用于连接LED芯片和衬底的导热粘合剂。衬底的第一端子包括宽度至少与LED芯片一样宽的部分，并且垂直截面积为封装组件的总垂直横截面面积的至少30％，并且直线元件。扩大的第一端子部分提供更多的用于散热和传导的面积，并且与导热粘合剂和封装封装一起提供增强的导热性。

23. 发明授权

US06879040B2 Surface mountable electronic device 有权
标题翻译：可表面安装的电子设备
公开(公告)号：US06879040B2
公开(公告)日：2005-04-12
申请号：US10649005
申请日：2003-08-26
申请人： Kee Yean Ng , Gurbir Singh
发明人： Kee Yean Ng , Gurbir Singh
IPC分类号： H01C1/14 , H01L23/31 , H01L23/495 , H01L23/498 , H01L33/48 , H01L33/62 , H05K3/34 , H01L23/04 , H01L23/48 , H01L23/52
CPC分类号： H01L33/486 , H01C1/14 , H01L23/3107 , H01L23/49551 , H01L23/49805 , H01L24/48 , H01L24/73 , H01L33/62 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01068 , H01L2924/12041 , H01L2924/181 , H05K3/3442 , H05K2201/09154 , H05K2201/09472 , H05K2201/09745 , H05K2201/10106 , Y02P70/613 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.
摘要翻译：可表面安装的电子设备包括具有用于安装设备的第一表面的主体。第一表面在其中具有凹部。电触头设置在第一表面。电触点包括形成所述凹部的至少一个内表面的至少一部分的第一部分。

24. 发明授权

US06784460B2 Chip shaping for flip-chip light emitting diode 有权
标题翻译：倒装芯片发光二极管芯片整形
公开(公告)号：US06784460B2
公开(公告)日：2004-08-31
申请号：US10268223
申请日：2002-10-10
申请人： Kee Yean Ng , Yew Cheong Kuan
发明人： Kee Yean Ng , Yew Cheong Kuan
IPC分类号： H01L29267
CPC分类号： H01L33/20
摘要： A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.
摘要翻译：倒装芯片设计的LED包括发光区域和覆盖发光区域的一个或多个透明基板。发光区域包括负掺杂层，正掺杂层和负掺杂层和正掺杂层之间的有源p-n结层。至少一个基板具有通过（1）导电或非导电材料的组成确定的锥体形状，（2）侧表面的数量，（3）顶点或顶表面的偏移度，和（4）每个侧面相对于底面的倾斜角。

25. 发明授权

US08237188B2 Light source 有权
标题翻译：光源
公开(公告)号：US08237188B2
公开(公告)日：2012-08-07
申请号：US12784095
申请日：2010-05-20
申请人： Siang Ling Oon , Chin Nyap Tan , Kee Yean Ng
发明人： Siang Ling Oon , Chin Nyap Tan , Kee Yean Ng
IPC分类号： H01L33/08 , F21V29/00
CPC分类号： H01L33/486 , H01L33/644 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.
摘要翻译：本文公开了光源。一个实施例包括具有第一表面和与第一表面相对的第二表面的基底。至少一个第一导电层固定到基板的第一表面上并且部分地覆盖基板的第一表面。至少一个第二导电层固定到基板的第一表面上并且部分地覆盖基板的第一表面。在不被至少一个第一导电层或至少一个第二导电层中的任一个覆盖的区域中，将光发射器固定到衬底的第一表面。在固定光发射器的区域中，衬底可以比在第一和第二导电层被固定的区域更薄。散热器可以附接到基板的第二表面。

26. 发明授权

US07923831B2 LED-based light source having improved thermal dissipation 有权
标题翻译：基于LED的光源具有改善的散热
公开(公告)号：US07923831B2
公开(公告)日：2011-04-12
申请号：US11755912
申请日：2007-05-31
申请人： Kee Yean Ng
发明人： Kee Yean Ng
IPC分类号： H01L23/04
CPC分类号： H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques.
摘要翻译：公开了一种光源，其具有安装在部分封装在塑料体中的引线上的多个管芯。每个模具由第一和第二触点供电。一个触点连接到安装有管芯的引线上。来自LED的光从顶部表面离开模具。每个引线包括基本恒定厚度的金属层。该层包括边界，边界内的模具安装区域和边界内的传热区域。该边界在垂直于连接管芯安装区域和传热区域的线的尺寸上增加。引线被布置成使得管芯安装区域靠近第一点并且被定向成使得管线从第一点辐射。光源可以使用常规的引线框架技术制造。

27. 发明授权

US07843434B2 Optical mouse with a wavelength converting layer 有权
标题翻译：具有波长转换层的光电鼠标
公开(公告)号：US07843434B2
公开(公告)日：2010-11-30
申请号：US11224516
申请日：2005-09-12
申请人： Kee Yean Ng , Fook Main Heng
发明人： Kee Yean Ng , Fook Main Heng
IPC分类号： G06F3/033 , G09G5/08
CPC分类号： G06F3/0317 , G06F3/03543
摘要： A pointing device having an illumination system, an imaging array, and a controller is disclosed. The illumination system illuminates a surface over which the pointing device moves, the illumination system generating a light signal having first and second spectral regions. A portion of the light signal is viewable by a user of the pointing device. The first spectral region includes visible light of a predetermined color and the second spectral region includes infrared light. The imaging array records a plurality of images of the illuminated surface and is sensitive to light in the second spectral region. The second spectral region can be chosen to match the sensitivity of a silicon imaging array, while the first spectral region provides a decorative glow that is seen by the user.
摘要翻译：公开了具有照明系统，成像阵列和控制器的指示装置。照明系统照亮指示装置移动的表面，照明系统产生具有第一和第二光谱区域的光信号。光信号的一部分可由指示设备的用户观看。第一光谱区包括预定颜色的可见光，第二光谱区包括红外光。成像阵列记录被照射表面的多个图像并对第二光谱区域中的光敏感。可以选择第二光谱区域以匹配硅成像阵列的灵敏度，而第一光谱区域提供由用户看到的装饰辉光。

28. 发明授权

US07675231B2 Light emitting diode display device comprising a high temperature resistant overlay 有权
标题翻译：包括耐高温覆盖层的发光二极管显示装置
公开(公告)号：US07675231B2
公开(公告)日：2010-03-09
申请号：US10779116
申请日：2004-02-13
申请人： Elizabeth Ching Ling Fung , Kee Yean Ng , Hong Hust Yeoh
发明人： Elizabeth Ching Ling Fung , Kee Yean Ng , Hong Hust Yeoh
IPC分类号： H01J1/62 , H01K1/32
CPC分类号： H01L33/58 , H01L33/44 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.
摘要翻译：发光二极管显示装置包括具有第一导电部和第二导电部的基板。发光二极管管芯耦合到第一导电部分。引线键合耦合到发光二极管管芯并且耦合到第二导电部分。密封剂将发光二极管管芯和引线接合在衬底上方。覆盖层位于密封剂之上，其中覆盖层具有高的玻璃化转变温度。

29. 发明授权

US07568815B2 Light source having a plurality of white LEDs with different output spectra 有权
标题翻译：光源具有多个具有不同输出光谱的白色LED
公开(公告)号：US07568815B2
公开(公告)日：2009-08-04
申请号：US11691343
申请日：2007-03-26
申请人： Joon Chok Lee , Kee Yean Ng , Chee Wai Chia , David C. Feldmeier
发明人： Joon Chok Lee , Kee Yean Ng , Chee Wai Chia , David C. Feldmeier
IPC分类号： F21V9/00
CPC分类号： H05B33/0869
摘要： A solid state light source having first and second component light sources and an interface circuit and a method for making the same are disclosed. The first and second component light sources emit light having first and second color points on different sides of the black body radiation curve. The first and second component light sources include LEDs that emit light of a first wavelength and a layer of a light converting material that converts a portion of that light to light of a second wavelength. The interface circuit powers the first and second component light sources such that the solid state light source has a color point that is closer to the black body radiation curve than either the first or second color points. A third component light source can be included to expand the range of white color temperatures that can be reached by the light source.
摘要翻译：公开了一种具有第一和第二分量光源的固态光源及其接口电路及其制造方法。第一和第二分量光源发射在黑体辐射曲线的不同侧上具有第一和第二色点的光。第一和第二分量光源包括发射第一波长的光的LED和将该部分光转换成第二波长的光的光转换材料的层。接口电路为第一和第二分量光源供电，使得固态光源具有比第一或第二色点更接近黑体辐射曲线的色点。可以包括第三分量光源以扩大由光源可以达到的白色温度的范围。

30. 发明授权

US07547583B2 Light emitting diode package with direct leadframe heat dissipation 有权
标题翻译：具有直接引线框散热的发光二极管封装
公开(公告)号：US07547583B2
公开(公告)日：2009-06-16
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/495 , H01L23/34 , H01L31/0203
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译：公开了一种用于封装集成电路的封装电路和方法。封装电路具有引线框，集成电路芯片和封装层。引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。封装层具有顶部，底部以及第一和第二侧表面。第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径具有更小热阻的热路径。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式