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21. 发明授权

US10651128B2 Electronic devices with yielding substrates 有权
公开(公告)号：US10651128B2
公开(公告)日：2020-05-12
申请号：US16021266
申请日：2018-06-28
申请人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L21/00 , H01L33/00 , H01L23/538 , H01L33/50 , H01L33/62 , H01L25/075 , H01L33/60 , H01L33/58 , H01L33/44
摘要： In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

22. 发明授权

US09494305B2 Lighting systems incorporating flexible light sheets deformable to produce desired light distributions 有权
标题翻译：照明系统结合柔性光片可变形以产生所需的光分布
公开(公告)号：US09494305B2
公开(公告)日：2016-11-15
申请号：US14303197
申请日：2014-06-12
申请人： Michael A. Tischler , Paul Palfreyman , Calvin Wade Sheen
发明人： Michael A. Tischler , Paul Palfreyman , Calvin Wade Sheen
IPC分类号： F21V21/14 , F21L4/00 , F21V21/005 , F21V21/34 , F21V33/00 , G06F1/16 , G09F13/00 , F21Y105/00 , F21L4/08 , F21V1/00 , F21V23/06 , F21V31/00 , F21V17/00 , F21V21/08 , F21Y101/02
CPC分类号： F21V21/14 , F21L4/00 , F21L4/08 , F21L2001/00 , F21V17/007 , F21V21/005 , F21V21/08 , F21V21/34 , F21V23/06 , F21V31/005 , F21V33/00 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , G06F1/1616 , G09F13/00
摘要： In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.
摘要翻译：根据某些实施例，照明系统包括具有布置在其上的第一发光强度分布的发光元件的柔性光片，并且光片被弯曲或折叠以产生不同于第一发光强度分布的第二发光强度分布。

23. 发明授权

US09107272B2 Failure mitigation in arrays of light-emitting devices 有权
标题翻译：在发光器件阵列中的故障缓解
公开(公告)号：US09107272B2
公开(公告)日：2015-08-11
申请号：US14484880
申请日：2014-09-12
申请人： Michael A. Tischler , Philippe M. Schick , Paul Jungwirth , Calvin Wade Sheen
发明人： Michael A. Tischler , Philippe M. Schick , Paul Jungwirth , Calvin Wade Sheen
IPC分类号： H05B37/00 , H05B33/08 , F21K99/00
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译：根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。

27. 发明授权

US08524518B2 Epitaxial formation support structures and associated methods 有权
公开(公告)号：US08524518B2
公开(公告)日：2013-09-03
申请号：US13465867
申请日：2012-05-07
申请人： Calvin Wade Sheen
发明人： Calvin Wade Sheen
IPC分类号： H01L21/00
CPC分类号： H01L33/32 , B28B1/16 , H01L21/02433 , H01L21/02458 , H01L21/0254 , H01L29/2003 , H01L33/007 , H01L33/0079 , H01L33/48
摘要： Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

28. 发明申请

US20130111744A1 BROAD-AREA LIGHTING SYSTEMS 审中-公开
公开(公告)号：US20130111744A1
公开(公告)日：2013-05-09
申请号：US13692129
申请日：2012-12-03
申请人： Michael A. Tischler , Philippe M. Schick , Calvin Wade Sheen
发明人： Michael A. Tischler , Philippe M. Schick , Calvin Wade Sheen
IPC分类号： H05K3/32 , H05K13/00
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements

29. 发明授权

US08187901B2 Epitaxial formation support structures and associated methods 有权
标题翻译：外延形成支撑结构及相关方法
公开(公告)号：US08187901B2
公开(公告)日：2012-05-29
申请号：US12961370
申请日：2010-12-06
申请人： Calvin Wade Sheen
发明人： Calvin Wade Sheen
IPC分类号： H01L21/00
CPC分类号： H01L33/32 , B28B1/16 , H01L21/02433 , H01L21/02458 , H01L21/0254 , H01L29/2003 , H01L33/007 , H01L33/0079 , H01L33/48
摘要： Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.
摘要翻译：本文公开了外延形成支撑结构和制造外延形成支撑结构和固态照明装置的相关方法。在几个实施例中，制造外延形成支撑衬底的方法可以包括形成具有第一侧，与第一侧相对的第二侧和基本类似于N型氮化镓的热膨胀系数的未固化支撑衬底。该方法还可以包括将未固化的支撑衬底的第一侧定位在第一参考板的第一表面上，并将第二参考板的第二表面定位在第二侧上以形成堆叠。第一和第二表面可以包括均匀的平坦部分。该方法还可以包括烧结堆叠以烧结未固化的支撑衬底。支撑基板的至少一侧可以形成基本均匀平坦的平坦表面。

30. 发明授权

US10978402B2 Electronic devices with yielding substrates 有权
公开(公告)号：US10978402B2
公开(公告)日：2021-04-13
申请号：US16842100
申请日：2020-04-07
申请人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L33/00 , H01L21/00 , H01L23/538 , H01L33/50 , H01L33/62 , H01L23/498 , H01L51/00 , H01L25/075 , H01L33/60 , H01L33/58 , H01L33/44
摘要： In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

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