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21. 发明申请

US20100233619A1 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION 有权
标题翻译：新型聚酰亚胺硅氧烷，含有新型聚酰亚胺硅氧烷的感光性树脂组合物，以及形成图案的方法
公开(公告)号：US20100233619A1
公开(公告)日：2010-09-16
申请号：US12722068
申请日：2010-03-11
申请人： Shohei TAGAMI , Takanobu Takeda , Michihiro Sugo , Hideto Kato
发明人： Shohei TAGAMI , Takanobu Takeda , Michihiro Sugo , Hideto Kato
IPC分类号： G03F7/004 , C08G77/04 , G03F7/20
CPC分类号： C08G77/455 , C08G73/106 , C08K5/34922 , C08L63/00 , C08L79/08 , C08L83/10 , G03F7/0382 , G03F7/0387
摘要： A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group. R3 and R4, R3 and R5, or R4 and R5 may be bonded to each other to form a ring together with the carbon atom or the carbon atom and the oxygen atom to which they are bonded with the proviso that the R3, R4, and R5 are independently an alkylene group.
摘要翻译：提供了在分子中具有一部分或全部氢原子被酸不稳定基团取代的酚羟基的聚酰亚胺硅氧烷。聚酰亚胺硅氧烷包括由式（1）表示的单元：其中X是四价基团，其中至少一部分是由式（2）表示的四价有机基团：其中R 1是单价烃基，R 2是三价基，平均为n为1〜120的整数。 Y为二价有机基团，其中至少一部分为具有酚羟基的二价有机基团，其中部分或全部氢原子被式（3）表示的酸不稳定基团取代：其中R3和 R4是氢原子或烷基，R5是烷基，芳基或芳烷基。 R 3和R 4，R 3和R 5或R 4和R 5可以彼此键合以与碳原子或碳原子和它们所键合的氧原子一起形成环，条件是R3，R4和 R5独立地是亚烷基。

22. 发明授权

US09653335B2 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method 有权
公开(公告)号：US09653335B2
公开(公告)日：2017-05-16
申请号：US13556655
申请日：2012-07-24
申请人： Hideto Kato , Michihiro Sugo , Shohei Tagami
发明人： Hideto Kato , Michihiro Sugo , Shohei Tagami
IPC分类号： H01L21/683 , C09J183/04 , C08G77/52 , C09J183/14 , C08G77/04 , C08G77/14 , C08G77/00
CPC分类号： H01L21/6836 , C08G77/04 , C08G77/14 , C08G77/52 , C08G77/70 , C09J183/04 , C09J183/14 , H01L2221/68327 , H01L2221/6834 , Y10T428/2848 , Y10T428/31515 , Y10T428/31663
摘要： A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.

23. 发明授权

US08748293B2 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same 有权
标题翻译：有机聚硅氧烷，含有机聚硅氧烷的临时粘合剂组合物，以及使用其制造薄片晶片的方法
公开(公告)号：US08748293B2
公开(公告)日：2014-06-10
申请号：US13406114
申请日：2012-02-27
申请人： Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
发明人： Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
IPC分类号： H01L21/461 , H01L21/463 , C08G77/20
CPC分类号： C08G77/70 , C08G77/04 , C08G77/50 , C08L83/04 , C09J183/04 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386
摘要： The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
摘要翻译：本发明提供含有以下单元（I）〜（III）的非芳香族饱和烃基有机聚硅氧烷：（I）由R 1 SiO 3/2：40〜99摩尔％表示的硅氧烷单元（T单元）（II）由R2R3SiO2 / 2表示的硅氧烷单元（D单元）：59摩尔％以下; 和（III）由R4R5R6SiO1 / 2表示的硅氧烷单元（M单元）：1〜30摩尔％。可以是有机聚硅氧烷，其可溶于非极性有机溶剂，使得有机聚硅氧烷在短时间内可以被剥离，并且难以溶于极性有机溶剂中，例如在将光致抗蚀剂涂覆在半导体侧上时被示例性地使用从而从其上除去光致抗蚀剂，使得在将光致抗蚀剂涂覆在接合的基板的半导体侧上并从中除去光致抗蚀剂时，有机聚硅氧烷不从支撑基板剥离。

24. 发明授权

US08263308B2 Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation 有权
标题翻译：聚酰亚胺硅酮，含有新型聚酰亚胺硅酮的感光性树脂组合物，以及图案形成方法
公开(公告)号：US08263308B2
公开(公告)日：2012-09-11
申请号：US12722068
申请日：2010-03-11
申请人： Shohei Tagami , Takanobu Takeda , Michihiro Sugo , Hideto Kato
发明人： Shohei Tagami , Takanobu Takeda , Michihiro Sugo , Hideto Kato
IPC分类号： G03F7/004 , G03F7/30 , C08G69/26 , C08G77/00
CPC分类号： C08G77/455 , C08G73/106 , C08K5/34922 , C08L63/00 , C08L79/08 , C08L83/10 , G03F7/0382 , G03F7/0387
摘要： A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group. R3 and R4, R3 and R5, or R4 and R5 may be bonded to each other to form a ring together with the carbon atom or the carbon atom and the oxygen atom to which they are bonded with the proviso that the R3, R4, and R5 are independently an alkylene group.
摘要翻译：提供了在分子中具有一部分或全部氢原子被酸不稳定基团取代的酚羟基的聚酰亚胺硅氧烷。聚酰亚胺硅氧烷包括由式（1）表示的单元：其中X是四价基团，其中至少一部分是由式（2）表示的四价有机基团：其中R 1是一价烃基，R 2是三价基，平均为n为1〜120的整数。 Y为二价有机基团，其中至少一部分为具有酚羟基的二价有机基团，其中部分或全部氢原子被式（3）表示的酸不稳定基团取代：其中R3和 R4是氢原子或烷基，R5是烷基，芳基或芳烷基。 R 3和R 4，R 3和R 5或R 4和R 5可以彼此键合以与碳原子或碳原子和它们所键合的氧原子一起形成环，条件是R3，R4和 R5独立地是亚烷基。

25. 发明授权

US07041766B2 Colorless and transparent polyimidesilicone resin having thermosetting functional groups 有权
标题翻译：无色透明的具有热固性官能团的聚酰亚胺树脂
公开(公告)号：US07041766B2
公开(公告)日：2006-05-09
申请号：US10681119
申请日：2003-10-09
申请人： Yoshinori Yoneda , Michihiro Sugo , Hideto Kato
发明人： Yoshinori Yoneda , Michihiro Sugo , Hideto Kato
IPC分类号： C08G77/26
CPC分类号： C08G73/106 , C08G77/455 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A colorless and transparent thermosetting polyimidesilicone resin comprising structural units of the following general formula (1) and structural units of the general formula (4), said resin being soluble in an organic solvent wherein X is a tetravalent organic group having 4 or more carbon atoms, none of the carbon atoms of X being bound to a plurality of carbonyl groups, Y is a diamine residue and Z is a diaminosiloxane residue.
摘要翻译：一种无色透明的热固性聚酰亚胺树脂，其包含以下通式（1）的结构单元和通式（4）的结构单元，所述树脂可溶于有机溶剂，其中X为具有4个或更多个碳原子的四价有机基团 X的碳原子都不与多个羰基结合，Y是二胺残基，Z是二氨基硅氧烷残基。

26. 发明授权

US06706841B2 Solventless polyimide silicone resin compositions 有权
标题翻译：无溶剂聚酰亚胺硅树脂组合物
公开(公告)号：US06706841B2
公开(公告)日：2004-03-16
申请号：US10140251
申请日：2002-05-08
申请人： Michihiro Sugo , Akira Yamamoto , Hideto Kato
发明人： Michihiro Sugo , Akira Yamamoto , Hideto Kato
IPC分类号： C08G7726
CPC分类号： C09D179/08 , C08G77/455 , C08L79/08 , H01B3/306
摘要： A polyimide silicone resin composition comprising a polyimide silicone resin having recurring units of formula (1), a (meth)acrylic compound, and a polymerization initiator has fluidity at 25° C. despite the substantially absence of a solvent. In formula (1), X is a tetravalent organic group, Y is a divalent organic group, Z is a divalent organic group having an organosiloxane structure, p and q are positive numbers. The composition using the reactive (meth)acrylic compound as a diluent for the polyimide silicone resin is substantially free of a solvent and thus eliminates the step of solvent removal while it is highly adherent to various shapes of substrates
摘要翻译：包含具有式（1）的重复单元的聚酰亚胺硅树脂，（甲基）丙烯酸化合物和聚合引发剂的聚酰亚胺硅树脂组合物尽管基本上不存在溶剂，但在25℃下具有流动性。在式（1）中，X是四价有机基团，Y是二价有机基团，Z是具有有机硅氧烷结构的二价有机基团，p和q是正数。使用反应性（甲基）丙烯酸类化合物作为聚酰亚胺硅酮树脂的稀释剂的组合物基本上不含溶剂，因此消除了溶剂去除的步骤，同时它与各种形状的基材高度贴合

27. 发明授权

US06538093B2 Polyimide silicone resin, process for its production, and polyimide silicone resin composition 失效
公开(公告)号：US06538093B2
公开(公告)日：2003-03-25
申请号：US09892444
申请日：2001-06-28
申请人： Michihiro Sugo , Hideto Kato
发明人： Michihiro Sugo , Hideto Kato
IPC分类号： C08G7726
CPC分类号： C08L79/08 , C08G73/1039 , C08G73/1042 , C08G73/106 , C08G77/455 , C08L63/00 , C09D179/08 , C09J179/08 , Y10T428/31663
摘要： A polyimide silicone resin which contains not more than 300 ppm of a cyclic siloxane oligomer having 10 or less silicon atoms, has a glass transition point of 250° C. or below and is soluble in an organic solvent. This polyimide silicone resin is produced using a diamine containing a diaminosiloxane containing not more than 300 ppm of the cyclic siloxane oligomer. Also disclosed is a polyimide silicone resin composition including 50 to 99% by mass of the polyimide silicone resin and 1 to 50% by mass of an epoxy compound. The polyimide silicone resin has been made to less contain the cyclic siloxane oligomers causative of trouble in electrical contacts, and promises a good adhesiveness or bond strength to substrates and a high reliability.

28. 发明授权

US08252882B2 Polyimide resin produced by using silphenylene compound 有权
标题翻译：使用硅亚苯基化合物生产的聚酰亚胺树脂
公开(公告)号：US08252882B2
公开(公告)日：2012-08-28
申请号：US13167942
申请日：2011-06-24
申请人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
发明人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
IPC分类号： C08G77/12
CPC分类号： C07F7/0812 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/106 , C08G73/1075 , C08G73/1078 , H05K1/0346
摘要： The present invention relates to a polyimide resin produced by using silphenylene compound represented by the following formula (1) as a monomer: in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.
摘要翻译：本发明涉及通过使用由下式（1）表示的硅亚苯基化合物作为单体制备的聚酰亚胺树脂：其中R 1至R 4各自独立地表示氢原子或具有1至6个碳原子的一价烃基，R5 R 6各自独立地表示碳原子数2〜8的二价烃基。本发明的硅亚苯基化合物可用作柔性印刷线路板材料，IC芯片用钝化膜和液晶面板材料。

29. 发明授权

US07981976B2 Heat-curable polyimide silicone resin composition 有权
标题翻译：热固性聚酰亚胺硅树脂组合物
公开(公告)号：US07981976B2
公开(公告)日：2011-07-19
申请号：US12230773
申请日：2008-09-04
申请人： Yoshinori Yoneda , Michihiro Sugo
发明人： Yoshinori Yoneda , Michihiro Sugo
IPC分类号： C08G77/455
CPC分类号： C08G73/125 , C08G73/1042 , C08G73/1057 , C08G73/106 , C08G73/1082 , C08L79/08
摘要： A heat-curable polyimide silicone resin composition comprising 100 parts by weight of a polyimide silicone resin having a radically polymerizable group bonded to a silicon atom, 0.1 to 20 parts by weight of a peroxycarbonate curing agent, and a solvent. The composition can be cured at a low temperature in a short time.
摘要翻译：一种可热固化的聚酰亚胺硅树脂组合物，其包含100重量份的与硅原子键合的自由基聚合基团的聚酰亚胺硅树脂，0.1至20重量份过氧碳酸酯固化剂和溶剂。组合物可以在短时间内在低温下固化。

30. 发明授权

US07432313B2 Solvent-free polymide silicone resin composition and a cured resin film thereof 有权
标题翻译：无溶剂聚硅氧烷树脂组合物及其固化树脂膜
公开(公告)号：US07432313B2
公开(公告)日：2008-10-07
申请号：US11221897
申请日：2005-09-09
申请人： Yoshinori Yoneda , Michihiro Sugo
发明人： Yoshinori Yoneda , Michihiro Sugo
IPC分类号： C08L79/08 , C08J3/28 , C08G77/08
CPC分类号： C08G73/106 , C08G77/455
摘要： A solvent-free polyimide silicone resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following formula (1-1) and repeating units represented by the following formula (1-2), a film of said resin with a thickness of 100 μm prepared on a quartz glass substrate having a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm, (b) a reactive diluent, and (c) a photopolymerization initiator wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group represented by the following formula (2), wherein R1 may be different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, which group may be substituted, R2 is a monovalent hydrocarbon group having a photopolymerizable group, a and b are each an integer of from 1 to 100 with a+b≦100.
摘要翻译： 1.一种无溶剂聚酰亚胺硅树脂组合物，其含有（a）具有下述式（1-1）表示的重复单元的聚酰亚胺硅树脂和下述式（1-2）所示的重复单元），所述树脂的膜具有在350nm〜450nm的波长下透光率为80％以上的石英玻璃基板上制备的厚度为100μm的厚度，（b）反应性稀释剂，（c）X为四价有机基团的光聚合引发剂 Y为二价有机基团，Z为由下式（2）表示的二价有机基团，其中R 1彼此可以不同，为1〜8价的一价烃基碳原子，该基团可以被取代，R 2是具有光聚合性基团的一价烃基，a和b各自为1〜100的整数，+ b <= 100。

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