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21. 发明申请

US20100018562A1 SOLAR CELL, SOLAR CELL STRING AND SOLAR CELL MODULE 有权
标题翻译：太阳能电池，太阳能电池和太阳能电池模块
公开(公告)号：US20100018562A1
公开(公告)日：2010-01-28
申请号：US12296748
申请日：2007-03-15
申请人： Takahisa Kurahashi , Hirotaka Sato , Akira Miyazawa , Kyotaro Nakamura , Toshio Kimura , Masaomi Hioki
发明人： Takahisa Kurahashi , Hirotaka Sato , Akira Miyazawa , Kyotaro Nakamura , Toshio Kimura , Masaomi Hioki
IPC分类号： H01L31/042 , H01L31/00
CPC分类号： H01L31/022433 , H01L31/0508 , Y02E10/50
摘要： A solar cell includes a semiconductor substrate having a photoelectric converting portion, a first electrode formed on a first main surface of the semiconductor substrate, and a second electrode connected to the first electrode on the first main surface. The first electrode includes a plurality of first connecting portions to be connected to an interconnector and a first non-connecting portion not connected to an interconnector. The first non-connecting portion is arranged between first connecting portions to electrically connect the first connecting portions together. The first connecting portion and first non-connecting portion are coupled forming an angle larger than 90° and smaller than 180°. A solar cell string and a solar cell module employ the solar cells.
摘要翻译：太阳能电池包括具有光电转换部分的半导体衬底，形成在半导体衬底的第一主表面上的第一电极和与第一主表面上的第一电极连接的第二电极。第一电极包括要连接到互连器的多个第一连接部分和未连接到互连器的第一非连接部分。第一非连接部分布置在第一连接部分之间以将第一连接部分电连接在一起。第一连接部分和第一非连接部分被连接形成大于90°且小于180°的角度。太阳能电池串和太阳能电池模块采用太阳能电池。

22. 发明申请

US20090007785A1 Method for removing mercury vapor in gas 审中-公开
标题翻译：去除气体中汞蒸气的方法
公开(公告)号：US20090007785A1
公开(公告)日：2009-01-08
申请号：US12073156
申请日：2008-02-29
申请人： Toshio Kimura , Tetsuya Fukunaga , Keizo Furukawa
发明人： Toshio Kimura , Tetsuya Fukunaga , Keizo Furukawa
IPC分类号： B01D53/64 , B01D53/02
CPC分类号： B01D53/02 , B01D2253/102 , B01D2257/302 , B01D2257/602 , B01J20/046 , B01J20/20 , B01J20/3204 , B01J20/3236
摘要： When sulfur oxides are present in mercury vapor-containing gas, the adsorption of mercury vapor by activated carbon is inhibited. Therefore, there has been demand for development of a method for effective adsorption removal of mercury vapor even in the coexistence of sulfur oxides.Efficient and long-term removal of mercury vapor was made successful by contacting an activated carbon adsorbent consisting of 100 parts by weight of activated carbon impregnated with 5 to 70 parts by weight of only an alkali metal halide, with mercury vapor in sulfur oxide-containing gas.
摘要翻译：当含汞气体中存在硫氧化物时，活性炭对汞蒸汽的吸附被抑制。因此，即使在硫氧化物共存的情况下，也需要开发有效吸附去除汞蒸汽的方法。通过使含有5〜70重量份碱金属卤化物的100重量份活性炭与含硫氧化物中的水银蒸气组成的活性炭吸附剂接触，使汞蒸气的高效和长期除去成功加油站。

23. 发明授权

US07265916B2 Module for optical devices, and manufacturing method of module for optical devices 失效
标题翻译：光学元件模块及光学元件模块的制造方法
公开(公告)号：US07265916B2
公开(公告)日：2007-09-04
申请号：US11039813
申请日：2005-01-24
申请人： Toshio Kimura
发明人： Toshio Kimura
IPC分类号： G02B7/02
CPC分类号： H01L27/14625 , G02B13/001 , H01L27/14618 , H01L31/0203 , H01L31/02325 , H01L2224/73265 , H01L2924/07811 , H04N5/2253 , H04N5/2254 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A DSP, which has a through electrode and is stacked to a wiring substrate through an adhesive part, a solid-state image pickup element, which is stacked to the DSP through an adhesive part and has a through electrode and an effective pixel area, and a translucent lid part, which is placed to face the effective pixel area and bonded to the solid-state image pickup element through an adhesive part, are stored in an optical path defining unit with a lens for defining an optical path to the effective pixel area, and the translucent lid part is coupled to the optical path defining unit by a coupling part.
摘要翻译：一种DSP，其具有通过电极并且通过粘合部分堆叠到布线基板，固态图像拾取元件，其通过粘合部分堆叠到DSP并且具有通孔和有效像素区域，以及被放置成面对有效像素区域并通过粘合部分粘合到固态图像拾取元件的半透明盖部分被存储在具有用于限定到有效像素区域的光路的透镜的光路限定单元中并且半透明盖部分通过联接部分耦合到光路限定单元。

24. 发明授权

US07245643B2 Semiconductor laser module and method of manufacturing the same 有权
标题翻译：半导体激光模块及其制造方法
公开(公告)号：US07245643B2
公开(公告)日：2007-07-17
申请号：US10747398
申请日：2003-12-30
申请人： Masashi Nakae , Toshio Kimura
发明人： Masashi Nakae , Toshio Kimura
IPC分类号： H01S5/00
CPC分类号： B82Y20/00 , G02B6/4201 , G02B6/4213 , G02B6/4245 , G02B6/4269 , G02B6/4286 , H01S5/0014 , H01S5/005 , H01S5/02248 , H01S5/02284 , H01S5/02415 , H01S5/02438 , H01S5/02484 , H01S5/0683 , H01S5/1085 , H01S5/22 , H01S5/227 , H01S5/3409 , H01S5/4012 , H01S5/4031 , H01S5/4087
摘要： A semiconductor laser module according to the present invention includes a polarization-synthesizing module having a polarization-synthesizing means configured to polarization synthesize two laser beams and a holder member for holding the polarization-synthesizing means with an approximately cylindrical circumferential surface, and a supporting member for supporting the holder member at least to rotate about an central axis and fixing the holder member at a predetermined position.
摘要翻译：根据本发明的半导体激光器模块包括具有偏振合成两个激光束的偏振合成装置的极化合成模块和用于保持具有近似圆柱形周向表面的偏振合成装置的保持器构件，以及支撑构件用于支撑保持器构件至少围绕中心轴线旋转并将保持器构件固定在预定位置。

25. 发明授权

US07198446B2 Connected fastener having separation facilitator 失效
标题翻译：连接紧固件有分离促进器
公开(公告)号：US07198446B2
公开(公告)日：2007-04-03
申请号：US10491006
申请日：2002-09-27
申请人： Hideaki Yoshizawa , Toshio Kimura
发明人： Hideaki Yoshizawa , Toshio Kimura
IPC分类号： F16B15/08
CPC分类号： F16B15/08
摘要： The object of the invention is to secure straight travelability for a fastener during the driving of the latter, simplify the connecting fastener production process, simplify the cleaning of the work site, and prevent work-attending damage to the flooring. In a connecting fastener, kraft paper (5) in a combination band (2, 3) for holding a number of nails (2) is pasted to opposite surfaces of the nails (2), the kraft paper (5) having a plastic layer (6) that is formed with a plurality of grooves (7A, 7B) with a pitch smaller than the arrangement pitch of the nails (2), facilitating the separation of the nails (2).
摘要翻译：本发明的目的是在紧固件的驱动过程中确保紧固件的直线行进性能，简化连接紧固件生产过程，简化工作场所的清洁以及防止工作对地板的损坏。在连接紧固件中，将用于保持多个钉子（2）的组合带（2,3）中的牛皮纸（5）粘贴到指甲（2）的相对表面上，牛皮纸（5）具有塑料层（6），其形成有具有比所述指甲（2）的排列间距小的间距的多个凹槽（7A，7B），有助于所述指甲（2）的分离。

26. 发明授权

US07194014B2 Semiconductor laser device, semiconductor laser module, and optical fiber amplifier using the semiconductor laser module 有权
标题翻译：半导体激光器件，半导体激光器模块和使用半导体激光器模块的光纤放大器
公开(公告)号：US07194014B2
公开(公告)日：2007-03-20
申请号：US10748159
申请日：2003-12-31
申请人： Junji Yoshida , Naoki Tsukiji , Toshio Kimura , Masashi Nakae , Takeshi Aikiyo
发明人： Junji Yoshida , Naoki Tsukiji , Toshio Kimura , Masashi Nakae , Takeshi Aikiyo
IPC分类号： H01S5/00 , H01S3/14
CPC分类号： H01S5/4031 , B82Y20/00 , G02B6/4206 , G02B6/4218 , H01S3/094003 , H01S3/094073 , H01S3/302 , H01S5/02248 , H01S5/02284 , H01S5/02415 , H01S5/02438 , H01S5/028 , H01S5/0683 , H01S5/1039 , H01S5/1096 , H01S5/12 , H01S5/125 , H01S5/227 , H01S5/3215 , H01S5/3409 , H01S5/4012 , H01S5/4062 , H01S5/4087
摘要： A semiconductor laser device having two active-layer stripe structures includes an n-InP substrate, an n-InP clad layer, a lower GRIN-SCH layer, an active layer, an upper GRIN-SCH layer, a p-InP clad layer, and a p-InGaAsP contact layer grown in this order, in a side cross section cut along one of the stripe structure. A high-reflection film is disposed on a reflection-side end surface, and a low-reflection film is disposed on an emission-side end surface. A p-side electrode is disposed on only a part of the upper surface of the p-InGaAsP contact layer so that a current non-injection area is formed on an area absent the p-side electrode.
摘要翻译：具有两个有源层条纹结构的半导体激光器件包括n-InP衬底，n-InP覆盖层，下部GRIN-SCH层，有源层，上部GRIN-SCH层，p-InP覆盖层，和p-InGaAsP接触层，沿着条纹结构中的一个切割的侧截面中依次生长。高反射膜设置在反射侧端面上，低反射膜设置在发射侧端面上。 p侧电极仅设置在p-InGaAsP接触层的上表面的一部分上，使得在没有p侧电极的区域上形成电流的非注入区域。

27. 发明授权

US07085440B2 Semiconductor laser module and optical amplifier 有权
标题翻译：半导体激光模块和光放大器
公开(公告)号：US07085440B2
公开(公告)日：2006-08-01
申请号：US10476871
申请日：2002-07-02
申请人： Toshio Kimura , Masashi Nakae
发明人： Toshio Kimura , Masashi Nakae
IPC分类号： G02B6/00 , G02B6/36 , G02B6/38 , G02B5/30 , G02B27/28
CPC分类号： H01S5/146 , B82Y20/00 , G02B6/2713 , G02B6/4206 , G02B6/4218 , H01S3/094003 , H01S3/094073 , H01S3/302 , H01S5/005 , H01S5/02248 , H01S5/02284 , H01S5/02415 , H01S5/02438 , H01S5/1039 , H01S5/125 , H01S5/3215 , H01S5/3409 , H01S5/4012 , H01S5/4025 , H01S5/4087
摘要： A semiconductor laser module includes a polarization direction transforming part which transforms polarization directions of first and second laser beams such that they are orthogonal to each other even if a polarization dependent optical isolator is utilized in the semiconductor laser module. The configuration allows the two laser beams to propagate through the birefringence element to the output port without each splitting into an ordinary ray and an extraordinary ray on entering the birefringence element, and therefore free from decrease of optical power reaching the output port. Thus, high power semiconductor laser modules can be provided.
摘要翻译：半导体激光器模块包括偏振方向变换部分，即即使在半导体激光器模块中使用偏振相关光隔离器，也可以使第一和第二激光束的偏振方向彼此正交。该配置允许两个激光束通过双折射元件传播到输出端口，而不会在进入双折射元件时分裂成普通的光线和异常的光线，并且因此没有降低到达输出端口的光功率。因此，可以提供大功率半导体激光器模块。

28. 发明授权

US07052934B2 Fabrication method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US07052934B2
公开(公告)日：2006-05-30
申请号：US10787740
申请日：2004-02-27
申请人： Hideyuki Kurimoto , Yoshihisa Dotta , Toshio Kimura
发明人： Hideyuki Kurimoto , Yoshihisa Dotta , Toshio Kimura
IPC分类号： H01L21/44
CPC分类号： H01L21/6835 , H01L21/6836 , H01L24/27 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2221/68381 , H01L2224/274 , H01L2924/3512 , H01L2924/00
摘要： A fabrication method of a semiconductor device according to the present invention includes the steps of: bonding a reinforcing plate with a front surface of a semiconductor wafer via a reinforcing plate, the reinforcing plate having holes and the semiconductor wafer bearing semiconductor devices; grinding a back surface of the semiconductor wafer; and detaching the reinforcing plate from the semiconductor wafer by injecting a solvent for dissolving an adhesive layer into the holes and by allowing the solvent to permeate through the adhesive layer. The method enables the reinforcing plate to be quickly detached from the semiconductor wafer without causing defects, such as bending and cracking, in the semiconductor wafer after the reinforcing plate is used to grind the semiconductor wafer.
摘要翻译：根据本发明的半导体器件的制造方法包括以下步骤：通过加强板，具有孔的加强板和半导体晶片轴承半导体器件将加强板与半导体晶片的前表面接合; 研磨半导体晶片的背面; 并且通过将用于溶解粘合剂层的溶剂注入到孔中并使溶剂渗透通过粘合剂层而从半导体晶片分离加强板。该方法能够在加强板用于研磨半导体晶片之后，在半导体晶片中使加强板快速地从半导体晶片脱离，而不引起诸如弯曲和破裂的缺陷。

29. 发明授权

US07023551B2 Method, system and computer program product for assembling an optical module 有权
公开(公告)号：US07023551B2
公开(公告)日：2006-04-04
申请号：US09845158
申请日：2001-05-01
申请人： Shinichiro Iizuka , Toshio Kimura
发明人： Shinichiro Iizuka , Toshio Kimura
IPC分类号： G01B11/00
CPC分类号： G02B6/4221 , G02B6/4203 , G02B6/4226 , G02B6/4227 , H01S5/0014 , H01S5/005
摘要： A method, system and computer program product for assembling an optical module incorporates a far field pattern (FFP) optical measurement system and optionally a near field pattern (NFP) optical measurement system to obtain information about the axis and/or the divergent angle of light output from the optical elements to be assembled as part of the optical module. The optical elements include a light-emitting element, such as a laser diode, and at least one optical component, such as a collimating lens or a focusing lens. The system for assembling the optical module further includes a stage having the light-emitting element mounted thereon, a holding mechanism configured to hold and position the optical components to desired positions based on the measurements from the FFP and/or NFP optical measurement systems. A controller can control the stage, the holding mechanism and a fixing device configured to fix the positions of the optical elements once the optical elements are positioned in the desired positions.

30. 发明授权

US06934311B2 Semiconductor laser module and Raman amplifier 有权
标题翻译：半导体激光模块和拉曼放大器
公开(公告)号：US06934311B2
公开(公告)日：2005-08-23
申请号：US10329716
申请日：2002-12-27
申请人： Hiroshi Shimizu , Naoki Tsukiji , Junji Yoshida , Toshio Kimura , Yutaka Ohki , Kouhei Terada , Hidehiro Taniguchi
发明人： Hiroshi Shimizu , Naoki Tsukiji , Junji Yoshida , Toshio Kimura , Yutaka Ohki , Kouhei Terada , Hidehiro Taniguchi
IPC分类号： G02B6/42 , G02F1/35 , H01S3/094 , H01S3/10 , H01S3/30 , H01S5/022 , H01S5/024 , H01S5/12 , H01S5/34 , H04B10/2507 , H04B10/29 , H04B10/294 , H01S3/08 , H01S3/098 , H01S5/00
CPC分类号： B82Y20/00 , G02B6/4206 , H01S3/094011 , H01S3/302 , H01S5/02248 , H01S5/02284 , H01S5/02296 , H01S5/02415 , H01S5/0683 , H01S5/1092 , H01S5/12 , H01S5/146 , H01S5/227 , H01S5/3408 , H01S2301/02
摘要： A semiconductor laser module has a Fabry-Perot type semiconductor laser device, an optical fiber, and first and second lenses. The tip of the optical fiber, on which the laser beam falls, is askew polished. The optical fiber is fixed in such a manner that the axis of the optical fiber makes an angle with respect to an optical axis of the laser beam. Coatings that avoid reflection are formed on the tip of the optical fiber, and on the first and second lenses.
摘要翻译：半导体激光器模块具有法布里 - 珀罗型半导体激光器件，光纤以及第一和第二透镜。激光束落在其上的光纤的尖端是倾斜的抛光。光纤以使得光纤的轴相对于激光束的光轴成一定角度的方式固定。避免反射的涂层形成在光纤的尖端上，并在第一和第二透镜上。

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