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    • 22. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US09006729B2
    • 2015-04-14
    • US12943558
    • 2010-11-10
    • Kengo AkimotoJunichiro SakataYoshiaki OikawaShunpei Yamazaki
    • Kengo AkimotoJunichiro SakataYoshiaki OikawaShunpei Yamazaki
    • H01L29/10H01L29/12H01L29/786H01L29/45
    • H01L29/7869H01L29/45
    • It is an object to provide a method for manufacturing a highly reliable semiconductor device having a thin film transistor formed using an oxide semiconductor and having stable electric characteristics. The semiconductor device includes an oxide semiconductor film overlapping with a gate electrode with a gate insulating film interposed therebetween; and a source electrode and a drain electrode which are in contact with the oxide semiconductor film. The source electrode and the drain electrode include a mixture, metal compound, or alloy containing one or more of a metal with a low electronegativity such as titanium, magnesium, yttrium, aluminum, tungsten, and molybdenum. The concentration of hydrogen in the source electrode and the drain electrode is 1.2 times, preferably 5 times or more as high as that of hydrogen in the oxide semiconductor film.
    • 本发明的目的是提供一种用于制造具有使用氧化物半导体形成并且具有稳定的电特性的薄膜晶体管的高度可靠的半导体器件的方法。 半导体器件包括与栅电极重叠的氧化物半导体膜,其间插入有栅极绝缘膜; 以及与氧化物半导体膜接触的源电极和漏电极。 源电极和漏极包括含有一种或多种具有低电负性的金属如钛,镁,钇,铝,钨和钼的混合物,金属化合物或合金。 源电极和漏电极中的氢浓度是氧化物半导体膜中的氢的浓度的1.2倍,优选为5倍以上。
    • 26. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110108834A1
    • 2011-05-12
    • US12917569
    • 2010-11-02
    • Shunpei YamazakiSuzunosuke HiraishiKengo AkimotoJunichiro Sakata
    • Shunpei YamazakiSuzunosuke HiraishiKengo AkimotoJunichiro Sakata
    • H01L29/24
    • H01L29/45G02F1/1368H01L29/7869
    • An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using an oxide of a metal whose work function is lower than the work function of the oxide semiconductor layer or an oxide of an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.
    • 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极层具有两层或多层的层叠结构,其中使用其功函数低于氧化物半导体层的功函数的金属的氧化物形成与氧化物半导体层接触的层 或含有这种金属的合金的氧化物。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。