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21. 发明授权

US4708545A Method for drilling reference holes in multi-layer printed wiring board assembly 失效
标题翻译：多层印刷电路板组件中参考孔的钻孔方法
公开(公告)号：US4708545A
公开(公告)日：1987-11-24
申请号：US797983
申请日：1985-11-14
申请人： Toshinori Fujii , Shinji Okamoto
发明人： Toshinori Fujii , Shinji Okamoto
IPC分类号： H05K3/00 , B23B49/00 , B23Q35/02 , G03F9/00 , H05K1/02 , H05K3/46 , B23C3/00
CPC分类号： B23Q35/02 , G03F9/00 , H05K3/4638 , H05K1/0269 , H05K2201/083 , H05K2201/09781 , H05K2203/101 , H05K3/0008 , H05K3/0047 , H05K3/4611 , Y10T408/03 , Y10T409/303752
摘要： A method for drilling reference holes in a multi-layer printed wiring board assembly, in which drilling position marks provided on inner-layer circuit board in the assembly are roughly detected through each of two outer-layer boards of the assembly, a spot-facing is made with respect to the outer-layer boards at roughly detected points of the marks, and thereafter the marks are precisely detected at the faced spots. Positions for drilling the reference holes can be thereby determined at the spots precisely in close proximity to the internally provided drilling position marks, to allow the drilling performed very accurately in simpler and economical manner.
摘要翻译：一种用于在多层印刷线路板组件中钻取参考孔的方法，其中通过组件的两个外层板中的每一个大致检测在组件中的内层电路板上提供的钻孔位置标记，在标记的大致检测点处相对于外层板制成，然后在面部处精确地检测出标记。因此，可以在精确地靠近内部提供的钻孔位置标记的位置处确定钻孔参考孔的位置，以便以更简单和经济的方式非常精确地执行钻孔。

22. 发明授权

US09376545B2 Resin composition, melt-formed article, multilayer structure, and process for producing resin composition 有权
标题翻译：树脂组合物，熔融成型制品，多层结构，以及树脂组合物的制造方法
公开(公告)号：US09376545B2
公开(公告)日：2016-06-28
申请号：US13057298
申请日：2009-08-07
申请人： Shinji Okamoto , Hiroki Masumoto , Kouji Yamada , Tomonori Yoshida
发明人： Shinji Okamoto , Hiroki Masumoto , Kouji Yamada , Tomonori Yoshida
IPC分类号： C08K5/098 , C08L29/04
CPC分类号： C08K5/098 , C08K2201/008 , C08L29/04 , Y10T428/31736 , Y10T428/31797 , Y10T428/31928
摘要： The present invention provides a resin composition which is excellent in gas-barrier properties after a hot-water treatment and excellent in handling properties without increasing viscosity of the resin composition in a melt-kneading step at forming. The invention provides a resin composition containing a thermoplastic resin (A) and a partially dehydrated product or completely dehydrated product (B) of hydrated carboxylic acid salt.
摘要翻译：本发明提供了一种树脂组合物，其在热水处理后的阻气性优异且处理性能优异，而在成型时的熔融捏合步骤中树脂组合物的粘度增加。本发明提供含有热塑性树脂（A）和水合羧酸盐的部分脱水产物或完全脱水产物（B）的树脂组合物。

23. 发明授权

US08765037B2 Process for preparing ethylene-vinyl alcohol copolymer composition, and process for producing ethylene-vinyl alcohol copolymer pellets 有权
标题翻译：制备乙烯 - 乙烯醇共聚物组合物的方法，以及生产乙烯 - 乙烯醇共聚物颗粒的方法
公开(公告)号：US08765037B2
公开(公告)日：2014-07-01
申请号：US12810463
申请日：2008-12-22
申请人： Keisuke Fujimura , Yasufumi Beniya , Akio Harao , Yoshiharu Nagao , Shinji Okamoto
发明人： Keisuke Fujimura , Yasufumi Beniya , Akio Harao , Yoshiharu Nagao , Shinji Okamoto
IPC分类号： B29B9/12
CPC分类号： B29B9/12 , C08J3/12 , C08J3/215 , C08J2323/08 , C08J2329/04 , C08K3/32 , C08K3/38 , C08K5/09
摘要： An ethylene-vinyl alcohol copolymer (EVOH) composition preparation process is provided, which comprises the steps of: feeding an EVOH alcohol solution into a tower type apparatus, the EVOH alcohol solution comprising 100 parts by weight of an EVOH and not less than 300 parts by weight of an alcohol having a carbon number of not greater than 4; bringing the EVOH alcohol solution into contact with water, and feeding out a part of the alcohol together with water from the apparatus to provide an EVOH water/alcohol mixture solution comprising 100 parts by weight of the EVOH, 10 to 200 parts by weight of the alcohol and 50 to 200 parts by weight of water; bringing the EVOH water/alcohol mixture solution into contact with water in an agitator container with stirring, and feeding out a part or all of the alcohol together with water from the container to provide an EVOH composition comprising 100 parts by weight of the EVOH, less than 10 parts by weight of the alcohol and 20 to 100 parts by weight of water. This preparation process makes it possible to efficiently replace the alcohol in the EVOH alcohol solution with water to provide a lower water content EVOH composition.
摘要翻译：提供乙烯 - 乙烯醇共聚物（EVOH）组合物制备方法，其包括以下步骤：将EVOH醇溶液进料到塔式设备中，EVOH醇溶液包含100重量份EVOH和不少于300份重量的碳数不大于4的醇; 使EVOH醇溶液与水接触，并将一部分醇与来自该装置的水一起送出，以提供EVOH水/醇混合物溶液，其包含100重量份EVOH，10至200重量份的醇和50〜200重量份的水; 使EVOH水/醇混合物溶液在搅拌容器中与水接触，并从容器中将水一部分或全部与水一起供给，以提供EVOH组合物，其包含100重量份EVOH，更少大于10重量份的醇和20至100重量份的水。该制备方法使得可以用水有效地代替EVOH醇溶液中的醇以提供较低的含水量的EVOH组合物。

24. 发明申请

US20110135950A1 RESIN COMPOSITION, MELT-FORMED ARTICLE, MULTILAYER STRUCTURE, AND PROCESS FOR PRODUCING RESIN COMPOSITION 有权
标题翻译：树脂组合物，熔融成型品，多层结构和生产树脂组合物的方法
公开(公告)号：US20110135950A1
公开(公告)日：2011-06-09
申请号：US13057298
申请日：2009-08-07
申请人： Shinji Okamoto , Hiroki Masumoto , Kouji Yamada , Tomonori Yoshida
发明人： Shinji Okamoto , Hiroki Masumoto , Kouji Yamada , Tomonori Yoshida
IPC分类号： C08K5/09 , B32B27/08
CPC分类号： C08K5/098 , C08K2201/008 , C08L29/04 , Y10T428/31736 , Y10T428/31797 , Y10T428/31928
摘要： The present invention provides a resin composition which is excellent in gas-barrier properties after a hot-water treatment and excellent in handling properties without increasing viscosity of the resin composition in a melt-kneading step at forming. The invention provides a resin composition containing a thermoplastic resin (A) and a partially dehydrated product or completely dehydrated product (B) of hydrated carboxylic acid salt.
摘要翻译：本发明提供了一种树脂组合物，其在热水处理后的阻气性优异且处理性能优异，而在成型时的熔融捏合步骤中树脂组合物的粘度增加。本发明提供含有热塑性树脂（A）和水合羧酸盐的部分脱水产物或完全脱水产物（B）的树脂组合物。

25. 发明申请

US20110020626A1 RESIN COMPOSITION AND MULTILAYER STRUCTURE USING THE SAME 有权
标题翻译：树脂组合物和使用该树脂的多层结构
公开(公告)号：US20110020626A1
公开(公告)日：2011-01-27
申请号：US12866743
申请日：2009-04-10
申请人： Shinji Okamoto , Kouji Yamada
发明人： Shinji Okamoto , Kouji Yamada
IPC分类号： B32B27/08 , C08L29/04
CPC分类号： C08L23/0861 , B32B5/022 , B32B7/12 , B32B27/06 , B32B27/08 , B32B27/12 , B32B27/18 , B32B27/20 , B32B27/22 , B32B27/306 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2255/20 , B32B2255/205 , B32B2307/412 , B32B2307/514 , B32B2307/704 , B32B2307/7242 , B32B2307/7265 , B32B2439/00 , B32B2439/70 , B32B2439/80 , C08L29/04 , C08L77/00 , C08L2205/02 , Y10T428/31736 , Y10T428/31909 , Y10T428/31913 , C08L2666/06 , C08L2666/02 , C08L2666/04
摘要： The present invention provides a resin composition of a saponified ethylene-vinyl ester copolymer can provide a molded product including layer of the resin composition with less thickness variation and excellent gas-barrier properties, even if the layer is subjected to stretch forming such as deep drawing forming and vacuum-pressure forming where the layer is applied with different tension from side to side thereof in short time. The resin composition comprises an EVOH resin having ethylene content of 20 to 60 mol % and a PVA having 1,2-diol structural unit in a side chain. The present invention also provides a multilayer structure using the resin composition.
摘要翻译：本发明提供了一种皂化乙烯 - 乙烯基酯共聚物的树脂组合物，即使该层进行拉伸成形，例如深拉伸，也可以提供包含具有较小厚度变化和优异的阻气性的树脂组合物层的模塑制品形成和真空压力成形，其中在短时间内从一侧到另一侧以不同的张力施加该层。树脂组合物包含乙烯含量为20〜60摩尔％的EVOH树脂和侧链中具有1,2-二醇结构单元的PVA。本发明还提供使用该树脂组合物的多层结构。

26. 发明授权

US4857589A Hydrolyzed ethylene-vinyl acetate copolymer 失效
标题翻译：水解乙烯 - 乙酸乙烯酯共聚物
公开(公告)号：US4857589A
公开(公告)日：1989-08-15
申请号：US73722
申请日：1987-07-15
申请人： Shinji Okamoto , Masaaki Minakawa , Youiti Neki , Masasi Nakagiri
发明人： Shinji Okamoto , Masaaki Minakawa , Youiti Neki , Masasi Nakagiri
IPC分类号： C08F216/06 , C08F8/12 , C08F16/02 , C08L29/04
CPC分类号： C08F8/12 , C08F2800/20 , C08F2810/50
摘要： A hydrolyzed ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60% by mole and a defree of hydrolysis in the vinyl acetate component of at least 95% by mole, and having an ash content of not more than 20 ppm and an alkali metal content of not more than 5 ppm. The hydrolyzed copolymer of the invention can form films whose gas impermeability is not lowered even at high humidity.
摘要翻译：乙烯含量为20〜60摩尔％，乙酸乙烯酯成分中的水解率至少为95摩尔％，灰分为20ppm以下的水解乙烯 - 乙酸乙烯酯共聚物金属含量不超过5 ppm。本发明的水解共聚物可以形成即使在高湿度下气体不渗透性也不降低的膜。

27. 发明授权

US4677473A Soldering inspection system and method therefor 失效
标题翻译：焊接检查系统及其方法
公开(公告)号：US4677473A
公开(公告)日：1987-06-30
申请号：US795912
申请日：1985-11-07
申请人： Shinji Okamoto , Kazunari Yoshimura , Tomoharu Nakahara
发明人： Shinji Okamoto , Kazunari Yoshimura , Tomoharu Nakahara
IPC分类号： G01B11/24 , B23K1/00 , G01N21/88 , G01N21/956 , H04N7/18 , F21V33/00
CPC分类号： G01N21/95684 , G01N21/8806 , G01N2021/4742 , G01N2021/95638 , G01N21/8851
摘要： A soldering inspection system wherein light is irradiated on a soldered part at different incident angles by a light emitting means to collect information indicative of three-dimensional configuration of the soldered part and discriminate whether or not the configuration is acceptable. The three-dimensional configurational information can be obtained with light irradiated at least from two positions mutually of different angles with respect to the soldered part, the inspection is thereby made from quantitative viewpoint, and a highly precise result of the inspection is obtainable.
摘要翻译：一种焊接检查系统，其中通过发光装置以不同的入射角将光照射在焊接部件上，以收集指示焊接部件的三维构造的信息，并且判别该构造是否可接受。可以通过至少从相对于焊接部分的不同角度的两个位置照射的光获得三维结构信息，从而从定量的角度进行检查，并且可以获得高度精确的检查结果。

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