会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 27. 发明授权
    • Method for fabricating a memory cell
    • 用于制造存储单元的方法
    • US06399433B2
    • 2002-06-04
    • US09773218
    • 2001-01-31
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • H01L218242
    • H01L27/10852H01L27/10817H01L28/55
    • A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
    • 一种存储单元的制造方法包括在半导体本体上形成多晶硅层,该多晶硅层具有设置在第一平面中的至少一个选择晶体管。 在层的两个相邻结构之间形成间隙,并且该层的相邻结构之一被放置在第一硅插头的表面上。 在该间隙中形成单元板电极,并在该层中形成沟槽。 沟槽达到第一插头表面的最远处,并且填充有绝缘层。 该层被删除。 形成具有高ε或铁电介质的存储电容器和存储节点电极。 电容器设置在身体内和上方的第二平面内。 绝缘层被硅替代以形成直接连接到第一插头的第二硅插头。 第二插头电连接到存储节点电极,第一平面通过第一和第二插头电连接到第二平面。
    • 29. 发明授权
    • Manufacturing method for an integrated semiconductor structure
    • 集成半导体结构的制造方法
    • US07595262B2
    • 2009-09-29
    • US11588591
    • 2006-10-27
    • Till Schlösser
    • Till Schlösser
    • H01L21/3205H01L21/4763H01L21/8236H01L21/8234H01L21/8242H01L21/336H01L21/44H01L21/28
    • H01L27/10894H01L27/10882H01L27/10891
    • A manufacturing method for an integrated semiconductor structure and a corresponding semiconductor structure is disclosed. The method includes forming a peripheral circuitry in a peripheral device region, wherein the peripheral circuitry includes a peripheral transistor at least partially formed in the semiconductor substrate and having a first gate dielectric formed in a first high temperature process step. The method further includes forming a plurality of memory cells in a memory cell region, each of said memory cells including an access transistor at least partially formed in a semiconductor substrate and having a second gate dielectric formed in a second high temperature process step and having a metallic gate conductor. The first and second high temperature process steps are performed before a step of forming the metallic gate conductor.
    • 公开了一种用于集成半导体结构和相应的半导体结构的制造方法。 该方法包括在外围设备区域中形成外围电路,其中外围电路包括至少部分地形成在半导体衬底中并具有在第一高温工艺步骤中形成的第一栅极电介质的外围晶体管。 该方法还包括在存储器单元区域中形成多个存储单元,每个存储单元包括至少部分地形成在半导体衬底中并具有在第二高温工艺步骤中形成的第二栅电介质的存取晶体管, 金属栅极导体。 第一和第二高温工艺步骤在形成金属栅极导体的步骤之前进行。
    • 30. 发明授权
    • Arrangement with image sensors
    • 图像传感器布置
    • US07030434B1
    • 2006-04-18
    • US10089570
    • 2000-09-28
    • Wolfgang KrautschneiderHeribert GeibFranz HofmannTill Schlösser
    • Wolfgang KrautschneiderHeribert GeibFranz HofmannTill Schlösser
    • H01L31/062H01L31/113
    • H01L27/14609
    • A memory transistor and a selection transistor of an image sensor are connected in series and between a bit line (B5) and a reference line (R5). A gate electrode of the selection transistor is connected to a word line (W5), which extends crosswise in relation to the bit line (B5). A diode of the image sensor is switched between a gate electrode (G5) of the memory transistor and a first source/drain area (S/D5) of the memory transistor, which is connected to the selection transistor in such a way is polarized towards the first source/drain area (S/D5) of the memory transistor and in the reverse direction. A photodiode of the image sensor is switched between a voltage connection and either the gate electrode (G5) of the memory transistor or the first source/drain area (S/D5) of the memory transistor in such a way that it is polarized towards the voltage connection and in the reverse direction.
    • 图像传感器的存储晶体管和选择晶体管串联连接在位线(B 5)和基准线(R 5)之间。 选择晶体管的栅电极连接到相对于位线(B 5)横向延伸的字线(W 5)。 图像传感器的二极管在存储晶体管的栅电极(G 5)和存储晶体管的第一源极/漏极区域(S / D 5)之间切换,以这样的方式连接到选择晶体管 朝向存储晶体管的第一源极/漏极区域(S / D 5)偏振并且沿相反方向偏振。 图像传感器的光电二极管在存储晶体管的栅电极(G 5)或存储晶体管的第一源/漏区(S / D 5)的电压连接和栅极之间切换,使得其被极化 朝向电压连接和相反方向。