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21. 发明授权

US06753093B2 Heat dissipating material and manufacturing method thereof 失效
标题翻译：散热材料及其制造方法
公开(公告)号：US06753093B2
公开(公告)日：2004-06-22
申请号：US10247953
申请日：2002-09-20
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Takashi Yoshida , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B702
CPC分类号： B32B15/015 , B22D19/14 , C22C1/0475 , H01L21/4871 , H01L23/3735 , H01L24/32 , Y10T428/12063 , Y10T428/12069 , Y10T428/12493 , Y10T428/12528 , Y10T428/12951
摘要： A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.
摘要翻译：散热器包括电磁软铁片和形成在片材表面上的镀层。该板由防锈金属制成。电子部件安装在具有HITT基板的铝基座和散热器之间。散热器以低成本制造并且具有作为散热材料的有利特性。

22. 发明授权

US06597574B2 Radiator plate and process for manufacturing the same 失效
公开(公告)号：US06597574B2
公开(公告)日：2003-07-22
申请号：US10038265
申请日：2001-10-24
申请人： Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： H05K720
CPC分类号： H01L23/3733 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller than that of the metallic matrix. The radiator plate has a heat-receiving surface, on which an electric device serving as a heat generator is disposed, and a heat-radiating surface for radiating heat received from the heat-receiving surface. The dispersant is dispersed more on the heat-receiving-surface side than on the heat-radiating-surface side. Thus, the radiator plate is inhibited from warping, and is good in terms of the dimensional stability as a final product. Moreover, the thermal resistance is diminished between the heat-receiving surface and the heat-radiating surface. Accordingly, the heat-radiating ability of the radiator plate is secured. Also disclosed is a process for manufacturing the radiator plate.

23. 发明申请

US20140140004A1 HEAT SINK FOR POWER MODULE 审中-公开
标题翻译：电源模块散热器
公开(公告)号：US20140140004A1
公开(公告)日：2014-05-22
申请号：US13779519
申请日：2013-02-27
申请人： Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.
摘要翻译：功率模块包括功率器件和散热器。散热器包括冷却介质流动的制冷剂通道和布置在制冷剂通道中的波纹状散热片体。制冷剂通道由表面和背面限定，并且动力装置设置在表面附近。波纹状散热片本体具有沿着冷却介质的流动方向延伸的波峰和波谷，每个侧壁将相应的波峰与相邻的波谷连接。布置在相邻侧壁之间的每个相邻的一对侧壁和相应的一个峰或相应的一个槽形成翅片。在每个散热片中布置有沿冷却介质的流动方向延伸并且用于搅拌冷却介质的引导件。

24. 发明授权

US08411438B2 Heat sink for power module 失效
标题翻译：电源模块散热片
公开(公告)号：US08411438B2
公开(公告)日：2013-04-02
申请号：US11922945
申请日：2006-06-27
申请人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
摘要翻译：用于功率模块的散热器（1）能够将功率器件（101）安装在散热器的至少一个表面上。散热器包括散发由动力装置（101）产生的热量的冷却介质流动的制冷剂通路（1d）和布置在制冷剂通路（1d）中的波纹状散热片体（1a）。波纹状散热片体（1a）具有在冷却介质的流动方向上延伸的波峰（21b）和槽（21c），以及各个顶部（21b）的相应一个与相邻的顶部一个槽（21c）。布置在相邻侧壁（21a）之间的每个相邻的一对侧壁（21a）和相应的一个峰（21b）或相应的一个槽（21c）形成翅片（21）。每个侧壁（21a）具有操作以使至少旋转在相关联的翅片（21）中流动的冷却介质的百叶窗（31）。因此，散热器（1）具有进一步改善的散热性能。

25. 发明授权

US08299606B2 Semiconductor device includes a ceramic substrate and heat sink 有权
标题翻译：半导体器件包括陶瓷衬底和散热器
公开(公告)号：US08299606B2
公开(公告)日：2012-10-30
申请号：US13361446
申请日：2012-01-30
申请人： Shogo Mori , Eiji Kono , Keiji Toh
发明人： Shogo Mori , Eiji Kono , Keiji Toh
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.
摘要翻译：提供一种半导体器件，其可以包括具有陶瓷衬底和在陶瓷衬底的相对表面上的金属涂层的绝缘衬底，安装在绝缘衬底的一个表面上的半导体芯片和直接或间接固定到另一个的散热器绝缘基板的表面，并通过绝缘基板热连接到半导体芯片。散热器可以包括由金属板制成的壳体和固定在壳体中并由铝制成的散热片。金属片可以具有绝缘基板和散热片之间的热膨胀系数。

26. 发明授权

US08283773B2 Semiconductor device having anti-warping sheet 有权
标题翻译：具有抗翘曲片的半导体装置
公开(公告)号：US08283773B2
公开(公告)日：2012-10-09
申请号：US12698183
申请日：2010-02-02
申请人： Shogo Mori , Eiji Kono , Keiji Toh
发明人： Shogo Mori , Eiji Kono , Keiji Toh
IPC分类号： H01L23/06 , H01L23/15 , H01L23/10 , H01L23/34
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.
摘要翻译：半导体器件包括：绝缘基板，具有陶瓷基板和在陶瓷基板的相对表面上的金属涂层，安装在绝缘基板的一个表面上的半导体芯片，直接或间接地固定到绝缘基板的另一个表面的散热片并且通过所述绝缘基板与所述半导体芯片热连接，以及设置在所述散热器的至少一个表面上的至少一个抗翘曲板。防翘曲片由具有涂层的金属片制成，并且在绝缘基板和散热片之间具有热膨胀系数。

27. 发明申请

US20090174063A1 Semiconductor Module 有权
标题翻译：半导体模块
公开(公告)号：US20090174063A1
公开(公告)日：2009-07-09
申请号：US12086715
申请日：2006-12-11
申请人： Yuichi Furukawa , Shinobu Yamauchi , Nobuhiro Wakabayashi , Shintaro Nakagawa , Keiji Toh , Eiji Kono , Kota Otoshi , Katsufumi Tanaka
发明人： Yuichi Furukawa , Shinobu Yamauchi , Nobuhiro Wakabayashi , Shintaro Nakagawa , Keiji Toh , Eiji Kono , Kota Otoshi , Katsufumi Tanaka
IPC分类号： H01L23/06 , H01L23/535 , H01L23/34 , H01L23/48
CPC分类号： H01L23/3735 , H01L23/367 , H01L23/473 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.
摘要翻译：半导体模块10包括陶瓷基板，其具有安装有半导体元件12的前表面和在前表面的相对侧上的后表面，与前表面接合的前金属板15，后金属板16接合后部金属板16包括面向散热片13的接合面16b。接合面16b包括接合区域和非接合区域。非接合区域包括在后金属板16的厚度方向上延伸的凹部18.后金属板16的接合面积在接合面16b的总面积的65％〜85％的范围内后金属板16.结果，可以在发生由于热应力引起的变形和开裂的同时实现优异的散热性能。

28. 发明申请

US20090156051A1 HDMI source detection 失效
标题翻译： HDMI源检测
公开(公告)号：US20090156051A1
公开(公告)日：2009-06-18
申请号：US12002378
申请日：2007-12-17
申请人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
发明人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
IPC分类号： H01R3/00
CPC分类号： H04N5/44 , G09G5/006 , G09G2320/08 , G09G2370/047 , G09G2370/12 , H01R13/641 , H04N21/43635 , H04N21/44231
摘要： A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
摘要翻译：用于通过HDMI接收器连接器将HDMI源设备检测到HDMI信宿设备的电路不考虑HDMI源设备的活动状态，具有上拉电阻器，其具有第一和第二端子，其中第一端子耦合到DC电源资源。开关器件在电路节点处耦合在上拉电阻器的第二端子和地之间。当从HDMI接收器连接器电源引脚向其控制端施加电力时，切换装置被接通以将电路节点耦合到地，否则被切断。电路节点耦合到HDMI接收器连接器的DDC / CEC GROUND引脚。电路节点可读取为二进制信号，以指示源设备到HDMI接收器连接器的存在，其中当节点通过DDC / CEC GROUND引脚连接到源设备接地时，节点呈现逻辑低信号，或当开关器件接通时。该摘要不被认为是限制性的，因为其他实施例可能偏离本摘要中描述的特征。

29. 发明申请

US20080231754A1 System and method for dynamically establishing microdisplay driver offsets using brightness value in rear projection TV having dynamic iris control 审中-公开
标题翻译：使用具有动态光圈控制的背投电视中的亮度值动态地建立微显示器驱动器偏移的系统和方法
公开(公告)号：US20080231754A1
公开(公告)日：2008-09-25
申请号：US11726565
申请日：2007-03-22
申请人： Orlando Arreola , Vincent V. Du , Eiji Kono , Tuan pham , Yoshiaki Shimizu , Khoua Vang , Jesus Villalpando
发明人： Orlando Arreola , Vincent V. Du , Eiji Kono , Tuan pham , Yoshiaki Shimizu , Khoua Vang , Jesus Villalpando
IPC分类号： H04N5/57
CPC分类号： H04N9/31 , H04N5/57 , H04N5/7408 , H04N9/73 , H04N21/42202 , H04N21/4318
摘要： In a rear projection microdisplay TV with dynamic iris control, sensed average picture level (APL) or other sensed brightness level is used to dynamically establish microdisplay driver offsets including white balance.
摘要翻译：在具有动态光圈控制的背投式微型显示器TV中，使用感测平均图像电平（APL）或其他感测亮度级别来动态地建立包括白平衡的微显示驱动器偏移。

30. 发明申请

US20060249500A1 Method of manufacturing composite material 审中-公开
标题翻译：制造复合材料的方法
公开(公告)号：US20060249500A1
公开(公告)日：2006-11-09
申请号：US11412334
申请日：2006-04-26
申请人： Hidehiro Kudo , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Hidehiro Kudo , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： C22C1/05 , B22D18/02 , B22D19/14 , B22D27/09
CPC分类号： C22C1/1094 , B22D19/14 , B22F2998/10 , C22C1/1036 , C22C2001/1073 , B22F3/14
摘要： A method of manufacturing metal matrix composite with ceramic particles as a disperse phase includes the steps of holding the single metal matrix composite or the plurality of layered metal matrix composites between a pair of pressing dies, pressing the metal matrix composite by the pressing dies, and heating the metal matrix composite.
摘要翻译：制造具有陶瓷颗粒作为分散相的金属基复合材料的方法包括将单金属基复合材料或多层金属基复合材料保持在一对压模之间的步骤，通过压模挤压金属基复合材料，以及加热金属基复合材料。

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