专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07564139B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07564139B2
公开(公告)日：2009-07-21
申请号：US11947835
申请日：2007-11-30
申请人： Hideaki Kuwabara , Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Etsuko Arakawa , Shunpei Yamazaki
发明人： Hideaki Kuwabara , Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Etsuko Arakawa , Shunpei Yamazaki
IPC分类号： H01L29/40
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L29/0657 , H01L29/66757 , H01L29/78675 , H01L2221/68359 , H01L2221/68368 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2924/01014 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present invention, an integrated circuit film is mounted, thereby making a semiconductor device mounting the integrated circuit film thinner. The term “an integrated circuit film” means a film-like integrated circuit which is manufactured based on an integrated circuit manufactured by a semiconductor film formed over a substrate such as a glass substrate or a quartz substrate. In the present invention, the integrated circuit film is manufactured by a technique for transferring.
摘要翻译：本发明的目的是提供一种使半导体器件更薄而不使用用于硅晶片的后磨法的技术。根据本发明，安装集成电路膜，从而使得安装集成电路膜的半导体器件更薄。术语“集成电路膜”是指基于由诸如玻璃基板或石英基板的基板上形成的半导体膜制成的集成电路制造的膜状集成电路。在本发明中，通过转印技术制造集成电路膜。

22. 发明申请

US20090152539A1 Semiconductor Apparatus and Fabrication Method of the Same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090152539A1
公开(公告)日：2009-06-18
申请号：US12370767
申请日：2009-02-13
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L29/04 , H01L31/036 , H01L31/20
CPC分类号： H01L23/12 , H01L27/12 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3281 , H01L29/78603 , H01L51/003 , H01L51/0097 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , Y02E10/549 , Y02P70/521 , H01L2924/00
摘要： It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
摘要翻译：本发明的目的是提供一种能够防止由于水分或氧气的渗透引起的劣化的半导体器件，例如具有形成在塑料基板上的有机发光器件的发光装置，以及使用塑料基板的液晶显示装置。根据本发明，形成在玻璃基板或石英基板（TFT，具有有机化合物的发光器件，液晶器件，存储器件，薄膜二极管，pin-junction硅光电转换器，硅电阻元件等）与衬底分离，并转移到具有高导热性的塑料衬底。

23. 发明授权

US07495256B2 Semiconductor apparatus and fabrication method of the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07495256B2
公开(公告)日：2009-02-24
申请号：US11206000
申请日：2005-08-18
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L29/04 , H01L31/036 , H01L31/0376 , H01L31/20
CPC分类号： H01L23/12 , H01L27/12 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3281 , H01L29/78603 , H01L51/003 , H01L51/0097 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , Y02E10/549 , Y02P70/521 , H01L2924/00
摘要： It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
摘要翻译：本发明的目的是提供一种能够防止由于水分或氧气的渗透引起的劣化的半导体器件，例如具有形成在塑料基板上的有机发光器件的发光装置，以及使用塑料基板的液晶显示装置。根据本发明，形成在玻璃基板或石英基板（TFT，具有有机化合物的发光器件，液晶器件，存储器件，薄膜二极管，pin-junction硅光电转换器，硅电阻元件等）与衬底分离，并转移到具有高导热性的塑料衬底。

24. 发明授权

US07245331B2 Peeling method and method for manufacturing display device using the peeling method 有权
公开(公告)号：US07245331B2
公开(公告)日：2007-07-17
申请号：US10752574
申请日：2004-01-08
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno
IPC分类号： G02F1/136
CPC分类号： H01L27/1218 , H01L21/02175 , H01L21/28008 , H01L21/324 , H01L21/425 , H01L21/707 , H01L21/823487 , H01L27/1214 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L29/78603 , H01L33/005 , H01L33/0054 , H01L51/003 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2933/0016
摘要： The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.

25. 发明授权

US07164151B2 Semiconductor device with pixel portion and driving circuit, and electronic device 有权
标题翻译：具有像素部分和驱动电路的半导体器件，以及电子器件
公开(公告)号：US07164151B2
公开(公告)日：2007-01-16
申请号：US10774700
申请日：2004-02-10
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
IPC分类号： H01L29/04 , H01L31/20 , H01L31/036 , H01L31/0376
CPC分类号： H01L51/0024 , G02F1/13306 , G02F1/1339 , G02F1/1341 , G02F1/134309 , G02F1/13439 , G02F1/13452 , G02F1/13454 , G02F1/1368 , G02F2001/13456 , G02F2202/28 , H01L21/2007 , H01L21/67196 , H01L21/67207 , H01L21/67236 , H01L21/6835 , H01L21/76251 , H01L25/0657 , H01L25/50 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1266 , H01L27/1274 , H01L27/15 , H01L27/3248 , H01L27/3272 , H01L27/3276 , H01L29/78675 , H01L51/003 , H01L51/5012 , H01L51/5056 , H01L51/5072 , H01L51/5088 , H01L51/5092 , H01L51/5096 , H01L51/5206 , H01L51/5221 , H01L51/56 , H01L2221/68368 , H01L2224/05001 , H01L2224/05009 , H01L2224/05025 , H01L2224/13025 , H01L2224/16 , H01L2225/06524 , H01L2225/06548 , H01L2225/06555 , H01L2225/06586 , H01L2227/323 , H01L2227/326 , H01L2251/308 , H01L2251/5323 , H01L2924/00014 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.
摘要翻译：本发明旨在实现面板上系统的窄帧。除此之外，安装在面板上的系统旨在使功能更高更通用。在本发明中，在形成有像素部（包括液晶元件，发光元件）和驱动电路的面板上，层叠形成了构成外部电路的集成电路。具体地，在面板上的像素部分和驱动电路中，在与驱动电路重叠的位置上，根据转录技术层叠形成任何一种或多种集成电路。

26. 发明申请

US20060189097A1 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20060189097A1
公开(公告)日：2006-08-24
申请号：US11410073
申请日：2006-04-25
申请人： Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Shunpei Yamazaki
发明人： Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Shunpei Yamazaki
IPC分类号： H01L21/30
CPC分类号： H01L27/1266 , H01L21/6835 , H01L27/1214 , H01L2221/68359 , H01L2221/68368 , H01L2924/3025
摘要： The present invention is a separation method for easy separation of an allover release layer with a large area. Further, the present invention is the separating method that is not subjected to restrictions in the use of substrates, such as a kind of substrate, during forming a release layer. A separation method comprising the steps of forming a metal film, a first oxide, and a semiconductor film containing hydrogen in this order; and bonding a support to a release layer containing the first oxide and the semiconductor film and separating the release layer bonded to the support from a substrate provided with the metal layer by a physical means. Through the separation method, heat treatment is carried out to diffuse hydrogen contained in the semiconductor film, a third oxide is formed by reducing a second oxide formed at a surface boundary between the metal film and the first oxide film, and a film containing the second oxide and the third oxide, a surface boundary between the film containing the second oxide and the third oxide, and the metal film, or a surface boundary between the film containing the second oxide and the third oxide, and the first oxide is split.
摘要翻译：本发明是用于容易地分离大面积的全层释放层的分离方法。此外，本发明是在形成剥离层期间不受使用诸如基板的基板的限制的分离方法。一种分离方法，包括以下步骤：依次形成含有氢的金属膜，第一氧化物和半导体膜; 以及将载体接合到包含第一氧化物和半导体膜的剥离层，并且通过物理手段从与设置有金属层的基板分离结合到载体的剥离层。通过分离方法，进行热处理以扩散半导体膜中所含的氢，通过还原在金属膜和第一氧化物膜之间的表面边界处形成的第二氧化物和包含第二氧化物的膜形成第三氧化物氧化物和第三氧化物，含有第二氧化物的膜和第三氧化物的膜与金属膜之间的表面边界或含有第二氧化物的膜和第三氧化物之间的表面边界以及第一氧化物被分裂。

27. 发明授权

US07067392B2 Semiconductor apparatus and fabrication method of the same 失效
公开(公告)号：US07067392B2
公开(公告)日：2006-06-27
申请号：US10685398
申请日：2003-10-16
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L21/30
CPC分类号： H01L23/12 , H01L27/12 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3281 , H01L29/78603 , H01L51/003 , H01L51/0097 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , Y02E10/549 , Y02P70/521 , H01L2924/00
摘要： It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.

28. 发明申请

US20050001211A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20050001211A1
公开(公告)日：2005-01-06
申请号：US10774700
申请日：2004-02-10
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
IPC分类号： G02F1/1368 , G02F1/13 , G02F1/1345 , G02F1/1362 , G09F9/00 , H01L21/02 , H01L21/20 , H01L21/336 , H01L21/762 , H01L21/77 , H01L21/8234 , H01L21/84 , H01L27/00 , H01L27/08 , H01L27/088 , H01L27/12 , H01L29/786 , H01L51/50 , H01L29/04
CPC分类号： H01L51/0024 , G02F1/13306 , G02F1/1339 , G02F1/1341 , G02F1/134309 , G02F1/13439 , G02F1/13452 , G02F1/13454 , G02F1/1368 , G02F2001/13456 , G02F2202/28 , H01L21/2007 , H01L21/67196 , H01L21/67207 , H01L21/67236 , H01L21/6835 , H01L21/76251 , H01L25/0657 , H01L25/50 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1266 , H01L27/1274 , H01L27/15 , H01L27/3248 , H01L27/3272 , H01L27/3276 , H01L29/78675 , H01L51/003 , H01L51/5012 , H01L51/5056 , H01L51/5072 , H01L51/5088 , H01L51/5092 , H01L51/5096 , H01L51/5206 , H01L51/5221 , H01L51/56 , H01L2221/68368 , H01L2224/05001 , H01L2224/05009 , H01L2224/05025 , H01L2224/13025 , H01L2224/16 , H01L2225/06524 , H01L2225/06548 , H01L2225/06555 , H01L2225/06586 , H01L2227/323 , H01L2227/326 , H01L2251/308 , H01L2251/5323 , H01L2924/00014 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： [Summary][Problem] The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. [Means for Resolution] In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.
摘要翻译：发明内容本发明旨在实现面板上的系统的窄框架。除此之外，安装在面板上的系统旨在使功能更高更通用。 [分辨装置]在本发明中，在形成有像素部（包括液晶元件，发光元件）和驱动电路的面板上层叠了迄今构成外部电路的集成电路，形成。具体地，在面板上的像素部分和驱动电路中，在与驱动电路重叠的位置上，根据转录技术层叠形成任何一种或多种集成电路。

29. 发明授权

US08634041B2 Liquid crystal display device and manufacturing method of liquid crystal display device 有权
标题翻译：液晶显示装置及液晶显示装置的制造方法
公开(公告)号：US08634041B2
公开(公告)日：2014-01-21
申请号：US13466406
申请日：2012-05-08
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
IPC分类号： G02F1/1335
CPC分类号： G02F1/1362 , G02F1/133305 , G02F1/133603 , G02F2001/13613 , H01L27/14678 , H01L2221/68359 , H01L2221/68368 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592
摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.
摘要翻译：为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板，布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元，电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

30. 发明授权

US08040456B2 Liquid crystal display device and manufacturing method of liquid crystal display device 有权
标题翻译：液晶显示装置及液晶显示装置的制造方法
公开(公告)号：US08040456B2
公开(公告)日：2011-10-18
申请号：US10756833
申请日：2004-01-14
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
IPC分类号： G02F1/1335
CPC分类号： G02F1/1362 , G02F1/133305 , G02F1/133603 , G02F2001/13613 , H01L27/14678 , H01L2221/68359 , H01L2221/68368 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592
摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.
摘要翻译：为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板，布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元，电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式