专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US06969907B2 Cooling structure for multichip module 有权
标题翻译：多芯片模块的冷却结构
公开(公告)号：US06969907B2
公开(公告)日：2005-11-29
申请号：US10262865
申请日：2002-10-03
申请人： Makoto Imai , Naoki Ogawa , Yuji Yagi , Takashi Kojima , Yasushi Yamada
发明人： Makoto Imai , Naoki Ogawa , Yuji Yagi , Takashi Kojima , Yasushi Yamada
IPC分类号： H01L23/36 , H01L23/367 , H01L25/07 , H01L23/34 , H01L23/02 , H01L23/28 , H01L23/38 , H01L23/40
CPC分类号： H01L23/3672 , H01L25/072 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , Y10S257/93 , H01L2924/00
摘要： A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.
摘要翻译：第一电子装置，比第一电气装置产生的热量少的第二电子装置和电极通过由具有高导热性的导电材料形成的热平衡板连接。散热板设置在安装有第一和第二电子设备的绝缘基板的下方。第二电子设备被延伸穿过绝缘基板和散热板的热辐射路径和通过第二电子设备和电极延伸到散热板的散热路径来冷却。第一和第二电子装置由于通过热平整板的热辐射而具有基本相同的温度。结果，可以提高电子设备的冷却效果。

22. 发明申请

US20050080835A1 Semiconductor circuit for arithmetic processing and arithmetic processing method 失效
标题翻译：用于算术处理和算术处理方法的半导体电路
公开(公告)号：US20050080835A1
公开(公告)日：2005-04-14
申请号：US10641788
申请日：2003-08-15
申请人： Tadahiro Ohmi , Makoto Imai , Toshiyuki Nozawa , Masanori Fujibayashi , Koji Kotani , Tadashi Shibata , Takahisa Nitta
发明人： Tadahiro Ohmi , Makoto Imai , Toshiyuki Nozawa , Masanori Fujibayashi , Koji Kotani , Tadashi Shibata , Takahisa Nitta
IPC分类号： G06F7/00 , G06F7/48 , G06F7/50 , G06F7/506
CPC分类号： G06F7/4824 , G06F7/506
摘要： There is provided a semiconductor circuit for arithmetic processing and an arithmetic processing method that can increase the rate of processing data and reduces the area of a circuit by suppressing wasteful processing. There is provided a computing unit for computing input data, and this computing unit computes input digit data within a computation time unit and outputs a computation result representing a result obtained by the computation, and if a carry is generated in the computation a computation circuit (adders 1-3) for outputting carry data representing this carry, and delay means (memory 4) for delaying the computation result from the computation circuit by one computation time unit, are provided.
摘要翻译：提供了一种用于算术处理的半导体电路和运算处理方法，其可以通过抑制浪费处理来增加处理数据的速率并减小电路的面积。提供了一种用于计算输入数据的计算单元，该计算单元在计算时间单位内计算输入数字数据，并输出表示通过计算获得的结果的计算结果，并且如果在计算中产生进位，则计算电路用于输出表示该进位的进位数据的加法器1-3）和用于将来自计算电路的计算结果延迟一个计算时间单位的延迟装置（存储器4）。

23. 发明授权

US09437520B2 Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed 有权
标题翻译：半导体器件包括半导体元件和固定元件，半导体元件被固定到该半导体元件
公开(公告)号：US09437520B2
公开(公告)日：2016-09-06
申请号：US14774444
申请日：2013-03-13
申请人： Norimune Orimoto , Makoto Imai
发明人： Norimune Orimoto , Makoto Imai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/00 , H01L23/13
CPC分类号： H01L23/3675 , H01L23/13 , H01L23/36 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/29036 , H01L2224/291 , H01L2224/32014 , H01L2224/32113 , H01L2224/32245 , H01L2224/83129 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83444 , H01L2224/83455 , H01L2224/83815 , H01L2924/10161 , H01L2924/10272 , H01L2924/13055 , H01L2924/13091 , H01L2924/15159 , H01L2924/15165 , H01L2924/351 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member. At least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.
摘要翻译：半导体器件包括在平面图中具有矩形形状的半导体元件和固定半导体元件的固定元件。半导体元件设置成使得半导体元件的矩形面朝向固定构件的表面。半导体元件的矩形面的一部分固定在固定部件的表面上。半导体元件的矩形面的至少角部不固定到固定部件的表面。

24. 发明授权

US09084295B2 Electromagnetic cooking device 有权
标题翻译：电磁烹饪装置
公开(公告)号：US09084295B2
公开(公告)日：2015-07-14
申请号：US13119908
申请日：2009-03-25
申请人： Hideki Sadakata , Atsushi Fujita , Makoto Imai , Yuta Miura , Shinichiro Sumiyoshi
发明人： Hideki Sadakata , Atsushi Fujita , Makoto Imai , Yuta Miura , Shinichiro Sumiyoshi
IPC分类号： H05B6/12 , H05B6/06
CPC分类号： H05B6/062 , H05B2213/03
摘要： An induction heating cooker includes a top plate adapted to have an object placed thereon, plural heating coils provided below a lower surface of the top plate, an inverter for supplying high-frequency power to the heating coils, a data memory, and a controller controlling the inverter. The data memory stores first and second heating coil patterns. Each of the first and second heating coil patterns defines one or more heatable regions and one or more non-heatable regions. The controller selects a heating coil pattern from the first and second coil patterns. The controller controls the inverter such that high-frequency power can be supplied to one or more first heating coils out of the plural heating coils located in the one or more heatable regions of the selected heating coil pattern. The controller controls the inverter such that high-frequency power cannot be supplied to one or more second heating coils out of the plural heating coils located in the one or more non-heatable regions of the selected heating coil pattern. This induction heating cooker can adjust at least one of the location, the size, and the number of the heatable regions for induction-heating objects in response to at least one of the location, the size, and the number of the objects to be heated, thereby heating the objects efficiently.
摘要翻译：感应加热烹调器包括适于放置物体的顶板，设置在顶板下表面下方的多个加热线圈，向加热线圈供给高频电力的逆变器，数据存储器和控制器逆变器。数据存储器存储第一和第二加热线圈图案。第一和第二加热线圈图案中的每一个限定一个或多个可加热区域和一个或多个不可加热区域。控制器从第一和第二线圈图案中选择加热线圈图案。控制器控制逆变器，使得可以将高频功率提供给位于所选择的加热线圈图案的一个或多个可加热区域中的多个加热线圈中的一个或多个第一加热线圈。控制器控制逆变器，使得高频功率不能被提供给位于所选择的加热线圈图案的一个或多个不可加热区域中的多个加热线圈中的一个或多个第二加热线圈。该感应加热烹调器可以响应于待加热物体的位置，尺寸和数量中的至少一个来调节用于感应加热物体的可加热区域的位置，尺寸和数量中的至少一个，从而有效地加热物体。

25. 发明授权

US08659150B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08659150B2
公开(公告)日：2014-02-25
申请号：US13554254
申请日：2012-07-20
申请人： Makoto Imai
发明人： Makoto Imai
IPC分类号： H01L23/48
CPC分类号： H01L24/72 , H01L23/045 , H01L23/051 , H01L23/10 , H01L23/32 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/33 , H01L2224/04026 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
摘要： A semiconductor module that can be connected with simple wiring is provided. A semiconductor device of the semiconductor module is provided with a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on a surface of the semiconductor substrate opposite to the one surface. The semiconductor module is provided with a first electrode plate being in contact with the first electrode, a second electrode plate being in contact with the second electrode, and a first wiring member connected to the second electrode plate and penetrating the first electrode plate in a state of being insulated from the first electrode plate. The first electrode plate, the semiconductor device, and the second electrode plate are fixed with each other by an application of a pressure pressurizing the semiconductor device on the first electrode plate and the second electrode plate.
摘要翻译：提供可以与简单布线连接的半导体模块。半导体模块的半导体器件设置有半导体衬底，形成在半导体衬底的一个表面上的第一电极和形成在与该表面相对的半导体衬底的表面上的第二电极。半导体模块设置有与第一电极接触的第一电极板，与第二电极接触的第二电极板和连接到第二电极板并且以一种状态穿透第一电极板的第一配线构件与第一电极板绝缘。第一电极板，半导体器件和第二电极板通过在第一电极板和第二电极板上施加加压半导体器件的压力彼此固定。

26. 发明授权

US08324425B2 Method for producing bicyclic γ-amino acid derivative 有权
标题翻译：双环γ-氨基酸衍生物的制备方法
公开(公告)号：US08324425B2
公开(公告)日：2012-12-04
申请号：US13241933
申请日：2011-09-23
申请人： Yutaka Kitagawa , Makoto Imai
发明人： Yutaka Kitagawa , Makoto Imai
IPC分类号： C07C227/34 , C07C229/32 , A61K31/195 , A61K31/215 , A61P25/04 , A61P43/00
CPC分类号： C07B57/00 , A61K31/195 , A61K31/215 , C07B2200/07 , C07C227/34 , C07C2602/20 , Y02P20/55 , C07C229/32
摘要： Methods for producing compounds having activity as an α2δ ligand are provided.
摘要翻译：提供了具有作为α2δ配体活性的化合物的方法。

27. 发明申请

US20110192838A1 INDUCTIVE HEATING DEVICE 有权
标题翻译：电感加热装置
公开(公告)号：US20110192838A1
公开(公告)日：2011-08-11
申请号：US13123339
申请日：2009-05-13
申请人： Atsushi Fujita , Makoto Imai , Hideki Sadakata , Yuta Miura , Shinichiro Sumiyoshi
发明人： Atsushi Fujita , Makoto Imai , Hideki Sadakata , Yuta Miura , Shinichiro Sumiyoshi
IPC分类号： H05B6/04
CPC分类号： H05B6/062 , H05B2213/05
摘要： Disclosed is an inductive heating device which can lower losses in the device and readily provide cooling, wherein a controller is operated in a first control mode which controls the operation so that a unipolar first switching element and a unipolar second switching element conduct alternately when one of a bipolar third switching element and a bipolar fourth switching element is conducting and the other is disconnected when an aluminum object to be heated is heated, and in a second control mode in which the conduction of the first switching element and the fourth switching element and the conduction of the second switching element and the third switching element alternate when an iron object to be heated is heated.
摘要翻译：公开了一种感应加热装置，其可以降低装置中的损耗并容易地提供冷却，其中控制器以控制操作的第一控制模式操作，使得当单极第一开关元件和单极第二开关元件之一当加热的铝物体被加热时，双极性第三开关元件和双极性第四开关元件导通，另一个断开，并且在第一控制模式中，第一开关元件和第四开关元件以及当被加热的铁物体被加热时，第二开关元件和第三开关元件的导通交替。

28. 发明授权

US07830610B2 Lens, lens unit, and imaging device using the same 有权
标题翻译：透镜，透镜单元和使用其的成像装置
公开(公告)号：US07830610B2
公开(公告)日：2010-11-09
申请号：US12097180
申请日：2006-12-05
申请人： Hiroshi Nishizawa , Makoto Imai
发明人： Hiroshi Nishizawa , Makoto Imai
IPC分类号： G02B3/00
CPC分类号： C03B11/08 , C03B2215/404 , C03B2215/49 , G02B3/04 , G02B7/023 , G02B7/025 , Y02P40/57
摘要： A lens is provided which is configured so that the dimensional accuracy of the lens surface can be evaluated easily and accurately, and the control of the accuracy of the lens can be easily performed. The lens comprises a lens effective part having lens surfaces formed around an optical axis as the center and an edge part in a doughnut shape as viewed in a plan view, which is extended along the outer periphery of the lens effective part. The edge part and the lens effective part are molded simultaneously, and annular indices around the optical axis as the center, with which the dimensional accuracy of the lens surfaces can be detected, are formed on both the surfaces of the edge part.
摘要翻译：提供一种透镜，其被配置为使得可以容易且准确地评估透镜表面的尺寸精度，并且可以容易地执行透镜的精度控制。该透镜包括透镜有效部，该透镜有效部具有以光轴为中心形成的透镜面，以及沿着透镜有效部的外周延伸的俯视图中的圆环形状的边缘部。边缘部分和透镜有效部分同时成型，并且在边缘部分的两个表面上形成以光轴为中心的可以检测透镜表面的尺寸精度的环形折射率。

29. 发明授权

US07768149B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US07768149B2
公开(公告)日：2010-08-03
申请号：US11883486
申请日：2006-03-22
申请人： Makoto Imai , Masaharu Matsui
发明人： Makoto Imai , Masaharu Matsui
IPC分类号： H02J1/00
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2924/13055 , H01L2924/19107 , H02M2001/008 , Y10T307/25 , H01L2924/00014 , H01L2924/00
摘要： Inverter circuits formed of a plurality of power semiconductor devices are stored in a casing of a power module. An output terminal provided at one end side of the casing is connected to one inverter circuit. An output terminal provided at the other end side of the casing is connected to another inverter circuit. An output terminal configured to allow electric connection with an output terminal located at the opposite side by a busbar is further provided at each one end side and the other end side. By disposing the busbar appropriately, output from both inverter circuits can be provided from any of the one end side and the other end side. An output terminal configuration can be realized that allows improvement in the degree of freedom for arrangement and versatility in circuit designing with respect to the position relationship with the electric load.
摘要翻译：由多个功率半导体器件形成的逆变器电路被存储在功率模块的外壳中。设置在壳体的一端侧的输出端子连接到一个逆变器电路。设置在壳体的另一端侧的输出端子连接到另一个逆变器电路。输出端子被配置为允许通过汇流排与位于相对侧的输出端子进行电连接，每一端侧和另一端侧设置有输出端子。通过适当地配置母线，可以从一端侧和另一端侧的任一方设置两个逆变器电路的输出。可以实现输出端子配置，其允许相对于与电负载的位置关系，提高电路设计中的布置自由度和多功能性。

30. 发明申请

US20100172117A1 POWER MODULE 有权
标题翻译：电源模块
公开(公告)号：US20100172117A1
公开(公告)日：2010-07-08
申请号：US12663813
申请日：2008-06-12
申请人： Makoto Imai
发明人： Makoto Imai
IPC分类号： H05K7/02
CPC分类号： H01L25/072 , H01L23/04 , H01L23/473 , H01L24/48 , H01L25/16 , H01L2224/48091 , H01L2224/48108 , H01L2224/48157 , H01L2224/48464 , H01L2924/00014 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a power module capable of welding a snubber capacitor without causing melting damage to a resin housing by welding heat. When leads of a snubber capacitor are respectively welded to upper surfaces of the specific portions of a P-pole bus bar and an N-pole bus bar, the welding heat generated at the specific portions of the P-pole bus bar and the N-pole bus bar is respectively radiated from openings, through which the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar are exposed. As a result, the snubber capacitor can be later appended by welding without causing melting damage to the resin housing due to the welding heat. During welding, a separate cooling head is inserted into the openings to forcibly cool the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar respectively, so that the melting damage to a resin housing can be more reliably avoided.
摘要翻译：提供了能够焊接缓冲电容器而不会通过焊接热而对树脂壳体造成熔融损伤的电力模块。当缓冲电容器的引线分别焊接在P极母线和N极母线的特定部分的上表面时，在P极母线和N极母线的特定部分产生的焊接热，极母线从开口分别辐射，P极母线和N极母线的特定部分的下表面露出。结果，缓冲电容器可以随后通过焊接而附加，而不会由于焊接热而对树脂壳体造成熔融损坏。在焊接过程中，将一个单独的冷却头插入开口，以分别强制地冷却P极汇流条和N极汇流条的特定部分的下表面，使得对树脂外壳的熔化损伤可以更多可靠地避免。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式