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    • 23. 发明授权
    • Process for manufacturing semiconductor memory device having floating and control gates in which multiple insulating films are formed over floating gates
    • 具有浮置和控制栅极的半导体存储器件的制造方法,其中在浮栅上形成多个绝缘膜
    • US06589844B2
    • 2003-07-08
    • US10153728
    • 2002-05-24
    • Takuji Tanigami
    • Takuji Tanigami
    • H01L29788
    • H01L27/11521H01L27/115
    • A process for manufacturing a semiconductor memory device comprises the steps of: (a) forming a tunnel oxide film, a first (1st) conductive film to be a lower floating gate, a 1st insulating film and a second (2nd) insulating film in this order on a semiconductor substrate and patterning the 2nd insulating film, the 1st insulating film, the 1st conductive film and the tunnel oxide film into a desired configuration; (b) forming a third (3rd) insulating film on the entire surface of the resulting substrate; (c) reducing the 3rd insulating film until the 2nd insulating film is exposed; (d) removing the 2nd insulating film; (e) removing the 1st insulating film while further reducing the 3rd insulating film; (f) forming a 2nd conductive film to be an upper floating gate on the 1st conductive film and the 3rd insulating film; (g) flattening the 2nd conductive film until the 3rd insulating film is exposed; and (h) forming an interlayer capacitance film and a 3rd conductive film to be a control gate on the 2nd conductive film and the 3rd insulating film, and patterning the 3rd conductive film, the interlayer capacitance film, the 2nd conductive film and the 1st conductive film to form a floating gate and the control gate.
    • 一种制造半导体存储器件的方法包括以下步骤:(a)在其中形成隧道氧化物膜,第一(第一)导电膜作为下浮动栅极,第一绝缘膜和第二绝缘膜(第二绝缘膜) 将第二绝缘膜,第一绝缘膜,第一导电膜和隧道氧化物膜图案化成期望的构造; (b)在所得基板的整个表面上形成第三(第三)绝缘膜; (c)减少第三绝缘膜,直到暴露第二绝缘膜; (d)除去第二绝缘膜; (e)在进一步减少第三绝缘膜的同时去除第一绝缘膜; (f)在第一导电膜和第三绝缘膜上形成第二导电膜作为上浮置栅; (g)使第二导电膜平坦化,直到暴露第三绝缘膜; 和(h)在第二导电膜和第三绝缘膜上形成层间电容膜和第三导电膜作为控制栅极,并且对第三导电膜,层间电容膜,第二导电膜和第一导电膜 电影形成一个浮动门和控制门。
    • 24. 发明授权
    • Process for manufacturing semiconductor device
    • 半导体器件制造工艺
    • US06544843B2
    • 2003-04-08
    • US09738637
    • 2000-12-18
    • Takuji Tanigami
    • Takuji Tanigami
    • H01L21336
    • H01L27/11521G11C16/0491H01L21/76819H01L27/115
    • A process for manufacturing a semiconductor device forming a plurality of protrusions with different widths so that a recess between adjacent protrusions has a predetermined width on a semiconductor substrate and thereafter forming an insulating layer for element isolation in the recess, wherein the insulating layer for element isolation is formed by the steps of: (A) filling an insulating film for forming the insulating layer for element isolation in the recess to a higher level than top surfaces of the protrusions; (B) removing the insulating film at least from a top surface of a narrow protrusion and etching back the insulating film in the recess to a level lower than the top surface of the narrow protrusion, thereby exposing the top surface and a side face of the narrow protrusion and a side face and a part of a top face next to the side face of a wide protrusion; and (C) forming a mask to cover the exposed top surfaces and side faces of the protrusions and the top surface of the insulating film in the recess, removing the insulating film remaining from the top surface of the wide protrusion, and removing the mask, thereby forming the insulating layer for element isolation in the recess.
    • 一种用于制造形成具有不同宽度的多个突起的半导体器件的方法,使得相邻突起之间的凹部在半导体衬底上具有预定宽度,然后在凹部中形成用于元件隔离的绝缘层,其中用于元件隔离的绝缘层 通过以下步骤形成:(A)将用于在凹部中形成用于元件隔离的绝缘层的绝缘膜填充到比突起的顶表面更高的水平;(B)至少从顶表面去除绝缘膜, 一个狭窄的突出部分并且将凹陷中的绝缘膜蚀刻回到比该窄突起的顶表面低的水平面上,从而暴露该窄突起的顶表面和一个侧面以及一顶面的一个侧面和一部分 到广泛突起的侧面; 和(C)形成掩模以覆盖突出部的暴露的顶表面和侧面以及凹部中的绝缘膜的顶表面,去除从宽突起的顶表面残留的绝缘膜,并且去除掩模, 从而在凹部中形成用于元件隔离的绝缘层。
    • 25. 发明授权
    • Writing method for nonvolatile semiconductor memory with soft-write
repair for over-erased cells
    • 非易失性半导体存储器的写入方法,具有用于超擦除单元的软写修复
    • US5742541A
    • 1998-04-21
    • US580515
    • 1995-12-28
    • Takuji TanigamiShinichi Sato
    • Takuji TanigamiShinichi Sato
    • G11C17/00G11C16/04G11C16/10G11C16/14G11C16/34
    • G11C16/3409G11C16/0416G11C16/10G11C16/14G11C16/3404
    • A non-volatile semiconductor memory includes a plurality of memory cells. Each memory cell includes N-type source and drain regions formed in a P-well on a semiconductor substrate, a floating gate formed on the P-well with a tunnel oxide film therebetween, and a control gate formed on the floating gate with an interpoly dielectric film therebetween. The memory has a plurality of bit lines, a plurality of word lines and a source line. The source region of each memory cell is connected to the source line. The drain region of each memory cell is connected to one of the word lines. The memory cell is written to, erased, or read by selectively supplying suitable voltages to the source, bit, and word lines connected thereto. When a selected memory cell is written to by injection electrons into its floating gate, (1) a negative voltage is applied to the P-well and the source line, (2) a first positive voltage is applied to the selected bit line, (3) a second positive voltage is applied to the selected word line, and (4) OV is applied to the non-selected word line. The second positive voltage applied to the control gate is lower than a predetermined voltage between the source and the control gate.
    • 非易失性半导体存储器包括多个存储单元。 每个存储单元包括形成在半导体衬底上的P阱中的N型源极和漏极区,在P阱上形成有在其间具有隧道氧化物膜的浮置栅极,以及在浮置栅极上形成的具有间隔 电介质膜之间。 存储器具有多个位线,多个字线和源极线。 每个存储单元的源区连接到源极线。 每个存储单元的漏极区域连接到一条字线。 通过向连接到其的源,位和字线选择性地提供合适的电压来将存储单元写入,擦除或读取。 当通过注入电子将选定的存储单元写入其浮动栅极时,(1)向P阱和源极线施加负电压,(2)将第一正电压施加到所选位线, 3)将第二正电压施加到所选字线,并且(4)将OV施加到未选择的字线。 施加到控制栅极的第二正电压低于源极和控制栅极之间的预定电压。
    • 28. 发明授权
    • Process for fabricating a semiconductor device
    • 制造半导体器件的工艺
    • US06395619B2
    • 2002-05-28
    • US09203330
    • 1998-12-02
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • H01L2176
    • H01L21/76229
    • The present invention provides a process for fabricating semiconductor device comprising the steps of: forming an etching-stop layer on a semiconductor substrate; patterning the etching-stop layer so that the etching-stop layer remains in a region to be an active region and is removed from a region to be a device isolation region, followed by forming a trench in the region to be the device isolation region; depositing on the semiconductor substrate an insulating film having a thickness greater than or equal to the depth of the trench; forming a resist pattern having an opening above the etching-stop layer above the active region adjacent to a device isolation region whose width is greater than or equal to a predetermined value, followed by etching the insulating film using the resist pattern as a mask; and polishing the insulating film existing on the resulting semiconductor substrate for flattening after removing the resist pattern.
    • 本发明提供一种制造半导体器件的方法,包括以下步骤:在半导体衬底上形成蚀刻停止层; 图案化蚀刻停止层,使得蚀刻停止层保持在作为有源区的区域中,并从作为器件隔离区的区域去除,然后在该区域中形成作为器件隔离区的沟槽; 在半导体衬底上沉积厚度大于或等于沟槽深度的绝缘膜; 形成抗蚀剂图案,其具有在与宽度大于或等于预定值的器件隔离区相邻的有源区上方的蚀刻停止层上方的开口,然后使用抗蚀剂图案作为掩模蚀刻绝缘膜; 并且在除去抗蚀剂图案之后,对存在于所得半导体衬底上的绝缘膜进行抛光以使其变平。
    • 30. 发明授权
    • Semiconductor device with floating gates
    • 具有浮动栅极的半导体器件
    • US06441430B1
    • 2002-08-27
    • US09588761
    • 2000-06-06
    • Takuji Tanigami
    • Takuji Tanigami
    • H01L29788
    • H01L27/11521H01L27/115
    • A semiconductor device including a plurality of floating gates where each floating gate includes a lower floating gate whose sidewalls are substantially vertical to the semiconductor substrate and an upper floating gate having opposing sidewall portions that gradually widen in a convex manner towards the top of the floating gate. The device further includes an interlayer insulating film, and a control gate formed on the insulating film. An insulating film (10) is provided between and contacting adjacent floating gates, and has vertically aligned lower sidewall portions which contact the lower floating gates and curved upper sidewall portions which contact the upper floating gates and gradually narrow toward the top of the insulating film.
    • 一种包括多个浮动栅极的半导体器件,其中每个浮置栅极包括其侧壁基本上垂直于半导体衬底的下部浮置栅极,以及具有相对侧壁部分的上部浮动栅极,所述相对的侧壁部分以凸形方式朝向浮动栅极的顶部逐渐变宽 。 该器件还包括层间绝缘膜和形成在绝缘膜上的控制栅极。 绝缘膜(10)设置在相邻的浮动栅极之间并与之相接触,并且具有垂直对准的下侧壁部分,该下侧壁部分接触下浮动栅极和弯曲的上侧壁部分,该上侧壁部分与上浮动栅极接触,并朝向绝缘膜的顶部逐渐变窄。