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    • 25. 发明授权
    • Non-volatile memory devices and methods of operating the same
    • 非易失性存储器件及其操作方法
    • US07813180B2
    • 2010-10-12
    • US12005376
    • 2007-12-27
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • G11C7/00
    • H01L29/7881G11C16/3418H01L27/115H01L27/11521H01L29/42328H01L29/42336H01L29/66825
    • Example embodiment non-volatile memory devices may be capable of increased integration and reliability and may provide example methods of operating non-volatile memory devices. Example embodiment non-volatile memory devices may include a first control gate electrode on a semiconductor substrate. A first charge storing layer may be between the semiconductor substrate and the first control gate electrode. A source region may be defined in the semiconductor substrate at one side of the first control gate electrode. A first auxiliary gate electrode may be at the other side of the first control gate electrode and may be recessed into the semiconductor substrate. A first drain region may be defined in the semiconductor substrate at one side of the first auxiliary gate electrode opposite to the first control gate electrode. A bit line may be connected to the first drain region.
    • 示例性实施例非易失性存储器设备可能能够提高集成度和可靠性,并且可以提供操作非易失性存储器设备的示例性方法。 示例性实施例非易失性存储器件可以包括半导体衬底上的第一控制栅电极。 第一电荷存储层可以在半导体衬底和第一控制栅电极之间。 源区域可以在第一控制栅电极的一侧的半导体衬底中限定。 第一辅助栅电极可以在第一控制栅电极的另一侧,并且可以凹入到半导体衬底中。 第一漏极区域可以在第一辅助栅电极的与第一控制栅电极相对的一侧的半导体衬底中限定。 位线可以连接到第一漏区。
    • 29. 发明授权
    • Nonvolatile memory devices and methods of fabricating the same
    • 非易失性存储器件及其制造方法
    • US08017477B2
    • 2011-09-13
    • US11704205
    • 2007-02-09
    • Won-joo KimSuk-pil KimYoon-dong Park
    • Won-joo KimSuk-pil KimYoon-dong Park
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11568H01L29/42332H01L29/42336H01L29/42352H01L29/66621H01L29/7881H01L29/792
    • A nonvolatile memory device includes a plurality of first control gate electrodes, second control gate electrodes, first storage node films, and second storage node films. The first control gate electrodes are recessed into a semiconductor substrate. Each second control gate electrode is disposed between two adjacent first control gate electrodes. The second control gate electrodes are disposed on the semiconductor substrate over the first control gate electrodes. The first storage node films are disposed between the semiconductor substrate and the first control gate electrodes. The second storage node films are disposed between the semiconductor substrate and the second control gate electrodes. A method of fabricating the nonvolatile memory device includes forming the first storage node films, forming the first control gate electrodes, forming the second storage node films, and forming the second control gate electrodes.
    • 非易失性存储器件包括多个第一控制栅电极,第二控制栅电极,第一存储节点膜和第二存储节点膜。 第一控制栅电极凹入半导体衬底。 每个第二控制栅电极设置在两个相邻的第一控制栅电极之间。 第二控制栅电极设置在第一控制栅电极上的半导体衬底上。 第一存储节点膜设置在半导体衬底和第一控制栅电极之间。 第二存储节点膜设置在半导体衬底和第二控制栅电极之间。 一种制造非易失性存储器件的方法包括形成第一存储节点膜,形成第一控制栅电极,形成第二存储节点膜,以及形成第二控制栅电极。