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    • 21. 发明申请
    • LITHIUM SECONDARY BATTERY AND MANUFACTURING METHOD THEREOF
    • 锂二次电池及其制造方法
    • US20130067726A1
    • 2013-03-21
    • US13604675
    • 2012-09-06
    • Kazutaka KURIKINobuhiro InoueKai Kimura
    • Kazutaka KURIKINobuhiro InoueKai Kimura
    • H01M10/04
    • H01M10/052H01M10/058H01M10/446H01M2220/30Y02E60/122Y02P70/54Y10T29/49108
    • An object is to improve the cycle performance by improving the reactivity between lithium and a negative electrode active material in the case where an alloy-based material such as silicon is used as the negative electrode active material. A method of manufacturing a lithium secondary battery including a positive electrode including a positive electrode active material into/from which lithium can be inserted/extracted, a negative electrode including a negative electrode active material into/from which lithium can be inserted/extracted, and an electrolyte solution is provided. The method includes the steps of electrochemically inserting lithium into the negative electrode with use of a counter electrode before the lithium secondary battery is assembled, electrochemically extracting part of the lithium inserted into the negative electrode after the insertion, and assembling the lithium secondary after the extraction.
    • 本发明的目的是通过提高锂和负极活性物质之间的反应性来提高循环性能,在使用诸如硅的合金基材料作为负极活性物质的情况下。 一种制造锂二次电池的方法,该锂二次电池包括可以插入/提取锂的正极活性物质的正极,能够插入/提取锂的负极活性物质的负极,以及 提供电解质溶液。 该方法包括在组装锂二次电池之前使用对电极将锂电化学插入负极的步骤,在插入之后电化学提取插入到负极中的锂的一部分,并在提取后组装锂二次 。
    • 28. 发明申请
    • SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
    • 半导体衬底,制造半导体衬底的方法,半导体器件和电子器件
    • US20100291753A1
    • 2010-11-18
    • US12840379
    • 2010-07-21
    • Tetsuya KAKEHATAKazutaka KURIKI
    • Tetsuya KAKEHATAKazutaka KURIKI
    • H01L21/762
    • H01L21/76254
    • A single crystal semiconductor layer is formed over a substrate having an insulating surface by the following steps: forming an ion doped layer at a given depth from a surface of a single crystal semiconductor substrate; performing plasma treatment to the surface of the single crystal semiconductor substrate; forming an insulating layer on the single crystal semiconductor substrate to which the plasma treatment is performed; bonding the single crystal semiconductor substrate to the substrate having the insulating surface with an insulating layer interposed therebetween; and separating the single crystal semiconductor substrate using the ion doped layer as a separation surface. As a result, a semiconductor substrate in which a defect in an interface between the single crystal semiconductor layer and the insulating layer is reduced can be provided.
    • 通过以下步骤在具有绝缘表面的衬底上形成单晶半导体层:从单晶半导体衬底的表面形成在给定深度处的离子掺杂层; 对所述单晶半导体衬底的表面进行等离子体处理; 在进行等离子体处理的单晶半导体基板上形成绝缘层; 将单晶半导体衬底与绝缘表面的衬底接合在绝缘层之间; 以及使用离子掺杂层作为分离表面分离单晶半导体衬底。 结果,可以提供其中单晶半导体层和绝缘层之间的界面的缺陷减小的半导体衬底。