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    • 27. 发明授权
    • Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product
    • 感光树脂组合物,感光性树脂清漆,感光性树脂膜,感光性树脂固化物
    • US08604096B2
    • 2013-12-10
    • US13512713
    • 2010-11-29
    • Kouji SuzumuraIkue MitaniToshihiko TakasakiIkuo MukaiMasami Ochiai
    • Kouji SuzumuraIkue MitaniToshihiko TakasakiIkuo MukaiMasami Ochiai
    • C08F2/46C08F2/50C08B37/00B29C71/04C08J3/28C08G61/04
    • G02B1/10C08L63/10C09D7/48G03F7/027G03F7/029
    • Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product.The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from α-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.0 parts by mass based on 100 parts by mass of the component (A); and a content of the component (C) is 0.01 to 1 part by mass based on 100 parts by mass of the component (A).
    • 本发明提供能够快速固化的光敏树脂组合物,并提供在400〜780nm的可见光和耐热可靠性的透明性优异的光固化物中,感光性树脂清漆,感光性树脂膜和 感光性树脂固化物。 感光性树脂组合物包含(A)可聚合化合物,(B)聚合引发剂和(C)受阻酚基抗氧化剂,其中(B-1)选自α-羟基苯乙酮基光引发剂和糖基酯基光引发剂中的至少一种 和(B-2)作为组分(B)的氧化膦基光引发剂; 成分(C)是在同一芳环上具有分子中至少一个具有甲基和叔丁基一个基团的至少一个苯酚基的受阻酚基抗氧化剂; 相对于成分(A)100质量份,成分(B)的含量为0.02〜4.0质量份。 相对于100质量份的成分(A),成分(C)的含量为0.01〜1质量份。
    • 28. 发明申请
    • PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT
    • 感光树脂组合物,感光树脂变性,感光树脂薄膜和感光树脂固化产品
    • US20120270963A1
    • 2012-10-25
    • US13512713
    • 2010-11-29
    • Kouji SuzumuraIkue MitaniToshihiko TakasakiIkuo MukaiMasami Ochiai
    • Kouji SuzumuraIkue MitaniToshihiko TakasakiIkuo MukaiMasami Ochiai
    • C08L33/14
    • G02B1/10C08L63/10C09D7/48G03F7/027G03F7/029
    • Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product.The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from α-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.0 parts by mass based on 100 parts by mass of the component (A); and a content of the component (C) is 0.01 to 1 part by mass based on 100 parts by mass of the component (A).
    • 本发明提供能够快速固化的光敏树脂组合物,并提供在400〜780nm的可见光和耐热可靠性的透明性优异的光固化物中,感光性树脂清漆,感光性树脂膜和 感光性树脂固化物。 感光性树脂组合物包含(A)可聚合化合物,(B)聚合引发剂和(C)受阻酚基抗氧化剂,其中(B-1)选自α-羟基苯乙酮基光引发剂和糖基酯基光引发剂中的至少一种 和(B-2)作为组分(B)的氧化膦基光引发剂; 成分(C)是在同一芳环上具有分子中至少一个具有甲基和叔丁基一个基团的至少一个苯酚基的受阻酚基抗氧化剂; 相对于成分(A)100质量份,成分(B)的含量为0.02〜4.0质量份。 相对于100质量份的成分(A),成分(C)的含量为0.01〜1质量份。
    • 30. 发明申请
    • NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME
    • 新型含硅聚合物聚酰胺树脂,聚酰胺树脂及其制造方法
    • US20130158225A1
    • 2013-06-20
    • US13583727
    • 2011-04-13
    • Tooru KikuchiToshihiko TakasakiKatsuyuki Masuda
    • Tooru KikuchiToshihiko TakasakiKatsuyuki Masuda
    • C08G73/10C08G69/42
    • C08G73/106C08G69/42C08G73/105C08G73/1075C08G73/1078C08G77/455
    • A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
    • 包含由式(1)表示的重复单元的聚酰亚胺树脂:其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数, 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型,和包含由式(2)表示的重复单元的聚酰胺酸树脂:其中R是二胺残基; m为2〜30的整数, 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的酰胺基和羧基中的任一个相对于降冰片烷环具有外部构型。 聚酰亚胺树脂可溶于通用溶剂,透明度高,分子量高,机械性能优异,拉伸强度和伸长率优异。