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21. 发明授权

US07733096B2 Methods of testing fuse elements for memory devices 失效
标题翻译：测试存储器件熔丝元件的方法
公开(公告)号：US07733096B2
公开(公告)日：2010-06-08
申请号：US11731960
申请日：2007-04-02
申请人： Sung-Chieh Lin , Po-Hung Chen
发明人： Sung-Chieh Lin , Po-Hung Chen
IPC分类号： G01R31/02
CPC分类号： G11C29/02 , G11C17/165 , G11C29/027
摘要： A method of testing a fuse element for a memory device is provided. A first test probe is electrically connected to a program terminal of the memory device. A second test probe is electrically connected to a ground terminal. The fuse element is on an electrical circuit path between the program terminal and the ground terminal. The first and second test probes are electrically connected to a testing device. A first voltage is applied with the testing device between the program terminal and the ground terminal. At least part of a first current of the first voltage flows across the fuse element. The first voltage and the at least part of the first current that flows across the fuse element is not large enough to change the conductivity state of the fuse element. The first current is measured and used to evaluated the conductive state of the fuse element.
摘要翻译：提供一种测试用于存储器件的熔丝元件的方法。第一测试探针电连接到存储器件的程序终端。第二测试探针电连接到接地端子。保险丝元件位于程序端子和接地端子之间的电路上。第一和第二测试探针电连接到测试装置。测试设备在程序终端和接地端子之间施加第一个电压。第一电压的第一电流的至少一部分流过熔丝元件。在熔断元件上流动的第一电流和第一电流的至少一部分不足以改变熔丝元件的导电状态。测量第一电流并用于评估熔丝元件的导电状态。

22. 发明授权

US07459629B2 Extension box of storage media 有权
标题翻译：扩展箱的存储介质
公开(公告)号：US07459629B2
公开(公告)日：2008-12-02
申请号：US11298539
申请日：2005-12-12
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H02G3/08
CPC分类号： G11B33/122 , G11B33/025 , G11B33/124 , G11B33/1426
摘要： The invention discloses an extension box of storage media, which mainly utilized a plurality of heat dissipation fins protruding from a bottom surface of a bottom shell of the extension box. The heat dissipation fins efficaciously dissipate heat from the storage media, so it improves the dissipation heat efficiency and reduces breakdown for the storage media. The extension box of storage media of the present invention is electrically connected with an external electronic apparatus by a universal series bus (USB) or an IEEE 1394 interface connector for transmitting a data.
摘要翻译：本发明公开了一种存储介质的扩展箱，主要利用从扩展箱的底壳的底面突出的多个散热片。散热片有效地从存储介质中散热，从而提高散热效率，减少存储介质的故障。本发明的存储介质的扩展盒通过通用串行总线（USB）或IEEE 1394接口连接器与外部电子设备电连接，用于发送数据。

23. 发明授权

US07358482B2 Packaging structure of a light-sensing element and fabrication method thereof 失效
标题翻译：光敏元件的包装结构及其制造方法
公开(公告)号：US07358482B2
公开(公告)日：2008-04-15
申请号：US11231842
申请日：2005-09-22
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01L27/14
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in order to envelop the light-sensing chip. Thereby, the present invention not only can clean pollutants completely and promote the yield, but also can reduce the packaging area. In the present invention, the engagement portions may also be formed on the substrate and the light transparent cover so that the alignment can be undertaken easily.
摘要翻译：本发明公开了一种感光元件的封装结构及其制造方法，其中，将感光芯片安装在基板上，然后进行清洁工序; 接下来，使用胶合材料将具有空腔的透明透明盖安装到基板上，以便包围感光芯片。因此，本发明不仅可以完全清洁污染物并提高产量，还可以减少包装面积。在本发明中，也可以在基板和透光盖上形成接合部，使得可以容易地进行对准。

24. 发明授权

US07282788B2 Image sensing chip package structure 失效
标题翻译：图像感测芯片封装结构
公开(公告)号：US07282788B2
公开(公告)日：2007-10-16
申请号：US11225078
申请日：2005-09-14
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01L23/02
CPC分类号： H04N5/2257 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H04N5/2253 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.
摘要翻译：在图像感测芯片封装结构中，通过通孔电镀穿过衬底以电连接设置在衬底的上表面和下表面上的金属化迹线。电镀通孔可以从衬底的中心打开，而不是位于衬底的周边。因此可以在胶水分配过程中避免污染，并且保护层也可用于密封由镀通孔形成的间隙，从而提高产量。此外，可以进一步使用具有粘性的保护层来固定部件，从而降低生产成本并提高产品质量。

25. 发明申请

US20070063129A1 Packaging structure of a light-sensing device with a spacer wall 失效
标题翻译：具有间隔壁的光感测装置的包装结构
公开(公告)号：US20070063129A1
公开(公告)日：2007-03-22
申请号：US11230506
申请日：2005-09-21
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01L31/00
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a packaging structure of a light-sensing device with a spacer wall, wherein a spacer wall is used to protect the light-sensing region from external pollutants or two spacer walls are used to confine the glue to therebetween lest the overflow glue pollute the light-sensing region as in the conventional technology. Further, the present invention can reduce the packaging area and can promote the yield and quality obviously.
摘要翻译：本发明公开了一种具有间隔壁的光感测装置的封装结构，其中使用间隔壁来保护光感测区域免受外部污染物的影响，或者使用两个间隔壁将胶水限制在其间，以防止溢出胶像常规技术那样污染光感测区域。此外，本发明可以减少包装面积，并且可以显着提高产量和质量。

26. 发明申请

US20070057356A1 Image sensing chip package structure 失效
公开(公告)号：US20070057356A1
公开(公告)日：2007-03-15
申请号：US11225078
申请日：2005-09-14
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01L23/02
CPC分类号： H04N5/2257 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H04N5/2253 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.

27. 发明授权

US06101138A Area efficient global row redundancy scheme for DRAM 有权
标题翻译：用于DRAM的区域有效的全局行冗余方案
公开(公告)号：US06101138A
公开(公告)日：2000-08-08
申请号：US358982
申请日：1999-07-22
申请人： Chun Shiah , Bor-Doou Rong , Jeng-Tzong Shih , Po-Hung Chen
发明人： Chun Shiah , Bor-Doou Rong , Jeng-Tzong Shih , Po-Hung Chen
IPC分类号： G11C29/00 , G11C7/00
CPC分类号： G11C29/808
摘要： In this invention a global row redundancy scheme for a DRAM is described which effectively uses the resources of the chip to produce an area efficient design. The DRAM is constructed from two types of memory blocks, one that has a redundant cell array and one that does not. Both memory block types contain a memory cell array and bit line sense amplifiers. The bit line sense amplifiers, contained on the block with the redundant cell array, are shared with the memory cell array also contained in the block, and thus eliminating the need for sense amplifiers for use only with the redundant cell array. Although, every block could contain a redundant cell array, only one or two blocks with the redundant cell array are normally used. In the global row redundancy scheme repair can be made to any row containing a failed memory cell located in any memory block by using any unused rows in any redundant cell array, and in doing so provides a maximum effectiveness in repairing DRAM's that provides the opportunity to maximize yield.
摘要翻译：在本发明中，描述了用于DRAM的全局行冗余方案，其有效地使用芯片的资源来产生区域有效的设计。 DRAM由两种类型的存储器块构成，一个具有冗余单元阵列，另一个不存在。这两种存储块类型都包含存储单元阵列和位线读出放大器。包含在具有冗余单元阵列的块上的位线读出放大器与也包含在该块中的存储单元阵列共享，因此不需要仅用于冗余单元阵列的读出放大器。尽管每个块都可以包含冗余单元阵列，但通常只使用一个或两个具有冗余单元阵列的块。在全局行冗余方案中，可以通过使用任何冗余单元阵列中的任何未使用的行来修复任何包含位于任何存储器块中的故障存储器单元的行，并且这样做可以提供修复提供机会的DRAM的最大有效性最大化产量。

28. 发明授权

US10411394B2 Connector with latch protection 有权
公开(公告)号：US10411394B2
公开(公告)日：2019-09-10
申请号：US16124200
申请日：2018-09-07
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01R29/00 , H01R13/506 , H01R13/6585 , H01R13/405 , H01R12/71 , H01R13/627 , H01R13/6583 , H01R24/60 , H01R107/00
摘要： A connector with latch protection includes a metal casing, an insulating body, plural metal terminals and a partition. The insulating body covers the interior of the metal casing and has a tab extended forwardly from the front of the insulating body and disposed apart on the top and bottom of the tab respectively, and both sides of the tab corresponding to a connecting plug form an inwardly concave portion, and both sides of the partition have a protection plate corresponding to each inwardly concave portion and the front of the tab and bent and extended forwardly. When the partition is embedded into the insulating body by a molding method, a portion of the two metal protection plates exposed from the tab forms a pair of latch grooves for latching the connecting plug to effectively improve the durability and life and lower the manufacturing cost of the connector significantly.

29. 发明授权

US08646950B2 Display apparatus 有权
标题翻译：显示装置
公开(公告)号：US08646950B2
公开(公告)日：2014-02-11
申请号：US13657974
申请日：2012-10-23
申请人： Yi-Fan Lin , Shih-Yao Lin , Chieh-Jen Cheng , Po-Hung Chen
发明人： Yi-Fan Lin , Shih-Yao Lin , Chieh-Jen Cheng , Po-Hung Chen
IPC分类号： B60Q3/04
CPC分类号： G02B6/0088 , G02B6/0055 , G02B6/009
摘要： A display apparatus includes a panel module and a backlight module. The backlight module is disposed under the panel module. The backlight module includes a frame, a light guide plate, and a reflector. The frame supports the edge of the light guide plate. The reflector is disposed at the bottom of the light guide plate. The edge of the reflector and the edge of the frame horizontally form an engaging seam without overlapping, and the engaging seam is substantially in a serrated shape.
摘要翻译：显示装置包括面板模块和背光模块。背光模块设置在面板模块下方。背光模块包括框架，导光板和反射器。框架支撑导光板的边缘。反射器设置在导光板的底部。反射器的边缘和框架的边缘水平地形成接合缝而不重叠，并且接合缝基本上是锯齿形的。

30. 发明申请

US20130107571A1 DISPLAY APPARATUS 有权
标题翻译：显示设备
公开(公告)号：US20130107571A1
公开(公告)日：2013-05-02
申请号：US13657974
申请日：2012-10-23
申请人： Yi-Fan LIN , Shih-Yao Lin , Chieh-Jen Cheng , Po-Hung Chen
发明人： Yi-Fan LIN , Shih-Yao Lin , Chieh-Jen Cheng , Po-Hung Chen
IPC分类号： G09F13/04 , F21V8/00 , F21V7/04
CPC分类号： G02B6/0088 , G02B6/0055 , G02B6/009
摘要： A display apparatus includes a panel module and a backlight module. The backlight module is disposed under the panel module. The backlight module includes a frame, a light guide plate, and a reflector. The frame supports the edge of the light guide plate. The reflector is disposed at the bottom of the light guide plate. The edge of the reflector and the edge of the frame horizontally form an engaging seam without overlapping, and the engaging seam is substantially in a serrated shape.
摘要翻译：显示装置包括面板模块和背光模块。背光模块设置在面板模块下方。背光模块包括框架，导光板和反射器。框架支撑导光板的边缘。反射器设置在导光板的底部。反射器的边缘和框架的边缘水平地形成接合缝而不重叠，并且接合缝基本上是锯齿形的。

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