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21. 发明授权

US07947343B2 Adhesive film 失效
标题翻译：胶粘膜
公开(公告)号：US07947343B2
公开(公告)日：2011-05-24
申请号：US12224097
申请日：2006-02-27
申请人： Toyosei Takahashi
发明人： Toyosei Takahashi
IPC分类号： C09D163/02 , C09D4/02
CPC分类号： H01L23/10 , C09J7/10 , C09J2205/102 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , Y10T428/1059 , Y10T428/1073 , H01L2924/00 , H01L2924/3512
摘要： An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m2·24 h] or above, wherein the curable resin preferably contains photo-curable resin, thermosetting resin, or curable resin cured both by light and heat. The filler preferably contains a porous filler, the filler preferably has a mean void diameter of 0.1 to 5 nm, and the adhesive film preferably shows a water vapor transmission rate at 25° C. of 4 [g/m2·24 h] or above.
摘要翻译：一种用于将半导体部件或液晶显示部件与基板接合的粘合膜，所述粘合膜由含有固化性树脂和填料的树脂组合物构成，所述粘合膜的水蒸汽透过率为30 [g / m2·24h]以上，其中，所述固化性树脂优选含有通过光和热固化的光固化性树脂，热固性树脂或固化性树脂。填料优选含有多孔填料，填料优选具有0.1〜5nm的平均空隙直径，粘合膜优选在25℃下的水蒸气透过率为4 [g / m 2·24h]以上。

22. 发明申请

US20100297439A1 PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE 审中-公开
标题翻译：光敏胶粘剂组合物，胶粘膜和收光装置
公开(公告)号：US20100297439A1
公开(公告)日：2010-11-25
申请号：US12599685
申请日：2008-05-27
申请人： Rie Takayama , Toyosei Takahashi
发明人： Rie Takayama , Toyosei Takahashi
IPC分类号： G03F7/004 , B32B7/12 , B32B27/00
CPC分类号： G03F7/0388 , C08L63/00 , C08L2666/22 , C09J4/00 , C09J7/35 , C09J163/00 , C09J163/10 , C09J2205/31 , C09J2461/00 , G03F7/027 , G03F7/40 , Y10T428/2809 , Y10T428/31935 , C08F220/30
摘要： A photosensitive adhesive resin composition includes (A) a compound having a hydroxyl group or a carboxyl group, and a (meth)acryloyl group, (B) a resin which cures with the compound (A) by thermal treatment, (C) a compound having a (meth)acryloyl group and not having a hydroxyl group and a carboxyl group, (D) a phenol resin or a phenol compound, and (E) a photoactive compound. The photosensitive adhesive resin composition has excellent developability, and is used for producing a spacer formed between a transparent substrate and a substrate on which a semiconductor element is formed. An adhesive film and a light-receiving device are produced using the photosensitive adhesive resin composition.
摘要翻译：感光性粘合剂树脂组合物包含（A）具有羟基或羧基的化合物和（甲基）丙烯酰基，（B）通过热处理与化合物（A）固化的树脂，（C）化合物具有（甲基）丙烯酰基且不具有羟基和羧基的化合物，（D）酚醛树脂或酚化合物，和（E）光活性化合物。感光性粘合剂树脂组合物具有优异的显影性，并且用于制造在透明基板和形成有半导体元件的基板之间形成的间隔物。使用该感光性粘接性树脂组合物制造粘合膜和受光装置。

23. 发明申请

US20100193122A1 PROCESS FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：制造电子设备的方法
公开(公告)号：US20100193122A1
公开(公告)日：2010-08-05
申请号：US12665130
申请日：2008-06-16
申请人： Toyosei Takahashi , Rie Takayama
发明人： Toyosei Takahashi , Rie Takayama
IPC分类号： B29C65/14
CPC分类号： H01L31/18 , H01L24/94 , H01L27/14618 , H01L31/0203 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102
摘要： There is provided a process for manufacturing an electronic device, comprising an electronic component (a light receiving unit 11 and a base substrate 12 on which is placed the light receiving unit 11) and a substrate (a transparent substrate 13) which face each other and an adhesion layer 15, which bonds the electronic component to the substrate, containing a resin composition containing a photocurable resin, comprising forming the resin composition constituting the adhesion layer on the substrate or the electronic component; selectively exposing the resin composition with a light and developing the resin composition to form the frame-shaped adhesion layer in a predetermined region; placing the adhesion layer between the electronic component and the substrate; heating the electronic component, the substrate and the adhesion layer to a predetermined temperature, in the course of which the electronic component and the substrate are pressure-bonded through the adhesion layer; maintaining the pressure-bonding state of the electronic component, the substrate and the adhesion layer at the predetermined temperature; and cooling the electronic component, the substrate and the adhesion layer.
摘要翻译：提供了一种用于制造电子设备的方法，包括电子部件（光接收单元11和其上放置有光接收单元11的基板12）和彼此面对的基板（透明基板13）将包含含有光固化性树脂的树脂组合物的电子部件与基板接合的粘合层15，其包括在基板或电子部件上形成构成粘合层的树脂组合物; 选择性地曝光树脂组合物并显影树脂组合物以在预定区域形成框状粘合层; 将粘合层放置在电子部件和基板之间; 将电子部件，基板和粘合层加热至预定温度，电子部件和基板通过粘合层进行压力粘合; 将电子部件，基板和粘合层的压接状态维持在预定温度; 并冷却电子部件，基板和粘附层。

24. 发明申请

US20110008611A1 PHOTOSENSITIVE RESIN COMPOSITION, FILM FOR PHOTOSENSITIVE RESIN SPACER, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：感光树脂组合物，感光树脂隔膜膜和半导体器件
公开(公告)号：US20110008611A1
公开(公告)日：2011-01-13
申请号：US12920208
申请日：2009-03-16
申请人： Fumihiro Shiraishi , Toyosei Takahashi
发明人： Fumihiro Shiraishi , Toyosei Takahashi
IPC分类号： B32B5/16 , G03F7/004
CPC分类号： G03F7/0047 , G03F7/038 , Y10T428/25
摘要： Disclosed is a photosensitive resin composition which is used as a photosensitive resin spacer for forming a cavity section between a substrate and a semiconductor element, including (A) an alkali-soluble resin, (B) a photopolymerizable resin, (C) a filler and (D) a photosensitizing agent, wherein the average particle diameter of said filler is in the range of 5 to 25 nm and the content of said filler is in the range of 1 to 15 weight %. Also disclosed is a film for a photosensitive resin spacer which is composed of the photosensitive resin composition described above.
摘要翻译：公开了一种感光性树脂组合物，其用作在基材和半导体元件之间形成空腔部分的感光性树脂间隔物，其包含（A）碱溶性树脂，（B）光聚合性树脂，（C）填料和（D）光敏剂，其中所述填料的平均粒径在5至25nm的范围内，并且所述填料的含量在1至15重量％的范围内。还公开了由上述感光性树脂组合物构成的感光性树脂间隔物用膜。

25. 发明申请

US20100181684A1 RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE 失效
标题翻译：树脂组合物，填充材料，绝缘层和半导体器件
公开(公告)号：US20100181684A1
公开(公告)日：2010-07-22
申请号：US12664003
申请日：2008-06-11
申请人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
发明人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
IPC分类号： H01L23/48 , C08L1/00 , C08L75/00 , C08L67/00 , B32B3/10
CPC分类号： C08L63/10 , H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , Y10T428/24273 , H01L2924/014
摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.
摘要翻译：本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。本发明的填充材料由上述树脂组合物的固化物形成。本发明的绝缘层由上述树脂组合物的固化物形成。绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。本发明的半导体器件包括上述绝缘层。

26. 发明授权

US06768197B2 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device 有权
标题翻译：硬化助焊剂，抗焊剂，通过硬化助焊剂增强的半导体封装，半导体器件和半导体封装和半导体器件的制造方法
公开(公告)号：US06768197B2
公开(公告)日：2004-07-27
申请号：US10168645
申请日：2002-06-24
申请人： Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
发明人： Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
IPC分类号： H01I2348
CPC分类号： H01L24/81 , B23K35/224 , B23K35/3612 , B23K35/3613 , H01L21/563 , H01L2224/13111 , H01L2224/73203 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01059 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H05K3/284 , H05K3/3489 , H01L2224/0401
摘要： A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.

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