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21. 发明授权

US5086125A Polyimide resin composition 失效
公开(公告)号：US5086125A
公开(公告)日：1992-02-04
申请号：US574502
申请日：1990-08-24
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, ##STR2## The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: ##STR3## aromatic polysulfone consisting of recurring units of the formula: ##STR4## or aromatic polyetherimide consisting of recurring units of the formula: ##STR5##

22. 发明授权

US4797466A High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine 失效
标题翻译： 2,6-二（3-氨基苯氧基）吡啶的高温粘合聚酰亚胺
公开(公告)号：US4797466A
公开(公告)日：1989-01-10
申请号：US11907
申请日：1987-02-06
申请人： Hideaki Oikawa , Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Yoshiho Sonobe , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Yoshiho Sonobe , Akihiro Yamaguchi
IPC分类号： C08G73/00 , C08G73/10 , C09J5/06 , C09J179/08
CPC分类号： C08G73/105 , C08G73/1064 , C08G73/1071 , C08G73/1085 , Y10T428/31721
摘要： This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3-aminophenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.
摘要翻译：本发明涉及一种新型聚酰亚胺及其制备方法，聚酰亚胺的粘合剂及其应用方法。聚酰亚胺具有下式的重复单元：其中R是选自具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和未缩合的四价基团多芳基，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺可以通过2,6-二（3-氨基苯氧基）吡啶与四羧酸二酐在有机溶剂中反应制得，并酰亚胺化得到的聚酰胺酸。可以使用各种四羧酸二酐，特别优选的是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。

23. 发明授权

US4959440A Polymide for high-temperature adhesive 失效
标题翻译： Polymide用于高温胶粘剂
公开(公告)号：US4959440A
公开(公告)日：1990-09-25
申请号：US6513
申请日：1987-01-23
申请人： Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/00 , C08G73/10 , C09J179/08
CPC分类号： C08G73/1071 , C08G73/105
摘要： This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid.The diamine in use is ether diamine and includes 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.
摘要翻译：本发明涉及一种新型聚酰亚胺及其制备方法，聚酰亚胺的粘合剂及其应用方法。聚酰亚胺具有下式的重复单元：其中苯环中的两个羰基的位置是间位或对位的，R是选自以下的四价基团：具有式不少于两个碳，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺可以通过二胺与四羧酸二酐在有机溶剂中反应并酰亚胺化得到的聚酰胺酸来制备。所用的二胺是醚二胺，包括1,3-双[4-（3-氨基苯氧基）苯甲酰]苯和1,4-双[4-（3-氨基苯氧基）苯甲酰基]苯。可以使用各种四羧酸二酐，特别优选的是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。

24. 发明授权

US4883718A Flexible copper-clad circuit substrate 失效
标题翻译：柔性铜包覆电路基板
公开(公告)号：US4883718A
公开(公告)日：1989-11-28
申请号：US159850
申请日：1988-02-05
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Snobe , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Snobe , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： B32B15/08 , H05K1/03 , H05K3/02
CPC分类号： B32B15/08 , H05K1/0346 , H05K3/022 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： This invention relates to flexible copper-clad circuit substrates where copper foil is directly and firmly jointed with a polyimide film.Polyimide used is obtained conventionally by reacting diamine components including 3,3'-diaminobenzophenone, 1,3-bis(3-aminophenoxy)-bezene, 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)-phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, bis[4(3-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl] ketone and bis[4-(3-aminophenoxy)phenyl] sulfone, with tetracarboxylic acid dianhydride including pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride, in organic solvent, and by thermally or chemically imidizing resultant polyamic acid.Polyimide thus obtained has relatively lower melt viscosity and is flowable at high temperatures. Therefore, the copper foil and the polyimide film were assembled, pressed by heating under pressure and further cured to afford the flexible copper-clad circuit substrates having the polyimide film firmly jointed with the copper foil.
摘要翻译： PCT No.PCT / JP86 / 00334 Sec。 371日期1988年2月5日 102（e）日期1988年2月5日PCT Filed 1986年6月30日PCT公布。出版物WO88 / 00428 日本公开日1988年1月14日。本发明涉及铜箔与聚酰亚胺膜直接且牢固地接合的柔性铜包覆电路基板。所使用的聚酰亚胺通常通过使包括3,3'-二氨基二苯甲酮，1,3-双（3-氨基苯氧基） - 亚乙基，4,4'-双（3-氨基苯氧基）联苯，2,2-双[4 - （3-氨基苯氧基） - 苯基]丙烷，2,2-双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，双[4（3-氨基苯氧基）苯基 ]硫醚，双[4-（3-氨基苯氧基）苯基]酮和双[4-（3-氨基苯氧基）苯基]砜与四羧酸二酐包括均苯四酸二酐，3,3'，4,4'-二苯甲酮四羧酸二酐，3,3'，4,4'-联苯四羧酸二酐和双（3,4-二羧基苯基）醚二酐在有机溶剂中，并通过热或化学酰亚胺化得到的聚酰胺酸。如此获得的聚酰亚胺具有相对较低的熔体粘度并且可在高温下流动。因此，通过加压加压将铜箔和聚酰亚胺膜组装，加压固化，得到具有与铜箔牢固连接的聚酰亚胺膜的柔性铜包覆电路基板。

25. 发明授权

US4847349A Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines 失效
标题翻译：聚酰亚胺和来自间位取代的苯氧基二胺的聚酰亚胺的高温粘合剂
公开(公告)号：US4847349A
公开(公告)日：1989-07-11
申请号：US44028
申请日：1987-06-03
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
摘要翻译： PCT No.PCT / JP86 / 00335 Sec。 371日期：1987年6月3日 102（e）1987年6月3日PCT PCT日期1986年6月30日PCT公布。出版物WO87 / 01378 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体。（Ⅰ）（Ⅱ）（其中Y是选自由键，碳原子数为1〜10的二价烃，六氟化异亚丙基，羰基，硫基，亚磺酰基，磺酰基和氧化物组成的组的径向，R为是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团的四价基团，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为Y，R为III或IV，且为异丙叉基，R为IV。聚合物可以由相应的二胺和四羧酸二酐制备。本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

26. 发明授权

US4795798A High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane 失效
标题翻译： 2,2-双[4-（3-氨基苯氧基）苯基] 1,1,1,3,3,3-六氟丙烷的高温粘合聚酰亚胺
公开(公告)号：US4795798A
公开(公告)日：1989-01-03
申请号：US18496
申请日：1987-02-25
申请人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/105
摘要： This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
摘要翻译：本发明公开了具有良好的透光率和优异的高温流动性的高温粘合剂，其包含具有由下式（I）表示的重复单元的聚酰亚胺（I）（其中R是选自由具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团组成的组，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺通过以二胺组分2,2-二[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3 - 六氟丙烷与四羧酸二酐的反应制备聚酰胺酸得到，作为均苯四酸二酐，3,3'，4,4'-联苯四羧酸二酐，双（3,4-二羧基苯基）醚二酐和3,3'4,4'-二苯甲酮四羧酸二酐，进一步进行所得物的闭环反应聚酰胺酸脱水。

27. 发明授权

US5708128A Linear polyamic acid, linear polyimide and thermoset polyimide 失效
标题翻译：线性聚酰胺酸，线性聚酰亚胺和热固性聚酰亚胺
公开(公告)号：US5708128A
公开(公告)日：1998-01-13
申请号：US668836
申请日：1996-06-24
申请人： Hideaki Oikawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/101 , C08G73/1071 , Y10T428/31504
摘要： Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
摘要翻译：根据本发明制备了新型热固性聚酰亚胺和包含热固性聚酰亚胺和纤维增强材料的复合材料。热固性聚酰亚胺通过热处理线性聚酰胺酸或通过使用4,4'-双（3-氨基苯氧基）联苯和均苯四酸二酐作为必需单体制备的线性聚酰亚胺或通过加入4,4'-二氨基二苯醚或3 ，3'，4,4'-联苯四羧酸二酐加入到基本单体中，并通过用具有碳 - 碳三键的芳族二羧酸酐封端分子链末端。热固性聚酰亚胺具有热塑性聚酰亚胺的基本优异性能，并且还具有增强的耐热性和改善的机械性能。热固性聚酰亚胺可用于为飞机基体，电气和电子设备等提供各种复合材料。

28. 发明授权

US5288843A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5288843A
公开(公告)日：1994-02-22
申请号：US608727
申请日：1990-11-05
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26 , C08G8/02
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

29. 发明授权

US5210174A Preparation process of polyimide 失效
标题翻译：聚酰亚胺的制备方法
公开(公告)号：US5210174A
公开(公告)日：1993-05-11
申请号：US612461
申请日：1990-11-14
申请人： Shoji Tamai , Hideaki Oikawa , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Hideaki Oikawa , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/1067 , C08G73/1007 , C08G73/1028 , C08G73/1071
摘要： In a process for the preparation of polyimide by reacting a diamine compound with tetracarboxylic dianhydride in a phenol based solvent, an improved process for reacting the diamine compound with tetracarboxylic dianhydride in a solution by forming separate solutions of the tetracarboxylic dianhydride and the diamine compound and mixing the solutions and/or by dissolving tetracarboxylic dianhydride in the phenol-based solvent containing an organic base.

30. 发明授权

US5157085A Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US5157085A
公开(公告)日：1992-10-20
申请号：US321107
申请日：1989-03-09
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: ##STR1##

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