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    • 22. 发明授权
    • Integrated circuit memory devices having multiple input/output buses and precharge circuitry for precharging the input/output buses between write operations
    • 具有多个输入/输出总线和预充电电路的集成电路存储器件,用于在写入操作之间预充电输入/输出总线
    • US06487132B2
    • 2002-11-26
    • US09773780
    • 2001-01-31
    • Yong-Cheol BaeJung-Hwa Lee
    • Yong-Cheol BaeJung-Hwa Lee
    • G11C700
    • G11C7/1006G11C7/1048
    • Integrated circuit memory devices include precharge controller circuit, which generates a precharge control signal in response to completion of a write operation on a first input/output bus. A precharge circuit drives the first and a input/output buses to a predetermined voltage level in response to the precharge control signal. Multiple switches may be used to couple the first and second input/output buses to the memory cell array and these switches may also be coupled to a column select line. The switches may be responsive to a column select signal carried on the column select line such that one or more memory cells are coupled to the first input/output bus and one or more memory cells are coupled to the second input/output bus simultaneously. Because both of the input/output buses are coupled to the memory cell array in response to the column select signal, the memory cell array may be susceptible to bit line disturbance in which charges remaining on one input/output bus from a previous write operation corrupt memory cells during a write operation on a second input/output bus. By driving the first and second input/output buses to a predetermined voltage level after completing a write operation on one of the two input/output buses, bit line disturbance may be prevented.
    • 集成电路存储器件包括预充电控制器电路,其响应于在第一输入/输出总线上的写入操作的完成而产生预充电控制信号。 预充电电路响应于预充电控制信号将第一输入/输出总线驱动到预定的电压电平。 可以使用多个开关将第一和第二输入/输出总线耦合到存储单元阵列,并且这些开关也可以耦合到列选择线。 开关可以响应于列选择线上承载的列选择信号,使得一个或多个存储器单元耦合到第一输入/输出总线,并且一个或多个存储器单元同时耦合到第二输入/输出总线。 因为响应于列选择信号而将输入/输出总线都耦合到存储单元阵列,所以存储单元阵列可能容易受到位线干扰,其中一个输入/输出总线上剩余的电荷从先前的写操作损坏 在第二输入/输出总线上的写操作期间的存储器单元。 通过在两个输入/输出总线中的一个完成写入操作之后,通过将第一和第二输入/输出总线驱动到预定的电压电平,可以防止位线干扰。
    • 23. 发明授权
    • Semiconductor memory devices having shared data line contacts
    • 具有共享数据线触点的半导体存储器件
    • US06215690B1
    • 2001-04-10
    • US09536963
    • 2000-03-28
    • Jung-Hwa Lee
    • Jung-Hwa Lee
    • G11C700
    • G11C7/18G11C7/1048G11C11/4096G11C11/4097H01L27/10897
    • Disclosed herein is a semiconductor memory device which comprises a memory cell array having a plurality of memory cells and a plurality of bit line pairs connected to the memory cells. The device has two data line pairs corresponding to the memory cell array. Furthermore, the device comprises a plurality of selecting transistors connected to the bit line pairs and selecting two bit line pairs to connect the two selected bit line pairs to the two data line pairs in response to a column selection signal. The selecting transistors corresponding to the column selection signal are laid out to share source/drain to data line contacts with contiguous those to be selected by another column selection signal.
    • 本文公开了一种半导体存储器件,其包括具有多个存储器单元的存储单元阵列和连接到存储器单元的多个位线对。 该设备具有对应于存储单元阵列的两条数据线对。 此外,该装置包括连接到位线对的多个选择晶体管,并且响应于列选择信号选择两个位线对以将两个所选位线对连接到两个数据线对。 对应于列选择信号的选择晶体管布置成将数据线触点与要由另一列选择信号选择的相邻的数据线触点共享。
    • 26. 发明授权
    • Semiconductor memory device having capacitor for peripheral circuit
    • 具有用于外围电路的电容器的半导体存储器件
    • US07999299B2
    • 2011-08-16
    • US12264490
    • 2008-11-04
    • Jung-Hwa LeeSi-Woo Lee
    • Jung-Hwa LeeSi-Woo Lee
    • H01L27/108
    • H01L27/10894H01L27/0207H01L27/0629H01L28/40
    • Provided is a semiconductor memory device having peripheral circuit capacitors. In the semiconductor memory device, a first node is electrically connected to a plurality of lower electrodes of a plurality of capacitors in a peripheral circuit region to connect at least a portion of the capacitors in parallel. A second node is electrically connected to a plurality of upper electrodes of the capacitors in the peripheral circuit region to connect at least a portion of the capacitors in parallel. The first node is formed at substantially the same level as a bit line in a cell array region and is formed of the same material used to form the bit line.
    • 提供了具有外围电路电容器的半导体存储器件。 在半导体存储器件中,第一节点电连接到外围电路区域中的多个电容器的多个下电极,以平行地连接至少一部分电容器。 第二节点电连接到外围电路区域中的电容器的多个上电极,以平行地连接至少一部分电容器。 第一节点形成在与单元阵列区域中的位线基本相同的电平上,并且由用于形成位线的相同材料形成。
    • 27. 发明授权
    • Semiconductor device having decoupling capacitor and method of fabricating the same
    • 具有去耦电容器的半导体器件及其制造方法
    • US07883970B2
    • 2011-02-08
    • US12343035
    • 2008-12-23
    • Hyun-Ki KimJung-Hwa LeeJi-Young Kim
    • Hyun-Ki KimJung-Hwa LeeJi-Young Kim
    • H01L21/336
    • H01L29/945H01L27/0207H01L27/0805H01L27/10861H01L27/10876H01L27/10894H01L29/66181H01L29/66621H01L29/78
    • A semiconductor device having a decoupling capacitor and a method of fabricating the same are provided. The semiconductor device includes a semiconductor substrate having a cell region, a first peripheral circuit region, and a second peripheral circuit region. At least one channel trench is disposed in the cell region of the semiconductor substrate. At least one first capacitor trench is disposed in the first peripheral circuit region of the semiconductor substrate, and at least one second capacitor trench is disposed in the second peripheral circuit region of the semiconductor substrate. A gate electrode is disposed in the cell region of the semiconductor substrate and fills the channel trench. A first upper electrode is disposed in the first peripheral circuit region of the semiconductor substrate and fills at least the first capacitor trench. A second upper electrode is disposed in the second peripheral circuit region of the semiconductor substrate and fills at least the second capacitor trench. A gate dielectric layer is interposed between the channel trench and the gate electrode. A first dielectric layer is interposed between the semiconductor substrate of the first peripheral circuit region having the first capacitor trench and the first upper electrode and has the same thickness as the gate dielectric layer. A second dielectric layer is interposed between the semiconductor substrate of the second peripheral circuit region having the second capacitor trench and the second upper electrode and has a different thickness from the first dielectric layer.
    • 提供具有去耦电容器的半导体器件及其制造方法。 半导体器件包括具有单元区域,第一外围电路区域和第二外围电路区域的半导体衬底。 至少一个通道沟槽设置在半导体衬底的单元区域中。 至少一个第一电容器沟槽设置在半导体衬底的第一外围电路区域中,并且至少一个第二电容器沟槽设置在半导体衬底的第二外围电路区域中。 栅电极设置在半导体衬底的单元区域中并填充沟槽。 第一上电极设置在半导体衬底的第一外围电路区域中,并且填充至少第一电容器沟槽。 第二上电极设置在半导体衬底的第二外围电路区域中,并且填充至少第二电容器沟槽。 栅极电介质层介于通道沟槽和栅电极之间。 在具有第一电容器沟槽的第一外围电路区域的半导体衬底和第一上电极之间插入第一电介质层,并且具有与栅极电介质层相同的厚度。 在具有第二电容器沟槽的第二外围电路区域的半导体衬底和第二上部电极之间插入第二电介质层,并且具有与第一电介质层不同的厚度。
    • 30. 发明申请
    • Semiconductor device having decoupling capacitor and method of fabricating the same
    • 具有去耦电容器的半导体器件及其制造方法
    • US20070052013A1
    • 2007-03-08
    • US11449959
    • 2006-06-09
    • Hyun-Ki KimJung-Hwa LeeJi-Young Kim
    • Hyun-Ki KimJung-Hwa LeeJi-Young Kim
    • H01L29/94
    • H01L29/945H01L27/0207H01L27/0805H01L27/10861H01L27/10876H01L27/10894H01L29/66181H01L29/66621H01L29/78
    • A semiconductor device having a decoupling capacitor and a method of fabricating the same are provided. The semiconductor device includes a semiconductor substrate having a cell region, a first peripheral circuit region, and a second peripheral circuit region. At least one channel trench is disposed in the cell region of the semiconductor substrate. At least one first capacitor trench is disposed in the first peripheral circuit region of the semiconductor substrate, and at least one second capacitor trench is disposed in the second peripheral circuit region of the semiconductor substrate. A gate electrode is disposed in the cell region of the semiconductor substrate and fills the channel trench. A first upper electrode is disposed in the first peripheral circuit region of the semiconductor substrate and fills at least the first capacitor trench. A second upper electrode is disposed in the second peripheral circuit region of the semiconductor substrate and fills at least the second capacitor trench. A gate dielectric layer is interposed between the channel trench and the gate electrode. A first dielectric layer is interposed between the semiconductor substrate of the first peripheral circuit region having the first capacitor trench and the first upper electrode and has the same thickness as the gate dielectric layer. A second dielectric layer is interposed between the semiconductor substrate of the second peripheral circuit region having the second capacitor trench and the second upper electrode and has a different thickness from the first dielectric layer.
    • 提供具有去耦电容器的半导体器件及其制造方法。 半导体器件包括具有单元区域,第一外围电路区域和第二外围电路区域的半导体衬底。 至少一个通道沟槽设置在半导体衬底的单元区域中。 至少一个第一电容器沟槽设置在半导体衬底的第一外围电路区域中,并且至少一个第二电容器沟槽设置在半导体衬底的第二外围电路区域中。 栅电极设置在半导体衬底的单元区域中并填充沟槽。 第一上电极设置在半导体衬底的第一外围电路区域中,并且填充至少第一电容器沟槽。 第二上电极设置在半导体衬底的第二外围电路区域中,并且填充至少第二电容器沟槽。 栅极电介质层介于通道沟槽和栅电极之间。 在具有第一电容器沟槽的第一外围电路区域的半导体衬底和第一上电极之间插入第一电介质层,并且具有与栅极电介质层相同的厚度。 在具有第二电容器沟槽的第二外围电路区域的半导体衬底和第二上部电极之间插入第二电介质层,并且具有与第一电介质层不同的厚度。