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21. 发明授权

US07727364B2 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell 有权
标题翻译：辅助电极封装在电镀槽的阳离子交换膜管中
公开(公告)号：US07727364B2
公开(公告)日：2010-06-01
申请号：US11362432
申请日：2006-02-24
申请人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
发明人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
IPC分类号： C25D17/12 , C25D7/12
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。包封的辅助电极组件通常包括设置在保护管中的辅助电极。

22. 发明申请

US20100050779A1 CARBON NANOTUBE-BASED LOAD CELLS 有权
标题翻译：基于碳纳米管的负载细胞
公开(公告)号：US20100050779A1
公开(公告)日：2010-03-04
申请号：US12201242
申请日：2008-08-29
申请人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
发明人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
IPC分类号： G01B7/16 , H01L49/00 , H01L21/66
CPC分类号： G01L1/20 , G01L1/18 , G01L5/0076 , Y10S977/953 , Y10S977/956
摘要： A robust, stand-alone load cell comprises a block of aligned carbon nanotubes with parallel electrodes on opposing sides of the block and an electrical circuit connected between the electrodes for measuring the electrical resistance of the block. The nanotubes are preferably aligned perpendicular to the electrodes. Carbon nanotube-based load cells may be incorporated into a wafer asssembly for characterizing semiconductor processing equipment. Such a wafer assembly includes two parallel wafers with a plurality of carbon nanotube load cells positioned between and attached to both wafers. The load cells are independently electrically connected to a device which monitors and records the resistivity of the load cell. According to further aspects of the invention, each of the load cell's parallel electrodes may be comprised of many small electrodes, where each small electrode on one side of the block has a corresponding small electrode on the opposing side of the block; corresponding pairs of small electrodes are connected in series to form a chain; an electrical circuit, connected to both ends of the chain of opposing pairs of electrodes, is used to measure the electrical resistance of the chain.
摘要翻译：坚固的独立测力传感器包括在块的相对侧上具有平行电极的对准碳纳米管块和连接在电极之间的用于测量块的电阻的电路。纳米管优选垂直于电极取向。可以将碳纳米管基称重传感器结合到用于表征半导体处理设备的晶片组件中。这种晶片组件包括两个平行的晶片，其中多个碳纳米管负载单元位于两个晶片之间并附着在两个晶片上。称重传感器独立地电连接到监测和记录称重传感器的电阻率的装置。根据本发明的另外的方面，每个负载传感器的平行电极可以由许多小电极组成，其中块的一侧上的每个小电极在块的相对侧具有相应的小电极; 相应的一对小电极串联连接形成链条; 连接到相对电极对的链的两端的电路用于测量链的电阻。

23. 发明授权

US07500901B2 Data processing for monitoring chemical mechanical polishing 有权
标题翻译：数据处理用于监测化学机械抛光
公开(公告)号：US07500901B2
公开(公告)日：2009-03-10
申请号：US11222561
申请日：2005-09-08
申请人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
发明人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
摘要翻译：实施用于监测抛光衬底的技术的方法和装置。获取两个或多个数据点，其中每个数据点具有受传感器感测区域内的特征影响的值，并且对应于感测区域穿过衬底的衬底和传感器的相对位置。一组参考点用于修改采集的数据点。该修改补偿由穿过衬底的感测区域引起的所获取的数据点中的失真。基于修改的数据点，评估基板的局部特性以监测抛光。

24. 发明申请

US20070135958A1 INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING 有权
标题翻译：具有光和电流监测的集成端点检测系统
公开(公告)号：US20070135958A1
公开(公告)日：2007-06-14
申请号：US11677450
申请日：2007-02-21
申请人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
发明人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫的厚度。涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

25. 发明授权

US07195536B2 Integrated endpoint detection system with optical and eddy current monitoring 有权
标题翻译：具有光学和涡流监测的集成端点检测系统
公开(公告)号：US07195536B2
公开(公告)日：2007-03-27
申请号：US11217598
申请日：2005-08-31
申请人： Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
发明人： Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00 , B24B19/00 , G01H3/12 , G01N9/24
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫的厚度。涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

26. 发明申请

US20060266653A1 In-situ profile measurement in an electroplating process 失效
标题翻译：电镀工艺中的原位型材测量
公开(公告)号：US20060266653A1
公开(公告)日：2006-11-30
申请号：US11137711
申请日：2005-05-25
申请人： Manoocher Birang , Nicolay Kovarsky , Bernardo Donoso
发明人： Manoocher Birang , Nicolay Kovarsky , Bernardo Donoso
IPC分类号： C25D21/12
CPC分类号： G01B7/06 , C25D7/123 , C25D17/001 , C25D21/12 , G01B7/287 , H01L21/67253 , Y10T428/24802
摘要： A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
摘要翻译：一种用于测量电化学电镀单元的电解质中的差分电压的方法和装置。电流密度根据测得的差分电压计算，并与电镀材料的厚度值相关。可以从厚度值产生实时厚度分布。

27. 发明授权

US07137879B2 Conductive polishing article for electrochemical mechanical polishing 有权
公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

28. 发明申请

US20060246822A1 System and method for in-line metal profile measurement 审中-公开
标题翻译：在线金属型材测量的系统和方法
公开(公告)号：US20060246822A1
公开(公告)日：2006-11-02
申请号：US11479299
申请日：2006-06-29
申请人： Boguslaw Swedek , Nils Johansson , Andreas Wiswesser , Manoocher Birang
发明人： Boguslaw Swedek , Nils Johansson , Andreas Wiswesser , Manoocher Birang
IPC分类号： B24B51/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译：一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。可以使用附加的探针。

29. 发明授权

US07101254B2 System and method for in-line metal profile measurement 有权
公开(公告)号：US07101254B2
公开(公告)日：2006-09-05
申请号：US10966948
申请日：2004-10-15
申请人： Boguslaw A Swedek , Nils Johansson , Andreas Norbert Wiswesser , Manoocher Birang
发明人： Boguslaw A Swedek , Nils Johansson , Andreas Norbert Wiswesser , Manoocher Birang
IPC分类号： B24B49/00 , B24B1/00
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

30. 发明授权

US07101251B2 Polishing system with in-line and in-situ metrology 有权
标题翻译：具有在线和原位计量的抛光系统
公开(公告)号：US07101251B2
公开(公告)日：2006-09-05
申请号：US11166022
申请日：2005-06-23
申请人： Boguslaw A. Swedek , Bret W. Adams , Sanjay Rajaram , David A. Chan , Manoocher Birang
发明人： Boguslaw A. Swedek , Bret W. Adams , Sanjay Rajaram , David A. Chan , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.
摘要翻译：描述了用于化学机械抛光中的过程控制的计算机程序产品。该产品包括使得处理器从测量站接收基底层的初始预抛光厚度的测量的指令，从衬底的初始厚度确定端点算法的参数的值，接收通过监测衬底的原位抛光产生的监测信号，处理监控信号以检测指示最终或中间端点的信号特征，并且当使用具有确定的值的端点算法检测到端点标准时，发送指令停止抛光参数。

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