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21. 发明申请

US20070104872A1 METHOD OF SEALING SEMICONDUCTOR ELEMENT MOUNTED ON GOLD-PLATED PRINTED CIRCUIT BOARD 有权
标题翻译：在镀金电镀板上密封半导体元件的方法
公开(公告)号：US20070104872A1
公开(公告)日：2007-05-10
申请号：US11557249
申请日：2006-11-07
申请人： Eiichi Tabei , Hideyoshi Yanagisawa
发明人： Eiichi Tabei , Hideyoshi Yanagisawa
IPC分类号： B05D3/10 , C08L83/04 , B32B27/00
CPC分类号： C08L83/06 , H01L23/296 , H01L23/3142 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
摘要翻译：提供密封半导体元件的方法。所述方法包括以下步骤：用可固化的硅树脂涂覆安装在镀金印刷电路板上的半导体元件，然后固化可固化的硅树脂。在一种方法中，使用包含含酸酐基团的烷氧基硅烷和/或部分水解缩合产物的处理剂对镀金印刷电路板进行预处理。另一种方法中，可固化有机硅树脂包括处理剂。该方法在密封时产生良好的附着力。

22. 发明授权

US08835091B2 Method for manufacturing micro-structure and optically patternable sacrificial film-forming composition 有权
标题翻译：微结构和光学图案化的牺牲成膜组合物的制造方法
公开(公告)号：US08835091B2
公开(公告)日：2014-09-16
申请号：US13474795
申请日：2012-05-18
申请人： Yoshinori Hirano , Hideyoshi Yanagisawa
发明人： Yoshinori Hirano , Hideyoshi Yanagisawa
IPC分类号： G03F7/023 , G03F7/38 , G03F7/40 , B81C1/00
CPC分类号： G03F7/0384 , B81B2203/0384 , B81C1/00111 , G03F7/00 , G03F7/023 , G03F7/0236 , G03F7/38 , G03F7/40 , Y10S430/122 , Y10S430/123
摘要： A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.
摘要翻译：通过图案化牺牲膜来制造微结构，在图案上形成无机材料膜，并通过孔蚀刻去除牺牲膜图案，以限定具有图案轮廓的空间。图案化阶段包括以下步骤：（A）用包含甲酚酚醛清漆树脂，交联剂和光酸产生剂的组合物涂布基材，（B）加热以形成牺牲膜，（C）图案曝光，（D）显影以形成牺牲膜图案，和（E）在甲酚酚醛清漆树脂内形成交联。

23. 发明申请

US20110005803A1 WIRE OR CABLE 有权
标题翻译：电线或电缆
公开(公告)号：US20110005803A1
公开(公告)日：2011-01-13
申请号：US12831487
申请日：2010-07-07
申请人： Hideyoshi Yanagisawa
发明人： Hideyoshi Yanagisawa
IPC分类号： H01B3/28 , H01B3/30
CPC分类号： H01B3/441 , C08G77/18 , C08G77/20 , C08K5/005 , C08K5/14 , C08K5/5425 , C08K9/06 , C08L23/0869 , C09D183/04
摘要： A wire or cable comprising a conductor or wire core and a coating layer on the exterior of the conductor or wire core which is formed from a rubber or plastic composition containing a rubber or plastic and an inorganic filler having high moisture resistance is provided. The inorganic filler is the one which has been surface treated with an alkoxy group-containing organopolysiloxane having an unsaturated aliphatic group-containing group and a monovalent hydrocarbon group of 3 to 10 carbon atoms containing no aliphatic unsaturated bond obtained by partially cohydrolytic condensation of an organic functional group-containing silane and/or its (partially) hydrolytic condensate, and an organic functional group-containing silane and/or its (partially) hydrolytic condensate.
摘要翻译：提供一种电线或电缆，其包括由包含橡胶或塑料的橡胶或塑料组合物和具有高耐湿性的无机填料形成的导体或线芯的外部的导体或线芯和涂层。无机填料是用具有不饱和脂肪族基团的含烷氧基的有机聚硅氧烷和不含脂肪族不饱和键的3〜10个碳原子的一价烃基进行表面处理的无机填充剂，该有机聚硅氧烷通过有机含官能团的硅烷和/或其（部分）水解缩合物和含有机官能团的硅烷和/或其（部分）水解缩合物。

24. 发明申请

US20090159203A1 ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION 审中-公开
标题翻译：室温可固化有机硅氧烷组合物
公开(公告)号：US20090159203A1
公开(公告)日：2009-06-25
申请号：US12394751
申请日：2009-02-27
申请人： Norio Kameda , Hideyoshi Yanagisawa , Tsuneo Kimura
发明人： Norio Kameda , Hideyoshi Yanagisawa , Tsuneo Kimura
IPC分类号： B32B37/12 , C08G77/38 , B05D3/02
CPC分类号： C08L83/04 , C08G77/16 , C08K5/544 , C08L2666/44
摘要： Provided is a room temperature curable organopolysiloxane composition, including (A) 100 parts by mass of a diorganopolysiloxane with both terminals blocked with silanol groups, or a diorganopolysiloxane with each terminal blocked, independently, with a trialkoxysilyl group or a dialkoxyorganosilyl group, or a mixture thereof, (B) 0.1 to 30 parts by mass of a silane compound and/or a partial hydrolysis-condensation product thereof containing an average of at least two hydrolysable groups bonded to silicon atoms within each molecule, and in which the remaining groups bonded to silicon atoms are methyl groups, ethyl groups, propyl groups, vinyl groups, or phenyl groups, and (C) 0.1 to 10 parts by mass of either one, or two or more organosilicon compounds containing amino groups, and also containing four or more hydrolysable groups. Also provided are a sealing material and an adhesive including the above composition. Further provided are a process for sealing an adherend with a cured product of the above sealing material and a process for bonding two adherends with a cured product of the above adhesive. The room temperature curable organopolysiloxane composition yields a cured product that exhibits excellent adhesion when exposed to hot water vapor and following such exposure, and suffers minimal evaporation residues derived from the cured product.
摘要翻译：提供了一种室温固化型有机聚硅氧烷组合物，其包含（A）100质量份两端用硅烷醇基封端的二有机聚硅氧烷，或每一末端用三烷氧基甲硅烷基或二烷氧基有机甲硅烷基封端的二有机聚硅氧烷，或混合物（B）0.1〜30质量份的硅烷化合物和/或其部分水解缩合产物，其平均含有至少两个与每个分子中的硅原子键合的可水解基团，其中剩余的基团与硅原子是甲基，乙基，丙基，乙烯基或苯基，和（C）0.1至10质量份的含有氨基的一种或两种以上有机硅化合物，并且还含有四种或更多种可水解的团体还提供了包括上述组合物的密封材料和粘合剂。还提供了用上述密封材料的固化物密封被粘物的方法以及将两个被粘体与上述粘合剂的固化物接合的方法。室温可固化的有机基聚硅氧烷组合物产生固化产物，当暴露于热水蒸气并经受这种暴露时，其表现出优异的粘附性，并且受到来自固化产物的最小的蒸发残余物的影响。

25. 发明授权

US07452571B2 Method of sealing semiconductor element mounted on gold-plated printed circuit board 有权
标题翻译：密封安装在镀金印刷电路板上的半导体元件的方法
公开(公告)号：US07452571B2
公开(公告)日：2008-11-18
申请号：US11557249
申请日：2006-11-07
申请人： Eiichi Tabei , Hideyoshi Yanagisawa
发明人： Eiichi Tabei , Hideyoshi Yanagisawa
IPC分类号： B05D3/10 , C08G77/12 , C08G77/20 , C08G77/04 , C08G77/00
CPC分类号： C08L83/06 , H01L23/296 , H01L23/3142 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
摘要翻译：提供密封半导体元件的方法。所述方法包括以下步骤：用可固化的硅树脂涂覆安装在镀金印刷电路板上的半导体元件，然后固化可固化的硅树脂。在一种方法中，使用包含含酸酐基团的烷氧基硅烷和/或部分水解缩合产物的处理剂对镀金印刷电路板进行预处理。另一种方法中，可固化有机硅树脂包括处理剂。该方法在密封时产生良好的附着力。

26. 发明申请

US20070078276A1 Preparation of sulfide chain-bearing organisilicon compounds 有权
标题翻译：含硫化物负载有机硅化合物的制备
公开(公告)号：US20070078276A1
公开(公告)日：2007-04-05
申请号：US11529599
申请日：2006-09-29
申请人： Hideyoshi Yanagisawa
发明人： Hideyoshi Yanagisawa
IPC分类号： C07F7/04 , C07F7/08
CPC分类号： C07F7/1892
摘要： A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3-p)(R2)pSi—R3—S(R4—Sm)q—R4—S—R3—Si(OR1)(3-p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3-p)(R2)pSi—R3—S—R4—X, and optionally a halide having the formula: X—R4—X and/or sulfur with an aqueous solution or dispersion of a polysulfide M2Sn or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, n has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.
摘要翻译：具有平均组成式的硫化物链有机硅化合物：<？in-line-formula description =“In-line formula”end =“lead”？>（R 1 O）（3-p）（R 2）2 Si-R 3 -S（R 4）4 -S -S（或<！ - SIPO - >）（3-p）（R 2）在线公式描述=“在线公式”结束通过使具有下式的卤素封端的有机硅化合物：（R 1→O）3（3-p）

27. 发明申请

US20070078275A1 Preparation of sulfide chain-bearing organosilicon compounds 有权
公开(公告)号：US20070078275A1
公开(公告)日：2007-04-05
申请号：US11529591
申请日：2006-09-29
申请人： Hideyoshi Yanagisawa
发明人： Hideyoshi Yanagisawa
IPC分类号： C07F7/04 , C07F7/08
CPC分类号： C07F7/1892
摘要： A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3−p)(R2)pSi—R3—S—(R4—Sm)q—R4—S—R3—Si(OR1)(3−p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3−p)(R2)pSi—R3—S—R4—X, sulfur, and optionally a halide having the formula: X—R4—X with an aqueous solution or dispersion of a sulfide M2S or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.

28. 发明申请

US20060106241A1 Preparation of sulfide chain-bearing organosilicon compounds 有权
标题翻译：含硫化物链有机硅化合物的制备
公开(公告)号：US20060106241A1
公开(公告)日：2006-05-18
申请号：US11273084
申请日：2005-11-15
申请人： Hideyoshi Yanagisawa
发明人： Hideyoshi Yanagisawa
IPC分类号： C07F7/08
CPC分类号： C07F7/1892
摘要： By reacting a mixture of a halogenoalkyl group-bearing organosilicon compound and sulfur with an aqueous solution or water dispersion of an ammonium or alkali metal sulfide or a hydrate thereof in the presence of a phase transfer catalyst, a sulfide chain-bearing organosilicon compound having the average compositional formula (2): (R1O)(3-p)(R2)pSi—R3—Sm—R3—Si(OR1)(3-p)(R2)p (2) wherein m has an average value of 2≦m≦6 is obtained in high yields and at a low cost with minimized formation of a monosulfide-bearing organosilicon compound.
摘要翻译：通过使含有卤代烷基的有机硅化合物和硫的混合物与相转移催化剂存在下的铵或碱金属硫化物或其水合物的水溶液或水分散体反应，具有硫化物链的有机硅化合物具有平均组成式（2）：<？in-line-formula description =“In-line formula”end =“lead”？>（R 1）O（3-p）（R 2）2 Si-R 3 -S 3 （3-p）（R 2）2（2）（2） <？in-line-formula description =“在线公式”end =“tail”？>其中m的平均值为2 <= m <= 6，以高产率和低成本获得，最小化形成含有单硫的有机硅化合物。

29. 发明授权

US6015870A Process for preparing polysulfide silanes 有权
标题翻译：制备多硫硅烷的方法
公开(公告)号：US6015870A
公开(公告)日：2000-01-18
申请号：US161290
申请日：1998-09-28
申请人： Shoji Ichinohe , Hideyoshi Yanagisawa , Akira Yamamoto
发明人： Shoji Ichinohe , Hideyoshi Yanagisawa , Akira Yamamoto
IPC分类号： C07F7/18 , C08G77/22
CPC分类号： C07F7/1892
摘要： Polysulfide silanes: (RO).sub.3 SiC.sub.3 H.sub.6 S.sub.x C.sub.3 H.sub.6 Si(OR).sub.3 are reacted with an anhydrous sulfur compound: M.sup.1.sub.2 S or M.sup.2 S and a halogenoalkoxysilane: XC.sub.3 H.sub.6 Si(OR).sub.3 to form polysulfide silanes: (RO).sub.3 SiC.sub.3 H.sub.6 S.sub.y C.sub.3 H.sub.6 Si(OR).sub.3 wherein R is methyl or ethyl, x is a positive number of 3 to 6 on the average, M.sup.1 is an alkali metal or ammonium, M.sup.2 is an alkaline earth metal or zinc, X is a halogen, and y is a positive number less than x on the average. Short chain polysulfide silanes can be prepared with the industrial advantages of safety, high yields and low cost.
摘要翻译：将多硫化硅烷：（RO）3SiC 3 H 6 S x C 3 H 6 Si（OR）3与无水硫化合物：M12S或M2S和卤代烷氧基硅烷：XC3H6Si（OR）3反应形成多硫化硅烷：（RO）3SiC 3 H 6 S 3 C 6 H 6 Si（OR）3，其中R为甲基或乙基 x是平均为3〜6的正数，M1为碱金属或铵，M2为碱土金属或锌，X为卤素，y为平均小于x的正数。短链多硫硅烷可以安全，高产率，低成本的工业优点制备。

30. 发明授权

US5523441A Fluorocarbon group-containing organosilane compound 失效
标题翻译：含氟碳基的有机硅烷化合物
公开(公告)号：US5523441A
公开(公告)日：1996-06-04
申请号：US383376
申请日：1995-02-03
申请人： Hirofumi Kishita , Noriyuki Koike , Hideyoshi Yanagisawa , Toshio Takago
发明人： Hirofumi Kishita , Noriyuki Koike , Hideyoshi Yanagisawa , Toshio Takago
IPC分类号： C07F7/18 , C07F7/10
CPC分类号： C07F7/1836
摘要： Disclosed is a novel polyfluorocarbon group-containing alkoxy silane compound useful as a silane coupling agent as represented by the general formulaA--R.sub.f --(--CH.sub.2 --).sub.n --NH--R.sup.1 --SiR.sub.3,in which each R is, independently from the others, a monovalent hydrocarbon group having 1 to 10 carbon atoms or an alkoxy group having 1 to 6 carbon atoms with the proviso that at least one of the three groups denoted by R is an alkoxy group, R.sup.1 is a divalent hydrocarbon group having 1 to 10 carbon atoms, A is a monovalent group selected from the class consisting of a hydrogen atom, a fluorine atom, an aminomethyl group and a 2-aminoethyl group, R.sub.f is a polyfluorinated alkylene group with 1 to 20 carbon atoms or a polyfluorinated etherified alkylene group with 2 to 20 carbon atoms having at least one oxygen atom between two carbon atoms of an alkylene group forming an ether linkage, at least two of the hydrogen atoms therein being substituted by fluorine atoms, and the subscript n is 1 or 2.
摘要翻译：公开了一种新型的含有氟代烃基的烷氧基硅烷化合物，其可用作通式A-Rf - （ - CH2-）n-NH-R1-SiR3所示的硅烷偶联剂，其中每个R独立于其它，具有1-10个碳原子的一价烃基或具有1至6个碳原子的烷氧基，条件是由R表示的三个基团中的至少一个是烷氧基，R 1是具有1至10个碳原子的二价烃基碳原子，A为选自氢原子，氟原子，氨基甲基和2-氨基乙基的一价基团，Rf为碳原子数1〜20的多氟化亚烷基或多氟化醚化亚烷基具有2至20个碳原子，在形成醚键的亚烷基的两个碳原子之间具有至少一个氧原子，其中至少两个氢原子被氟原子取代，并且下标n为1或2。

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