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    • 21. 发明授权
    • Plasma deposition of amorphous semiconductors at microwave frequencies
    • 微波等离子体沉积非晶半导体
    • US08048782B1
    • 2011-11-01
    • US12855631
    • 2010-08-12
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • H01L21/00
    • C23C16/452C23C16/24C23C16/511H01J37/32192H01J37/3244
    • Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus avoids deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to transform them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. The invention allows for the ultrafast formation of silicon-containing amorphous semiconductors that exhibit high mobility, low porosity, little or no Staebler-Wronski degradation, and low defect concentration.
    • 微波等离子体沉积薄膜光伏材料的设备和方法。 该装置避免了将微波能量耦合到沉积物质的窗户或其他微波传输元件上的沉积。 该装置包括带有通过其的导管的微波施加器,其携带沉积物质。 施加器将微波能量传递到沉积物质以将它们转变成有助于形成薄膜材料的反应状态。 导管物理隔离在微波功率传递点反应以形成薄膜材料的沉积物质。 沉积物质分开通电并从功率传递点扫除,以防止薄膜沉积。 本发明允许超快速地形成显示高迁移率,低孔隙率,很少或没有Staebler-Wronski降解和低缺陷浓度的含硅非晶半导体。
    • 22. 发明申请
    • PLASMA DEPOSITION OF AMORPHOUS SEMICONDUCTORS AT MICROWAVE FREQUENCIES
    • 在微波频率下等离子体沉积非晶半导体
    • US20120040493A1
    • 2012-02-16
    • US12855645
    • 2010-08-12
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • H01L31/18
    • C23C16/511C23C16/24C23C16/545H01L21/02425H01L21/02532H01L21/02592H01L21/0262
    • Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus avoids deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to transform them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. The invention allows for the ultrafast formation of silicon-containing amorphous semiconductors that exhibit high mobility, low porosity, little or no Staebler-Wronski degradation, and low defect concentration.
    • 微波等离子体沉积薄膜光伏材料的设备和方法。 该装置避免了将微波能量耦合到沉积物质的窗户或其他微波传输元件上的沉积。 该装置包括带有通过其的导管的微波施加器,其携带沉积物质。 施加器将微波能量传递到沉积物质以将它们转变成有助于形成薄膜材料的反应状态。 导管物理隔离在微波功率传递点反应以形成薄膜材料的沉积物质。 沉积物质分开通电并从功率传递点扫除,以防止薄膜沉积。 本发明允许超快速地形成显示高迁移率,低孔隙率,很少或没有Staebler-Wronski降解和低缺陷浓度的含硅非晶半导体。
    • 27. 发明授权
    • Electrically erasable, directly overwritable, multibit single cell
memory element and arrays fabricated therefrom
    • 电可擦除,直接可重写的多单元单元存储元件和由其制造的阵列
    • US5536947A
    • 1996-07-16
    • US506630
    • 1995-07-25
    • Patrick K. KlersyDavid A. StrandStanford R. Ovshinsky
    • Patrick K. KlersyDavid A. StrandStanford R. Ovshinsky
    • C23C14/06G11C11/56G11C16/02H01L21/822H01L27/04H01L27/10H01L27/105H01L27/24H01L45/00
    • G11C13/0004G11C11/56G11C11/5678H01L27/2463H01L45/06H01L45/1233H01L45/1246H01L45/1253H01L45/144G11C13/04G11C2213/72
    • An electrically operated, directly overwritable, multibit, single-cell memory element. The memory element includes a volume of memory material which defines the single cell memory element. The memory material is characterized by: (1) a large dynamic range of electrical resistance values; and (2) the ability to be set at one of a plurality of resistance values within the dynamic range in response to selected electrical input signals so as to provide the single cell with multibit storage capabilities, and (3) the ability of at least a filamentary portion to be set, by the selected electrical singal to any resistance value in the dynamic range, regardless of the previous resistance value of the material. The memory element also includes a pair of spacedly disposed contacts for supplying the electrical input signal to set the memory material to a selected resistance value within the dynamic range. Each contact includes (1) a thin-film layer, preferably titanium cabonitride or titanium siliconitride, disposed adjacent to the memory material, used as a diffusion barrier to inhibit foreign material from entering the memory material, and (2) a thin-film layer, preferably a Ti--W alloy, disposed remote to the memory material, used to provide a barrier to aluminum electromigration, diffusion and providing an ohmic contact at the aluminum interface.
    • 电操作的直接覆盖多单位单元存储元件。 存储元件包括限定单个单元存储元件的一定量的存储器材料。 记忆材料的特征在于:(1)电阻值的大动态范围; 以及(2)响应于所选择的电输入信号在动态范围内被设置为多个电阻值之一的能力,以便向单个单元提供多位存储能力,以及(3)至少一个 通过所选择的电气单位在动态范围内的任何电阻值,而不管材料的先前电阻值如何,要设置的丝状部分。 存储元件还包括一对间隔设置的触点,用于提供电输入信号以将存储器材料设置在动态范围内的所选电阻值。 每个触点包括(1)设置在存储材料附近的用作阻挡异物进入存储材料的扩散阻挡层的薄膜层,优选钛碳氮化钛或钛硅化钛,以及(2)薄膜层 优选Ti-W合金,其设置在远离存储材料的位置,用于提供铝电迁移,扩散的屏障,并在铝界面处提供欧姆接触。