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21. 发明申请

US20230090133A1 DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION 有权
公开(公告)号：US20230090133A1
公开(公告)日：2023-03-23
申请号：US17481027
申请日：2021-09-21
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
IPC分类号： G02B6/42 , H01L25/18 , H01L23/00 , H01L25/00
摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

22. 发明申请

US20090004317A1 HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES 审中-公开
标题翻译：用于卷芯片包装的高热导率模塑料
公开(公告)号：US20090004317A1
公开(公告)日：2009-01-01
申请号：US11772200
申请日：2007-06-30
申请人： Xuejiao Hu , Leonel R. Arana , Robert M. Nickerson , Rahul N. Manepalli , Dingying Xu
发明人： Xuejiao Hu , Leonel R. Arana , Robert M. Nickerson , Rahul N. Manepalli , Dingying Xu
IPC分类号： B28B5/00 , C09K5/00
CPC分类号： C09K5/14
摘要： A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K.
摘要翻译：用于集成电路封装的模塑料包括环氧树脂和导热填料。该导热填料包含70％至95％的模塑料，其导热率在10W / m-K至3000W / m-K之间。

23. 发明申请

US20080237843A1 Microelectronic package including thermally conductive sealant between heat spreader and substrate 审中-公开
标题翻译：微电子封装，包括散热器和基板之间的导热密封剂
公开(公告)号：US20080237843A1
公开(公告)日：2008-10-02
申请号：US11729079
申请日：2007-03-27
申请人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
发明人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
IPC分类号： H01L23/367 , H01L21/58
CPC分类号： H01L23/10 , H01L23/04 , H01L2224/73253 , H01L2924/1433
摘要： A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.
摘要翻译：微电子封装。所述包装包括基材; 安装在基板上的管芯; 集成散热器，其安装在基板上，并热耦合到模具的背面; 以及将整体散热器粘合到基底上的密封剂材料，所述密封剂材料具有高于约1W / m /℃的体积热导率，并且弹性模量低于焊料的弹性模量。

24. 发明申请

US20080171249A1 Thermally efficient micromachined device 审中-公开
标题翻译：热效率微加工装置
公开(公告)号：US20080171249A1
公开(公告)日：2008-07-17
申请号：US11890698
申请日：2007-08-07
申请人： Leonel R. Arana , Aleksander J. Franz , Klavs F. Jensen , Samuel B. Schaevitz , Martin A. Schmidt
发明人： Leonel R. Arana , Aleksander J. Franz , Klavs F. Jensen , Samuel B. Schaevitz , Martin A. Schmidt
IPC分类号： H01M8/08 , F28F1/00 , F28F1/20 , C01B3/32 , F25B21/02 , B01J19/24
CPC分类号： B01F5/0618 , B01F13/0059 , B01F2005/0621 , B01F2005/0636 , B01J19/0093 , B01J23/468 , B01J35/04 , B01J2219/00783 , B01J2219/00828 , B01J2219/00835 , B01J2219/0086 , B01J2219/00873 , B01J2219/00889 , B01L3/5027 , B01L2200/14 , B01L2300/1805 , B01L2300/1883 , C01B3/047 , C01B3/323 , C01B3/386 , C01B2203/0233 , C01B2203/0261 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/1223 , C01B2203/1247 , C01B2203/1282 , F28F3/12 , F28F2260/02 , H01M8/04097 , H01M8/04201 , H01M8/0606 , H01M2250/405 , Y02B90/16 , Y02E60/364 , Y02P20/128 , Y02P20/52
摘要： A micromachined device for efficient thermal processing at least one fluid stream includes at least one fluid conducting tube having at least a region with wall thickness of less than 50 μm. The device optionally includes one or more thermally conductive structures in thermal communication with first and second thermally insulating portions of the fluid conducting tube. The device also may include a thermally conductive region, and at least a portion of the fluid conducting tube is disposed within the region. A plurality of structures may be provided projecting from a wall of the fluid conducting tube into an inner volume of the tube. The structures enhance thermal conduction between a fluid within the tube and a wall of the tube. A method for fabricating, from a substrate, a micromachined device for processing a fluid stream allows the selective removal of portions of the substrate to provide desired structures integrated within the device. As an example, the micromachined device may be adapted to efficiently react fluid reactants to produce fuel for a fuel cell associated with the device, resulting in a system capable of conversion of chemical to electrical energy.
摘要翻译：一种用于高效热处理的微加工装置，至少一个流体流包括至少一个具有至少一个壁厚小于50um的区域的流体导管。该装置可选地包括与流体导管的第一和第二绝热部分热连通的一个或多个导热结构。该装置还可以包括导热区域，并且流体导管的至少一部分设置在该区域内。可以设置从流体导管的壁突出到管的内部容积中的多个结构。该结构增强了管内的流体和管的壁之间的热传导。用于从衬底制造用于处理流体流的微加工装置的方法允许选择性地去除衬底的部分以提供集成在装置内的期望的结构。作为示例，微加工装置可以适于有效地使流体反应物反应以产生与装置相关联的燃料电池的燃料，从而产生能够将化学品转化为电能的系统。

25. 发明授权

US07243833B2 Electrically-isolated interconnects and seal rings in packages using a solder preform 有权
标题翻译：使用焊料预制件的封装中的电隔离互连和密封环
公开(公告)号：US07243833B2
公开(公告)日：2007-07-17
申请号：US11174409
申请日：2005-06-30
申请人： Leonel R. Arana , John Heck
发明人： Leonel R. Arana , John Heck
IPC分类号： B23K35/12 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device.
摘要翻译：实施例包括用于形成电子组件的电子组件和方法。一个实施例包括形成MEMS器件组件的方法，包括在衬底上形成有源MEMS区域。形成电耦合到有源MEMS区域的多个接合焊盘。密封环润湿层也形成在衬底上，围绕有源MEMS区域的密封环润湿层。单块焊料预制件位于接合焊盘和密封环润湿层上，单件焊料预制件包括密封环区域和焊盘区域。密封圈区域通过多个焊接桥连接到焊盘区域。该方法还包括将单件焊料预制件加热到高于回流温度的温度，使得桥接器分裂，并且来自预制件的焊料积聚在密封环润湿层和接合焊盘上。盖子与焊料相连。在某些实施例中，盖可以包括其中具有导电材料的通孔，用于提供与MEMS器件的电接触。

26. 发明授权

US07144299B2 Methods and devices for supporting substrates using fluids 失效
标题翻译：使用流体支撑底物的方法和装置
公开(公告)号：US07144299B2
公开(公告)日：2006-12-05
申请号：US11125605
申请日：2005-05-09
申请人： Leonel R. Arana , Terry L. Sterrett , Devendra Natekar
发明人： Leonel R. Arana , Terry L. Sterrett , Devendra Natekar
IPC分类号： B24B1/00
CPC分类号： B24B7/228 , B24B41/068 , Y10T29/49998
摘要： Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.
摘要翻译：描述电子设备支持和处理方法。一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。从电子设备延伸的焊料凸块位于流体中。通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。活化流体将电子设备机械地保持在适当位置。电子设备的表面被抛光，同时电子设备被活化的流体保持就位。通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。描述和要求保护其他实施例。

27. 发明授权

US07087451B2 Microfabricated hot wire vacuum sensor 有权
标题翻译：微型热丝真空传感器
公开(公告)号：US07087451B2
公开(公告)日：2006-08-08
申请号：US10807836
申请日：2004-03-24
申请人： Leonel R. Arana , Yuelin Lee Zou , John Heck
发明人： Leonel R. Arana , Yuelin Lee Zou , John Heck
IPC分类号： H01L21/00 , H01L31/058
CPC分类号： G01L11/002 , G01L21/12 , G01M3/186 , G01M3/3272 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure.
摘要翻译：可以使用半导体集成电路工艺形成微细真空传感器。传感器可以形成在具有微加工部件的外壳内。然后可以使用传感器来测量外壳内的压力。

28. 发明申请

US20170284943A1 DETECTING VOIDS AND DELAMINATION IN PHOTORESIST LAYER 审中-公开
公开(公告)号：US20170284943A1
公开(公告)日：2017-10-05
申请号：US15083883
申请日：2016-03-29
申请人： Nilanjan Ghosh , Deepak Goyal , Jing Cheng , Leonel R. Arana
发明人： Nilanjan Ghosh , Deepak Goyal , Jing Cheng , Leonel R. Arana
IPC分类号： G01N21/95 , G01N21/55
CPC分类号： G01N21/95 , G01N21/55 , G01N21/8422 , G01N21/956 , G01N2201/0612 , G01N2201/13
摘要： A system for detecting a void in a photoresist layer can include: a detector, a processor, and a memory. The detector can be arranged to receive reflected light from a surface of a sample. The processor can be in electrical communication with the detector, The memory can store instructions that, when executed by the processor, can cause the processor to perform operations. The operations can comprise: receiving optical data from the detector, receiving calibrated data, and determining an existence of the void. the optical data can include information regarding a signature of the reflected light. The calibrated data can include information regarding a signature for a known sample of photoresist. The determination of the existence of the void can be based on a deviation of the optical data from the calibrated data.

29. 发明申请

US20140091470A1 DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY 有权
标题翻译：用于薄膜组件的DIE WARPAGE控制
公开(公告)号：US20140091470A1
公开(公告)日：2014-04-03
申请号：US13631612
申请日：2012-09-28
申请人： Sandeep B. Sane , Shandar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
发明人： Sandeep B. Sane , Shandar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
IPC分类号： H01L23/00
CPC分类号： H01L24/32 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/89 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/3213 , H01L2224/32225 , H01L2224/32501 , H01L2224/32505 , H01L2224/73253 , H01L2224/81007 , H01L2224/81193 , H01L2224/81815 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/161 , H01L2924/16251 , H01L2924/3511 , H01L2924/00 , H01L2924/014
摘要： Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
摘要翻译：控制模具翘曲，用于组装薄模具。在一个示例中，形成具有背面上的基板和在前侧层中的部件的装置。背衬层形成在衬底上，该层在加热器件时抵抗器件翘曲。该装置通过加热连接到基板。

30. 发明申请

US20110151624A1 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die 有权
标题翻译：用于微电子器件的涂层，包括其的处理以及管理微电子管芯的热分布的方法
公开(公告)号：US20110151624A1
公开(公告)日：2011-06-23
申请号：US12653791
申请日：2009-12-21
申请人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
发明人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
IPC分类号： H01L21/50 , B32B27/00
CPC分类号： H01L23/3737 , H01L24/81 , H01L2924/12042 , Y10T428/24942 , Y10T428/2495 , Y10T428/265 , Y10T428/3154 , H01L2924/00
摘要： A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
摘要翻译：用于微电子器件的涂层包括含有填料（232）的聚合物膜（131）。聚合物膜的热导率大于3W / m·K，厚度（133）不超过10微米。聚合物膜可以与切割带（310）组合以形成简化微电子封装（100）的制造工艺的处理（300），并且可以使用该处理（300）来管理微电子器件的热分布。

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