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21. 发明申请

US20060142055A1 Printed circuit board structure for mobile terminal 审中-公开
标题翻译：移动终端印刷电路板结构
公开(公告)号：US20060142055A1
公开(公告)日：2006-06-29
申请号：US11114432
申请日：2005-04-26
申请人： Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
发明人： Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H04B1/28 , H04M1/00
CPC分类号： H01L25/162 , H01L23/50 , H01L23/66 , H01L2924/0002 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H05K1/0231 , H05K1/0237 , H05K1/0262 , H05K1/141 , H05K1/147 , H05K2201/10689 , H01L2924/00
摘要： A printed circuit board structure for a mobile terminal including a main printed circuit board including elements required for functions of the mobile terminal and mounted on an upper surface of the main printed circuit board, and an auxiliary printed circuit board laminated on the main printed circuit board including at least one element further required for the functions of the mobile terminal and mounted on an upper surface of the auxiliary printed circuit board.
摘要翻译：一种用于移动终端的印刷电路板结构，包括主印刷电路板，其包括移动终端的功能所需的元件，并且安装在主印刷电路板的上表面上，以及叠层在主印刷电路板上的辅助印刷电路板包括移动终端的功能进一步需要并安装在辅助印刷电路板的上表面上的至少一个元件。

22. 发明申请

US20050006654A1 Semiconductor monolithic integrated optical transmitter 失效
标题翻译：半导体单片集成光发射机
公开(公告)号：US20050006654A1
公开(公告)日：2005-01-13
申请号：US10716653
申请日：2003-11-19
申请人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
发明人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
IPC分类号： G02B6/12 , H01L33/00 , H01S5/026
CPC分类号： H01S5/026 , H01S5/0265
摘要： A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.
摘要翻译：公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

23. 发明授权

US07301751B2 Embedded capacitor 失效
标题翻译：嵌入式电容器
公开(公告)号：US07301751B2
公开(公告)日：2007-11-27
申请号：US11229756
申请日：2005-09-19
申请人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H01G4/06 , H01G4/005 , H01G4/228
CPC分类号： H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要： An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译：嵌入式电容器包括：第一基板，其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板，堆叠在第一和第二基板之间的多个电介质层，多个金属层插入在电介质层之间并连接到第一衬底的电极图案，以及多个接地层与金属层交替地插入在电介质层之间。

24. 发明申请

US20060098386A1 Embedded capacitor and method for manufacturing the same 失效
标题翻译：嵌入式电容器及其制造方法
公开(公告)号：US20060098386A1
公开(公告)日：2006-05-11
申请号：US11229756
申请日：2005-09-19
申请人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H01G4/30
CPC分类号： H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要： An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译：嵌入式电容器包括：第一基板，其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板，堆叠在第一和第二基板之间的多个电介质层，多个金属层插入在电介质层之间并连接到第一衬底的电极图案，以及多个接地层与金属层交替地插入在电介质层之间。

25. 发明授权

US07245644B2 Semiconductor monolithic integrated optical transmitter 失效
标题翻译：半导体单片集成光发射机
公开(公告)号：US07245644B2
公开(公告)日：2007-07-17
申请号：US10716653
申请日：2003-11-19
申请人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
发明人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
IPC分类号： H01S5/00
CPC分类号： H01S5/026 , H01S5/0265
摘要： A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.
摘要翻译：公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

26. 发明授权

US07236505B2 Fabry-perot laser generating mode-locked channel and method for fabricating the same 有权
标题翻译：法布里珀罗激光产生锁模通道及其制造方法
公开(公告)号：US07236505B2
公开(公告)日：2007-06-26
申请号：US10794980
申请日：2004-03-05
申请人： Shi-Yun Cho
发明人： Shi-Yun Cho
IPC分类号： H01S3/098
CPC分类号： H01S5/10 , H01S5/028 , H01S5/1057 , H01S5/1096 , H01S2304/00
摘要： A Fabry-Perot laser generates a mode-locked channel having the same wavelength as that of light injected into the laser. The laser includes a semiconductor substrate and a lower cladding layer formed on the substrate. An active layer is formed on the lower cladding layer and has a band gap distribution that continuously varies in a longitudinal direction of the substrate. The laser further includes an upper cladding layer formed on the active layer and the lower cladding layer.
摘要翻译：法布里 - 珀罗激光器产生具有与注入激光器的光相同波长的锁模通道。激光器包括半导体衬底和形成在衬底上的下覆盖层。在下包层上形成有源层，并具有在基板的长度方向上连续变化的带隙分布。激光器还包括形成在有源层和下包层上的上包层。

27. 发明申请

US20050041698A1 Fabry-perot laser generating mode-locked channel and method for fabricating the same 有权
标题翻译：法布里珀罗激光产生锁模通道及其制造方法
公开(公告)号：US20050041698A1
公开(公告)日：2005-02-24
申请号：US10794980
申请日：2004-03-05
申请人： Shi-Yun Cho
发明人： Shi-Yun Cho
IPC分类号： H01S5/0687 , H01S3/098 , H01S5/00 , H01S5/028 , H01S5/10
CPC分类号： H01S5/10 , H01S5/028 , H01S5/1057 , H01S5/1096 , H01S2304/00
摘要： A Fabry-Perot laser generates a mode-locked channel having the same wavelength as that of light injected into the laser. The laser includes a semiconductor substrate and a lower cladding layer formed on the substrate. An active layer is formed on the lower cladding layer and has a band gap distribution that continuously varies in a longitudinal direction of the substrate. The laser further includes an upper cladding layer formed on the active layer and the lower cladding layer.
摘要翻译：法布里 - 珀罗激光器产生具有与注入激光器的光相同波长的锁模通道。激光器包括半导体衬底和形成在衬底上的下覆盖层。在下包层上形成有源层，并具有在基板的长度方向上连续变化的带隙分布。激光器还包括形成在有源层和下包层上的上包层。

28. 发明授权

US06859298B2 Optical module of optical isolator structure 有权
标题翻译：光隔离器结构光模块
公开(公告)号：US06859298B2
公开(公告)日：2005-02-22
申请号：US10713488
申请日：2003-11-14
申请人： Shi-Yun Cho
发明人： Shi-Yun Cho
IPC分类号： G02B5/30 , G02B27/28 , G02F1/09 , H01S5/068 , G02B6/26
CPC分类号： G02F1/093
摘要： Disclosed is an optical module of an isolator structure including a semiconductor laser, a polarizer, and a Faraday rotator. The laser outputs a first linearly-polarized beam of a predetermined polarization mode. The polarizer is positioned to face an end of the laser, and its polarization axis is tilted at a 45° angle with respect to the polarization direction of the first beam. The Faraday rotator is disposed between the laser and the polarizer, and rotate the polarization direction of the first beam by 45° to substantially coincide with the polarization axis of the polarizer, and then output it to the polarizer, and to rotate a second beam from the polarizer by 45°, wherein the second beam has a polarization mode polarized perpendicular to the first beam, and then output it to the semiconductor laser.
摘要翻译：公开了包括半导体激光器，偏振器和法拉第旋转器的隔离器结构的光学模块。激光器输出预定偏振模式的第一线性偏振光束。偏振器被定位成面对激光器的端部，并且其偏振轴相对于第一光束的偏振方向以45°的角度倾斜。法拉第旋转体设置在激光和偏振器之间，并将第一光束的偏振方向旋转45°，以与偏振器的偏振轴基本一致，然后将其输出到偏振器，并将第二光束从所述偏振器为45°，其中所述第二光束具有垂直于所述第一光束偏振的偏振模，然后将其输出到所述半导体激光器。

29. 发明授权

US08772918B2 Semiconductor die package and embedded printed circuit board 有权
标题翻译：半导体封装和嵌入式印刷电路板
公开(公告)号：US08772918B2
公开(公告)日：2014-07-08
申请号：US12029502
申请日：2008-02-12
申请人： Shi-Yun Cho
发明人： Shi-Yun Cho
IPC分类号： H01L23/06
CPC分类号： H01L23/3677 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor die package having an enhanced degree of heating radiation from the semiconductor, thereby reducing mechanical and electrical failure from excessive temperatures. A semiconductor die has circuit patterns formed thereon; a bump pad deposited on the semiconductor die and supporting at least one of the bumps electrically connected to the circuit patterns; and a radiating pad formed on an upper surface of the bump pad such that the radiating pad surrounds the bumps. An embedded printed circuit substrate includes a radiating pad formed on the bump pad to surround the bumps; and a core substrate has a through-hole formed in the core substrate, that extends from an upper surface of the core substrate to a lower surface thereof. The semiconductor die is deposited on the upper surface of the core substrate such that the bumps extend through the through-hole.
摘要翻译：具有来自半导体的增强的加热辐射度的半导体管芯封装，从而减少过度温度的机械和电气故障。半导体管芯具有形成在其上的电路图案; 沉积在所述半导体管芯上并且支撑电连接到所述电路图案的所述凸块中的至少一个的凸块; 以及辐射焊盘，其形成在所述凸块焊盘的上表面上，使得所述辐射焊盘围绕所述凸块。嵌入式印刷电路基板包括形成在凸块焊盘上以围绕凸块的辐射焊盘; 并且芯基板具有形成在芯基板中的通孔，其从芯基板的上表面延伸到其下表面。半导体管芯沉积在芯基板的上表面上，使得凸块延伸穿过通孔。

30. 发明申请

US20080192449A1 ELECTRIC CIRCUIT PACKAGE 审中-公开
标题翻译：电路包装
公开(公告)号：US20080192449A1
公开(公告)日：2008-08-14
申请号：US12028864
申请日：2008-02-11
申请人： Dong-Churl Kim , Shi-Yun Cho , Hong-Kweun Kim , Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
发明人： Dong-Churl Kim , Shi-Yun Cho , Hong-Kweun Kim , Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
IPC分类号： H05K7/00
CPC分类号： H05K9/0022 , H01L23/3121 , H01L23/49811 , H01L23/50 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3025 , H05K1/0218 , H05K3/284 , H05K2201/10318 , H05K2203/1316 , H01L2224/0401
摘要： An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.
摘要翻译：电路封装包括：印刷电路基板，其具有绝缘层和形成在所述绝缘层的上表面上的导电图案层; 设置在印刷电路基板的上表面上的电子部件中的至少一个; 至少一个导电引脚与导电图案层电连接，在导电图案层之间提供接地; 以及模制构件，其形成在所述绝缘层上，使得所述导电销和所述电气部件被埋在所述模制构件中，其中每个导电销具有暴露于所述模制构件的上部的上表面。

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