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21. 发明申请

US20100065963A1 METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT 审中-公开
标题翻译：使用电线的毛细管内的气体流动的方法
公开(公告)号：US20100065963A1
公开(公告)日：2010-03-18
申请号：US12500495
申请日：2009-07-09
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01L23/48
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/13 , H01L23/49811 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/013 , H01L2924/00013
摘要： Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.
摘要翻译：可以形成各种电子部件的接触结构以具有主要的弹性特性。接触结构可以是独立的，并且可以耦合到各种不同的电子部件，例如探针卡组件，半导体晶片或管芯，插入件等。接触结构的提示可以具有设备与另一电子部件接触的拓扑。

22. 发明授权

US07142000B2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology 失效
标题翻译：在半导体器件上安装弹簧元件，以及晶圆级测试方法
公开(公告)号：US07142000B2
公开(公告)日：2006-11-28
申请号：US10673686
申请日：2003-09-29
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： G01R31/28 , G01R1/073
CPC分类号： H05K7/1069 , B23K1/0008 , B23K20/004 , B23K2101/40 , C23C18/1605 , C23C18/165 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R31/2856 , G01R31/2863 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/49811 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/94 , H01L25/0652 , H01L25/16 , H01L2223/54453 , H01L2224/02311 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45572 , H01L2224/45599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/83851 , H01L2224/85201 , H01L2224/85205 , H01L2224/90 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/20104 , H01L2924/20105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10S977/712 , Y10S977/723 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , Y10T29/49171 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49812 , Y10T428/12396 , Y10T428/12528 , H01L2224/13099 , H01L2924/00 , H01L2224/48824 , H01L2224/48744 , H01L2224/29099 , H01L2224/29075 , H01L2224/85399
摘要： Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.
摘要翻译：弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

23. 发明授权

US06482013B2 Microelectronic spring contact element and electronic component having a plurality of spring contact elements 失效
标题翻译：微电子弹簧接触元件和具有多个弹簧接触元件的电子部件
公开(公告)号：US06482013B2
公开(公告)日：2002-11-19
申请号：US08802054
申请日：1997-02-18
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R1200
CPC分类号： G01R3/00 , B23K20/004 , B23K2101/38 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D7/123 , C25D21/02 , G01R1/06727 , G01R1/06744 , G01R31/2884 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/4951 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/05001 , H01L2224/05023 , H01L2224/05548 , H01L2224/1134 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/4554 , H01L2224/456 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85043 , H01L2224/851 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R12/57 , H05K1/141 , H05K3/24 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/4015 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2224/13099 , H01L2924/00 , H01L2224/48 , H01L2224/05599 , H01L2224/05099
摘要： Spring contact elements having a base end portion, a contact end portion, and a central body portion. In a first embodiment, the spring contact elements provide for movement of a majority of the spring contact element characterized by a first spring constant. As the force and deflection increase, the movement of a rearward portion of the spring contact element will stop when a portion of the contact element abuts a portion of its mounting member while the movement of a forward portion will continue with a second and different spring constant. In a second embodiment, the spring contact elements include additional conductive and insulating layers formed about the contact element for controlling the impedance of the spring contact element throughout its range of motion. The additional conductive layer may be connected to ground. The spring contact elements may, in turn, be mounted on an electronic component, such as a space transformer or a semiconductor device to form a probe card assembly for effecting highly uniform pressure connections to corresponding terminals on another electronic component.
摘要翻译：具有基端部分，接触端部分和中心体部分的弹簧接触元件。在第一实施例中，弹簧接触元件提供弹簧接触元件的大部分的运动，其特征在于第一弹簧常数。当力和偏转增加时，当接触元件的一部分抵靠其安装构件的一部分时，弹簧接触元件的后部的移动将停止，同时前部的移动将以第二和不同的弹簧常数继续。在第二实施例中，弹簧接触元件包括围绕接触元件形成的额外的导电和绝缘层，用于在整个运动范围内控制弹簧接触元件的阻抗。附加的导电层可以连接到地面。弹簧接触元件又可以安装在诸如空间变压器或半导体器件的电子部件上，以形成用于实现与另一电子部件上的相应端子的高度均匀的压力连接的探针卡组件。

24. 发明授权

US06246247B1 Probe card assembly and kit, and methods of using same 有权
标题翻译：探针卡组合和试剂盒，以及使用方法
公开(公告)号：US06246247B1
公开(公告)日：2001-06-12
申请号：US09156957
申请日：1998-09-18
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： G01R1073
CPC分类号： H05K7/1069 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/0675 , G01R1/06761 , G01R1/07342 , G01R1/07378 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/05001 , H01L2224/05023 , H01L2224/05085 , H01L2224/05556 , H01L2224/05568 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49211 , Y10T29/49213 , Y10T29/49222 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20757 , H01L2224/05599
摘要： A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly thereto (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
摘要翻译：探针卡组件包括探针卡，具有直接安装在其上的弹性接触结构（探针元件）的空间变换器（即，不需要额外的连接线等）并且从其表面上的端子延伸出来，并且插入器空间变压器和探针卡之间。空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

25. 发明授权

US5884398A Mounting spring elements on semiconductor devices 失效
标题翻译：在半导体器件上安装弹簧元件
公开(公告)号：US5884398A
公开(公告)日：1999-03-23
申请号：US839760
申请日：1997-04-15
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H01R9/00
CPC分类号： B23K20/004 , B23K20/007 , C25D7/12 , G01R31/2884 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H05K3/326 , H05K3/4015 , B23K2201/40 , C25D21/02 , C25D5/08 , C25D5/22 , G01R31/2886 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L24/49 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K3/20 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y10T29/49144 , Y10T29/49149
摘要： Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
摘要翻译：弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

26. 发明申请

US20110057018A1 METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT 失效
公开(公告)号：US20110057018A1
公开(公告)日：2011-03-10
申请号：US12942709
申请日：2010-11-09
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/13 , H01L23/49811 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/013 , H01L2924/00013
摘要： Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

27. 发明申请

US20100093229A1 MICROELECTRONIC CONTACT STRUCTURE AND METHOD OF MAKING SAME 有权
标题翻译：微电子接触结构及其制造方法
公开(公告)号：US20100093229A1
公开(公告)日：2010-04-15
申请号：US12577444
申请日：2009-10-12
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R4/48
CPC分类号： G01R1/06727 , G01R1/06738 , H01L21/6835 , H01L2221/68359 , H01L2224/11003 , H01L2224/111 , H01L2224/11826 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13565 , H01L2224/13582 , H01L2224/819 , H01L2924/01019 , H01L2924/01074 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

28. 发明申请

US20080272794A1 METHOD OF MANUFACTURING A PROBE CARD 有权
标题翻译：制作探针卡的方法
公开(公告)号：US20080272794A1
公开(公告)日：2008-11-06
申请号：US12173695
申请日：2008-07-15
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R1/073
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

29. 发明授权

US07168162B2 Method of manufacturing a probe card 失效
标题翻译：探针卡的制造方法
公开(公告)号：US07168162B2
公开(公告)日：2007-01-30
申请号：US10823437
申请日：2004-04-12
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H01R9/00
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

30. 发明授权

US07073254B2 Method for mounting a plurality of spring contact elements 失效
标题翻译：用于安装多个弹簧接触元件的方法
公开(公告)号：US07073254B2
公开(公告)日：2006-07-11
申请号：US09753310
申请日：2000-12-29
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H05K3/00
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

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