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21. 发明授权

US10553341B2 Coil component and module including the same 有权
公开(公告)号：US10553341B2
公开(公告)日：2020-02-04
申请号：US15351622
申请日：2016-11-15
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Norio Sakai
IPC分类号： H01F17/06 , H01F27/29
摘要： An improvement in coil characteristics is achieved by performing accurate positioning of a magnetic core. A coil component 2 includes a wiring substrate 3, a magnetic core 4 that has a ring-like shape and that is disposed on a bottom surface of the wiring board 3, and a coil electrode 5 that is wound around the magnetic core 4, and the coil electrode 5 includes a plurality of inner metallic pins 11a and outer metallic pins 11b that are vertically arranged around the magnetic core 4. First end portions of the plurality of inner and outer metallic pins 11a and 11b are each connected, with solder, to an end surface of a corresponding one of a plurality of via conductors 9a, the end surface being exposed at the bottom surface of the wiring board 3.

22. 发明授权

US10476133B2 Electrical element, mobile device, and method for manufacturing electrical element 有权
公开(公告)号：US10476133B2
公开(公告)日：2019-11-12
申请号：US15256822
申请日：2016-09-06
申请人： Murata Manufacturing Co., Ltd.
发明人： Bunta Okamoto , Isamu Morita , Satoshi Ishino , Jun Sasaki , Yoshihito Otsubo , Keisuke Araki , Norio Sakai
IPC分类号： H01Q1/24 , H01Q1/38 , H05K1/02 , H05K1/14 , H01Q1/48
摘要： An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

23. 发明申请

US20180366258A1 INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20180366258A1
公开(公告)日：2018-12-20
申请号：US15998734
申请日：2018-08-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Mitsuyoshi Nishide , Norio Sakai
IPC分类号： H01F27/29 , H05K1/18 , H01F27/24 , H01F27/28 , H01F41/04 , H05K3/30
CPC分类号： H01F27/29 , H01F17/0033 , H01F27/24 , H01F27/28 , H01F41/04 , H05K1/165 , H05K1/185 , H05K3/30 , H05K2201/1003 , H05K2203/1305
摘要： A small-sized inductor with desired characteristics is provided. An inductor 1a includes a resin layer 3 and an inductor electrode 6, which includes an inner winding portion 6a and an outer winding portion 6b. The inner winding portion 6a and the outer winding portion 6b forming the inductor electrode 6 include the metal pins 7a to 7d and the wiring boards 8a to 8d. Here, the inner winding portion 6a and the outer winding portion 6b include the metal pins 7a to 7d and the wiring boards 8a to 8d, which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode 6, and improve the characteristics of the inductor 1a. The inductor 1a can reduce its size by including the inductor electrode 6 wound to have a multiplex winding structure.

24. 发明申请

US20180090263A1 INDUCTOR COMPONENT 审中-公开
公开(公告)号：US20180090263A1
公开(公告)日：2018-03-29
申请号：US15809208
申请日：2017-11-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Shinichiro Banba , Mitsuyoshi Nishide , Norio Sakai , Haruhiko Mori
IPC分类号： H01F27/32 , H01F27/28 , H01F27/24
CPC分类号： H01F27/32 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/28 , H01F2017/002
摘要： A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

25. 发明授权

US09456494B2 Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate 有权
标题翻译：多层布线基板，探针卡，以及多层布线基板的制造方法
公开(公告)号：US09456494B2
公开(公告)日：2016-09-27
申请号：US14231780
申请日：2014-04-01
申请人： Murata Manufacturing Co., Ltd.
发明人： Norio Sakai , Yoshihito Otsubo
IPC分类号： H05K1/09 , H05K1/03 , H05K1/11 , H05K1/02 , H01L23/498 , H05K3/46
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/19105 , H05K1/115 , H05K3/4629 , H05K3/4652 , H05K2201/09709 , H05K2201/09827 , Y10T29/49165
摘要： A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.
摘要翻译：多层布线基板包括基板主体和多条布线。基板主体包括第一和第二主表面。多个布线从基板主体的第一主面向第二主面侧延伸。基板主体包括彼此层叠的多个绝缘体层。布线各自包括分开设置在多个绝缘体层中的通孔导体。在多个布线中的至少一个中，设置在限定基板主体的第一主表面的第一绝缘体层中的通孔导体的直径小于设置在多个布线中的至少一个布线中的通孔导体的直径的除了第一绝缘体层之外的绝缘体层。

26. 发明授权

US09253881B2 Multilayer flexible substrate 有权
标题翻译：多层柔性基板
公开(公告)号：US09253881B2
公开(公告)日：2016-02-02
申请号：US13903119
申请日：2013-05-28
申请人： Murata Manufacturing Co., Ltd.
发明人： Norio Sakai , Yoshihito Otsubo
IPC分类号： H05K1/00 , H05K1/02 , H05K3/46 , H05K1/11 , H05K3/40
CPC分类号： H05K1/0298 , H05K1/115 , H05K3/4069 , H05K3/4691 , H05K2201/0391
摘要： A multilayer flexible substrate includes a first structural layer including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and filled vias disposed in the insulating layer; and a second structural layer provided on a principal surface of a portion of the first structural layer and including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and a filled via provided in the insulating layer. The multilayer flexible substrate includes rigid regions and a flexible region that is more flexible than the rigid regions. In the multilayer flexible substrate, the filled via disposed in the flexible region has a higher porosity than the filled via disposed in the second structural layer.
摘要翻译：多层柔性基板包括：第一结构层，其包括至少一个包括绝缘层的树脂片，设置在绝缘层的主表面上的布线导体和布置在绝缘层中的填充通孔; 以及第二结构层，其设置在所述第一结构层的一部分的主表面上，并且包括至少一个包括绝缘层的树脂片，设置在所述绝缘层的主表面上的布线导体和设置在所述绝缘层的主表面上的填充通孔绝缘层。多层柔性基板包括刚性区域和比刚性区域更柔性的柔性区域。在多层柔性基板中，设置在柔性区域中的填充通孔具有比设置在第二结构层中的填充通孔更高的孔隙率。

27. 发明授权

US11239022B2 Inductor component manufacturing method and inductor component 有权
公开(公告)号：US11239022B2
公开(公告)日：2022-02-01
申请号：US15451465
申请日：2017-03-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Shinichiro Banba , Mitsuyoshi Nishide , Norio Sakai
IPC分类号： H01F27/02 , H01F27/29 , H01F17/00 , H01F41/04
摘要： An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

28. 发明授权

US11139101B2 Coil component 有权
公开(公告)号：US11139101B2
公开(公告)日：2021-10-05
申请号：US15491120
申请日：2017-04-19
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Norio Sakai
IPC分类号： H01F27/28 , H01F27/29 , H01F17/00 , H01F17/06
摘要： A coil component includes an insulating layer in which a magnetic core is embedded, coil electrodes wound around the magnetic core, external connection pad electrodes that are provided on the upper surface of the insulating layer and are connected to the coil electrodes. Each of the coil electrodes includes a plurality of inner metal pins standing in the insulating layer, a plurality of outer metal pins standing in the insulating layer, a plurality of upper wiring patterns formed on the upper surface of the insulating layer, and a plurality of lower wiring pattern formed on the undersurface of the insulating layer. Each of the pad electrodes is directly connected to the upper end surface of the inner metal pin or the outer metal pin, and has, in plan view, an area larger than that of the single upper wiring pattern or the single lower wiring pattern.

29. 发明授权

US10559535B2 High-frequency module and manufacturing method therefor 有权
公开(公告)号：US10559535B2
公开(公告)日：2020-02-11
申请号：US15892504
申请日：2018-02-09
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Yoshihisa Masuda , Hideo Nakagoshi , Yuta Morimoto , Norio Sakai , Yoriyuki Matsumoto , Hiroaki Tsuchida
IPC分类号： H01L23/31 , H01L23/552 , H01L21/48 , H01L21/56 , H01L21/78 , H01L23/13 , H01L23/538 , H01L23/66
摘要： The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

30. 发明申请

US20170347447A1 RESIN MULTILAYER SUBSTRATE 审中-公开
公开(公告)号：US20170347447A1
公开(公告)日：2017-11-30
申请号：US15678422
申请日：2017-08-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Norio Sakai , Yoshihito Otsubo
IPC分类号： H05K1/02 , H05K3/46 , H05K1/18
CPC分类号： H05K1/0278 , H01L2224/16227 , H01L2924/15313 , H01L2924/19105 , H05K1/0271 , H05K1/0298 , H05K1/183 , H05K1/186 , H05K3/4691 , H05K3/4697
摘要： A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.

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