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    • 21. 发明申请
    • Electromagnetic radiation emitting semiconductor chip and procedure for its production
    • 电磁辐射发射半导体芯片及其生产程序
    • US20070034888A1
    • 2007-02-15
    • US11585632
    • 2006-10-24
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • H01L33/00
    • H01L33/20H01L33/46
    • A semiconductor chip which emits electromagnetic radiation is presented. The chip includes an epitaxially produced semiconductor layer stack based on nitride semiconductor material, which includes an n-conducting semiconductor layer, a p-conducting semiconductor layer, and an electromagnetic radiation generating region, which is arranged between these two semiconductor layers. The chip further includes a base on which the semiconductor layer stack is arranged, and a mirror layer, which is arranged between the semiconductor layer stack and the base. The n-conducting semiconductor layer faces away from the base, and the n-conducting semiconductor layer or an outcoupling layer located on the n-conducting semiconductor layer has a radiation-outcoupling surface which, in turn, includes planar outcoupling sub-surfaces, which are positioned obliquely with respect to a main plane of the radiation-generating region and each form an angle of between 15° and 70° with this plane.
    • 提出了发射电磁辐射的半导体芯片。 芯片包括基于氮化物半导体材料的外延生产的半导体层堆叠,其包括n导电半导体层,p导电半导体层和电磁辐射产生区域,其布置在这两个半导体层之间。 芯片还包括布置有半导体层堆叠的基底和布置在半导体层堆叠和基底之间的镜面层。 n导电半导体层背离基底,并且位于n导电半导体层上的n导电半导体层或输出耦合层具有辐射耦合表面,辐射输出耦合表面又包括平面输出耦合子表面,其中 相对于辐射产生区域的主平面倾斜地定位,并且每个与该平面形成15°至70°的角度。
    • 22. 发明授权
    • Method for fabricating a plurality of electromagnetic radiation emitting semiconductor chips
    • 制造多个电磁辐射半导体芯片的方法
    • US07655488B2
    • 2010-02-02
    • US12290097
    • 2008-10-27
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • H01L21/00
    • H01L33/20H01L33/46
    • Method for fabricating a semiconductor chip which emits electromagnetic radiation, wherein to improve the light yield of semiconductor chips which emit electromagnetic radiation, a textured reflection surface is integrated on the p-side of a semiconductor chip. The semiconductor chip has an epitaxially produced semiconductor layer stack based on GaN, which comprises an n-conducting semiconductor layer, a p-conducting semiconductor layer and an electromagnetic radiation generating region which is arranged between these two semiconductor layers. The surface of the p-conducting semiconductor layer which faces away from the radiation-generating region is provided with three-dimensional pyramid-like structures. A mirror layer is arranged over the whole of this textured surface. A textured reflection surface is formed between the mirror layer and the p-conducting semiconductor layer.
    • 用于制造发射电磁辐射的半导体芯片的方法,其中为了提高发射电磁辐射的半导体芯片的光输出,纹理反射表面被集成在半导体芯片的p侧上。 半导体芯片具有基于GaN的外延生产的半导体层堆叠,其包括n导电半导体层,p导电半导体层和布置在这两个半导体层之间的电磁辐射产生区域。 面向辐射产生区域的p导电半导体层的表面设置有三维金字塔状结构。 镜面层布置在整个这个有纹理的表面上。 在镜面层和导电性半导体层之间形成纹理反射面。
    • 26. 发明授权
    • Electromagnetic radiation emitting semiconductor chip and procedure for its production
    • 电磁辐射发射半导体芯片及其生产程序
    • US07442966B2
    • 2008-10-28
    • US11585632
    • 2006-10-24
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • H01L33/00
    • H01L33/20H01L33/46
    • A semiconductor chip which emits electromagnetic radiation is presented. The chip includes an epitaxially produced semiconductor layer stack based on nitride semiconductor material, which includes an n-conducting semiconductor layer, a p-conducting semiconductor layer, and an electromagnetic radiation generating region, which is arranged between these two semiconductor layers. The chip further includes a base on which the semiconductor layer stack is arranged, and a mirror layer, which is arranged between the semiconductor layer stack and the base. The n-conducting semiconductor layer faces away from the base, and the n-conducting semiconductor layer or an outcoupling layer located on the n-conducting semiconductor layer has a radiation-outcoupling surface which, in turn, includes planar outcoupling sub-surfaces, which are positioned obliquely with respect to a main plane of the radiation-generating region and each form an angle of between 15° and 70° with this plane.
    • 提出了发射电磁辐射的半导体芯片。 芯片包括基于氮化物半导体材料的外延生产的半导体层堆叠,其包括n导电半导体层,p导电半导体层和电磁辐射产生区域,其布置在这两个半导体层之间。 芯片还包括布置有半导体层堆叠的基底和布置在半导体层堆叠和基底之间的镜面层。 n导电半导体层背离基底,并且位于n导电半导体层上的n导电半导体层或输出耦合层具有辐射耦合表面,辐射输出耦合表面又包括平面输出耦合子表面,其中 相对于辐射产生区域的主平面倾斜地定位,并且每个与该平面形成15°至70°的角度。
    • 29. 发明授权
    • Electromagnetic radiation emitting semiconductor chip and procedure for its production
    • 电磁辐射发射半导体芯片及其生产程序
    • US07129528B2
    • 2006-10-31
    • US10671854
    • 2003-09-25
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • Stefan BaderDominik EisertBerthold HahnStephan Kaiser
    • H01L33/00
    • H01L33/20H01L33/46
    • Semiconductor chip which emits electromagnetic radiation, and method for fabricating it. To improve the light yield of semiconductor chips which emit electromagnetic radiation, a textured reflection surface (131) is integrated on the p-side of a semiconductor chip. The semiconductor chip has an epitaxially produced semiconductor layer stack (1) based on GaN, which comprises an n-conducting semiconductor layer (11), a p-conducting semiconductor layer (13) and an electromagnetic radiation generating region (12) which is arranged between these two semiconductor layers (11, 13). The surface of the p-conducting semiconductor layer (13) which faces away from the radiation-generating region (12) is provided with three-dimensional pyramid-like structures (15). A mirror layer (40) is arranged over the whole of this textured surface. A textured reflection surface (131) is formed between the mirror layer (40) and the p-conducting semiconductor layer (13). The textured reflection surface (131) can increase the amount of light which is decoupled at the radiation-outcoupling surface (111) by virtue of the fact that a beam (3), after double reflection on the reflection surface (131), is more likely not to be totally reflected.
    • 发射电磁辐射的半导体芯片及其制造方法。 为了提高发射电磁辐射的半导体芯片的光输出,在半导体芯片的p侧上集成纹理化反射面(131)。 半导体芯片具有基于GaN的外延生产的半导体层堆叠(1),其包括n导电半导体层(11),p导电半导体层(13)和电磁辐射产生区域(12),其布置 在这两个半导体层(11,13)之间。 背离辐射产生区域(12)的p导电半导体层(13)的表面设置有三维金字塔状结构(15)。 镜面层(40)布置在整个这个纹理表面上。 在镜面层(40)和导电性半导体层(13)之间形成纹理反射面(131)。 纹理反射表面(131)可以通过在反射表面(131)上双重反射之后的光束(3)更多地增加在辐射输出耦合表面(111)处解耦的光量 可能不会被完全反映。