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21. 发明授权

US5330292A System and method for transmitting and calculating data in shield machine 失效
标题翻译：盾构机数据传输和计算系统及方法
公开(公告)号：US5330292A
公开(公告)日：1994-07-19
申请号：US927672
申请日：1992-09-29
申请人： Shoichi Sakanishi , Tetsuya Shinbo , Tomoyuki Abe , Yasuhiko Ichimura , Yasuo Kanemitsu , Kanji Shibatani , Masahiko Yamamoto , Hiroaki Yamaguchi
发明人： Shoichi Sakanishi , Tetsuya Shinbo , Tomoyuki Abe , Yasuhiko Ichimura , Yasuo Kanemitsu , Kanji Shibatani , Masahiko Yamamoto , Hiroaki Yamaguchi
IPC分类号： E21D11/00 , E21D9/06 , E21D9/087 , G08C23/00
CPC分类号： G08C23/00 , E21D9/093
摘要： The present invention discloses a system and a method for transmitting data in a shield machine and for calculating the filling amount of a void by detecting the distance to the natural ground. The system and the method are capable of transmitting analogue signals or signals of relatively high frequencies with reliability, enabling an unskilled operator to accurately detect buried articles and accurately carry out the back-filling work. Therefore, an optical rotary joint (100) is disposed between a rotary cutter head (10) and a non-rotary shield body (2) to count time taken to detect the peak value of a reflected signal larger than a standard value or time taken to detect the zero cross position present prior to the peak value. In accordance with the counted time, the distance between the antenna and the natural ground is calculated and displayed. Then, the void volume is calculated in accordance with the distance so that a target value of the back-filling amount is set.
摘要翻译： PCT No.PCT / JP91 / 00316 Sec。 371日期：1992年9月29日 102（e）日期1992年9月29日PCT 1991年3月8日PCT公布。公开号WO91 / 14077 1991年9月19日，本发明公开了一种在屏蔽机中传送数据的系统和方法，用于通过检测距天然地面的距离来计算空隙的填充量。该系统和方法能够以可靠的方式传输相对较高频率的模拟信号或信号，使得不熟练的操作者能够精确地检测埋置的物品并准确地执行后备工作。因此，光学旋转接头（100）设置在旋转刀头（10）和非旋转屏蔽体（2）之间，以计数检测大于标准值或所用时间的反射信号的峰值所需的时间以检测峰值之前存在的零交叉位置。根据计时时间，计算并显示天线与天然地面之间的距离。然后，根据距离计算空隙体积，使得设定填充量的目标值。

22. 发明授权

US5155333A Low hydrogen type coated electrode 失效
标题翻译：低氢型涂层电极
公开(公告)号：US5155333A
公开(公告)日：1992-10-13
申请号：US733819
申请日：1991-07-22
申请人： Takashi Wada , Shouzou Naruse , Tomoyuki Abe
发明人： Takashi Wada , Shouzou Naruse , Tomoyuki Abe
IPC分类号： B23K35/36 , B23K35/365
CPC分类号： B23K35/365 , B23K35/3602
摘要： Disclosed herein is a low hydrogen type coated electrode comprising a steel core wire entirely coated with a coating agent, wherein the coating agent contains, by weight, 35-55% CaCO.sub.3, 1-4% SrCO.sub.3, 1.5-4% CaF.sub.2, 1-5% TiO.sub.2, 5-12% SiO.sub.2, 3-9% Si, 1-6% Mn and 15-40% Fe and fulfills the following relationships:CaCO.sub.3 /CaF.sub.2=from 9 to 25, andFe/CaF.sub.2=from 5 to 22.The low hydrogen type coated electrode produces excellent effects particularly when applied to downward welding for circumferential butt joints of pipes.
摘要翻译：本文公开了一种低氢型涂覆电极，其包括完全涂覆有涂层剂的钢芯丝，其中涂层剂含有35-55％CaCO 3，1-4％SrCO 3，1.5-4％CaF 2， 5％TiO2，5-12％SiO2，3-9％Si，1-6％Mn和15-40％Fe，满足以下关系：CaCO3 / CaF2 = 9〜25，Fe / CaF2 = 5〜低氢型涂覆电极特别适用于管道圆周对接接头的向下焊接时产生极好的效果。

23. 发明授权

US09206308B2 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board 有权
标题翻译：预浸料，预浸料和多层印刷电路板用环氧树脂组合物
公开(公告)号：US09206308B2
公开(公告)日：2015-12-08
申请号：US13637629
申请日：2011-03-22
申请人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
发明人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
IPC分类号： H05K1/03 , B32B27/04 , B32B27/20 , B32B27/26 , B32B27/38 , C08K3/10 , C08K3/22 , C08L63/00 , C08G59/22 , C08G59/30 , C08G59/38 , C08G59/62 , C08G59/40 , C08J5/24 , C08K9/02 , C08K5/5313 , C08K5/5397
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
摘要翻译：本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

24. 发明授权

US08250680B2 Urinal 有权
标题翻译：小便池
公开(公告)号：US08250680B2
公开(公告)日：2012-08-28
申请号：US12172176
申请日：2008-07-11
申请人： Kensuke Murata , Masayuki Nagaishi , Tomoyuki Abe , Hiroshi Tsuboi
发明人： Kensuke Murata , Masayuki Nagaishi , Tomoyuki Abe , Hiroshi Tsuboi
IPC分类号： E03D13/00
CPC分类号： G01V3/12 , E03D5/105 , E03D13/00
摘要： A urinal includes: a urinal body; a high-frequency sensor which radiates a radio beam obliquely passing through an upper surface of the urinal body toward a bowl and receives a reflected wave from an object so as to generate a detection signal; and a valve which discharges or stops flushing water to the urinal body in response to the detection signal. An angle formed between a first plane including the upper surface of the urinal body and a second plane including a radiation surface of an antenna of the high-frequency sensor is in a range of more than 0 degree to less than 90 degree. A cross line where the first plane and the second plane intersect with each other is substantially parallel to a horizontal direction of the urinal body. The radio beam is a linearly-polarized wave. An excitation direction of the radio beam intersects with the cross line. An intensity of the radio beam passing through the urinal body is larger than that of the radio beam reflected by the upper surface.
摘要翻译：小便池包括：小便器; 高频传感器，其将倾斜地通过小便器的上表面的无线电束朝向碗体辐射，并从物体接收反射波，以产生检测信号; 以及响应于检测信号而将冲洗水排出或停止到小便器体的阀。在包括小便器的上表面的第一平面和包括高频传感器的天线的辐射表面的第二平面之间形成的角度在大于0度至小于90度的范围内。第一平面和第二平面彼此交叉的交叉线基本上平行于小便器的水平方向。无线电波束是线性偏振波。无线电波束的激发方向与交叉线相交。通过小便器的无线电波的强度大于由上表面反射的无线电波束的强度。

25. 发明授权

US08119925B2 Core substrate and printed wiring board 有权
标题翻译：核心基板和印刷线路板
公开(公告)号：US08119925B2
公开(公告)日：2012-02-21
申请号：US12390010
申请日：2009-02-20
申请人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano
发明人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/09536 , H05K2201/09809 , Y10T428/24331
摘要： The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.
摘要翻译：核心基材的芯层由浸渍有树脂的碳纤维制成。当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。芯层夹在包含玻璃纤维的绝缘层之间。绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。核心基板中的热应力被抑制。

26. 发明授权

US08110749B2 Printed wiring board 失效
标题翻译：印刷电路板
公开(公告)号：US08110749B2
公开(公告)日：2012-02-07
申请号：US12390168
申请日：2009-02-20
申请人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano
发明人： Hideaki Yoshimura , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano
IPC分类号： H05K1/16
CPC分类号： H05K3/445 , H05K3/4608 , H05K2201/0323 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09609 , H05K2201/09809
摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.
摘要翻译：在印刷电路板的芯层中形成大尺寸的通孔。大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。填充材料填充大尺寸通孔的内部空间。小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

27. 发明授权

US07799604B2 Semiconductor device having multilayer printed wiring board and manufacturing method of the same 有权
标题翻译：具有多层印刷线路板的半导体器件及其制造方法
公开(公告)号：US07799604B2
公开(公告)日：2010-09-21
申请号：US11822084
申请日：2007-07-02
申请人： Tomoyuki Abe , Motoaki Tani
发明人： Tomoyuki Abe , Motoaki Tani
IPC分类号： H01L21/44
CPC分类号： H01L21/4857 , H01L23/13 , H01L23/36 , H01L23/49833 , H01L23/5389 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H01L2924/3511
摘要： A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.
摘要翻译：半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片，穿过所述支撑体和所述第二基板的开口部。第一基板包括第一电介质层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括由与第一电介质层基本相同的材料制成的第二电介质层。

28. 发明授权

US07448825B2 Method for continuous on-site recycling of an asphalt mixture layer of a pavement and a motor-driven vehicle system therefor 有权
标题翻译：路面沥青混合料层及其电动车辆系统的连续现场回收方法
公开(公告)号：US07448825B2
公开(公告)日：2008-11-11
申请号：US11698531
申请日：2007-01-26
申请人： Atsushi Kasahara , Shunsuke Ushio , Kojiro Ogata , Hiroshi Inamitsu , Fumio Goto , Tomoyuki Abe , Hiroaki Irie , Isami Fujii , Kazuo Onoda , Hideo Ikeda , Eisuke Nagai , Atsuki Gomi , Masaki Tsunabuchi
发明人： Atsushi Kasahara , Shunsuke Ushio , Kojiro Ogata , Hiroshi Inamitsu , Fumio Goto , Tomoyuki Abe , Hiroaki Irie , Isami Fujii , Kazuo Onoda , Hideo Ikeda , Eisuke Nagai , Atsuki Gomi , Masaki Tsunabuchi
IPC分类号： E01C23/12 , E01C7/32
CPC分类号： E01C23/065
摘要： A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.
摘要翻译：一种用于在移动自行车辆系统的同时循环使用铺路的沥青混合物层的方法，其包括加热和软化沥青混合物层的步骤，刮削和破碎所述热和软化沥青混合物的步骤将软化混合物保持在足够不形成骨料的温度下，制备具有单一颗粒结构的沥青混合料，将具有单一颗粒结构的沥青混合料分级成多个粒度组的筛分步骤，设计混合比例的步骤，通过使用分级的所述多个粒度组将所述沥青混合物转化为再循环沥青混合物，将所述具有设计的混合比例的再循环沥青混合物均匀混合的步骤，以及将所述沥青混合物扩展和压实所述再循环沥青混合物已经均匀混合，从而形成再循环沥青混合物层。

29. 发明授权

US07400035B2 Semiconductor device having multilayer printed wiring board 有权
标题翻译：具有多层印刷线路板的半导体装置
公开(公告)号：US07400035B2
公开(公告)日：2008-07-15
申请号：US11023044
申请日：2004-12-28
申请人： Tomoyuki Abe , Motoaki Tani
发明人： Tomoyuki Abe , Motoaki Tani
IPC分类号： H01L23/04 , H01L21/48
CPC分类号： H01L21/4857 , H01L23/13 , H01L23/36 , H01L23/49833 , H01L23/5389 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H01L2924/3511
摘要： A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.
摘要翻译：半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片，穿过所述支撑体和所述第二基板的开口部。第一基板包括第一介电层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括由与第一电介质层基本相同的材料制成的第二电介质层。

30. 发明申请

US20060175084A1 Wiring board and method for fabricating the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20060175084A1
公开(公告)日：2006-08-10
申请号：US11138467
申请日：2005-05-27
申请人： Keishiro Okamoto , Tomoyuki Abe , Motoaki Tani , Nobuyuki Hayashi
发明人： Keishiro Okamoto , Tomoyuki Abe , Motoaki Tani , Nobuyuki Hayashi
IPC分类号： H05K1/11 , H05K3/42
CPC分类号： H05K3/445 , H05K1/056 , H05K3/426 , H05K2201/0179 , H05K2201/0195 , H05K2201/0323 , H05K2201/09581 , H05K2203/135 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.
摘要翻译：布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

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