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    • 21. 发明授权
    • Integration of damascene type diodes and conductive wires for memory device
    • 集成镶嵌型二极管和导线用于存储器件
    • US08193074B2
    • 2012-06-05
    • US12292620
    • 2008-11-21
    • Yoichiro Tanaka
    • Yoichiro Tanaka
    • H01L21/326
    • H01L27/1021
    • A method of making a semiconductor device includes forming a first conductivity type polysilicon layer over a substrate, forming an insulating layer over the first conductivity type polysilicon layer, where the insulating layer comprises an opening exposing the first conductivity type polysilicon layer, and forming an intrinsic polysilicon layer in the opening over the first conductivity type polysilicon layer. A nonvolatile memory device contains a first electrode, a steering element located in electrical contact with the first electrode, a storage element having a U-shape cross sectional shape located over the steering element, and a second electrode located in electrical contact with the storage element.
    • 制造半导体器件的方法包括在衬底上形成第一导电型多晶硅层,在第一导电型多晶硅层上形成绝缘层,其中绝缘层包括暴露第一导电型多晶硅层的开口,并形成内在的 在第一导电型多晶硅层的开口中的多晶硅层。 非易失性存储器件包括第一电极,与第一电极电接触的操作元件,位于操舵元件上方的具有U形横截面形状的存储元件,以及与存储元件电接触的第二电极 。
    • 22. 发明授权
    • Liner for tungsten/silicon dioxide interface in memory
    • 内存中用于钨/二氧化硅界面的衬垫
    • US08071475B2
    • 2011-12-06
    • US11863734
    • 2007-09-28
    • Yoichiro TanakaSteven J. RadiganUsha Raghuram
    • Yoichiro TanakaSteven J. RadiganUsha Raghuram
    • H01L21/44
    • H01L27/101H01L27/1021
    • A semiconductor wafer assembly includes a base of dielectric. A layer of silicon is deposited thereover. A metal hard mask is deposited over the silicon. A dielectric hard mask is deposited over the metal hard mask. Photoresist is deposited over the dielectric hard mask, whereby a plurality of sacrificial columns is formed from the layer of metal hard mask through the photoresist such that the sacrificial columns extend out from the silicon layer. An interface layer is disposed between the layer of conductive material and the layer of hard mask to enhance adhesion between each of the plurality of sacrificial columns and the layer of conductive material to optimize the formation of junction diodes out of the silicon by preventing the plurality of sacrificial columns from being detached from the layer of silicon prematurely due to the sacrificial columns peeling or falling off.
    • 半导体晶片组件包括电介质基体。 一层硅沉积在其上。 金属硬掩模沉积在硅上。 电介质硬掩模沉积在金属硬掩模上。 光致抗蚀剂沉积在电介质硬掩模上,由此通过光致抗蚀剂从金属硬掩模层形成多个牺牲柱,使得牺牲柱从硅层延伸出来。 界面层设置在导电材料层和硬掩模层之间,以增强多个牺牲柱和导电材料层之间的粘附力,以通过防止多个 牺牲柱由于牺牲柱脱落或脱落而过早地与硅层分离。
    • 24. 发明申请
    • Integration of damascene type diodes and conductive wires for memory device
    • 集成镶嵌型二极管和导线用于存储器件
    • US20100127358A1
    • 2010-05-27
    • US12292620
    • 2008-11-21
    • Yoichiro Tanaka
    • Yoichiro Tanaka
    • H01L21/329H01L29/868
    • H01L27/1021
    • A method of making a semiconductor device includes forming a first conductivity type polysilicon layer over a substrate, forming an insulating layer over the first conductivity type polysilicon layer, where the insulating layer comprises an opening exposing the first conductivity type polysilicon layer, and forming an intrinsic polysilicon layer in the opening over the first conductivity type polysilicon layer. A nonvolatile memory device contains a first electrode, a steering element located in electrical contact with the first electrode, a storage element having a U-shape cross sectional shape located over the steering element, and a second electrode located in electrical contact with the storage element.
    • 制造半导体器件的方法包括在衬底上形成第一导电型多晶硅层,在第一导电型多晶硅层上形成绝缘层,其中绝缘层包括暴露第一导电型多晶硅层的开口,并形成内在的 在第一导电型多晶硅层的开口中的多晶硅层。 非易失性存储器件包括第一电极,与第一电极电接触的操作元件,位于操舵元件上方的具有U形横截面形状的存储元件,以及与存储元件电接触的第二电极 。