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21. 发明授权

US5625732A Optical interface unit with detachable photonic device 失效
标题翻译：具有可拆卸光子器件的光学接口单元
公开(公告)号：US5625732A
公开(公告)日：1997-04-29
申请号：US147510
申请日：1993-11-05
申请人： Christopher K. Y. Chun , Shun-Meen Kuo , Gary F. Witting
发明人： Christopher K. Y. Chun , Shun-Meen Kuo , Gary F. Witting
IPC分类号： G02B6/42 , G02B6/26
CPC分类号： G02B6/4292 , G02B6/4249 , G02B6/4246
摘要： A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.
摘要翻译：一种具有安装在其上的光子器件的衬底，其具有可操作地连接到至少一个电引线的工作部分。形成具有用于光信号进入和退出的表面的模制光学部分，其封装基板，光子器件以及第一和第二电引线的一部分。光连接器被形成为插入到模制的光学部分中以将光纤束连接到其上，并且光学部分电连接到互连模块。

22. 发明授权

US5500914A Optical interconnect unit and method or making 失效
标题翻译：光互连单元和方法或制造
公开(公告)号：US5500914A
公开(公告)日：1996-03-19
申请号：US237524
申请日：1994-05-03
申请人： Barbara M. Foley , David Galloway , Shun-Meen Kuo , Christopher K. Y. Chun
发明人： Barbara M. Foley , David Galloway , Shun-Meen Kuo , Christopher K. Y. Chun
IPC分类号： G02B6/24 , G02B6/38 , G02B6/40 , G02B6/42 , G02B6/36
CPC分类号： G02B6/4249 , G02B6/3865 , G02B6/421
摘要： A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.
摘要翻译：公开了一种制造光互连单元的方法。形成有具有凹槽（112）的表面（107）的模具（100）。将光纤（117）放置在表面（107）的凹槽（112）中。将模塑材料施加到模具（100）的表面（107）上并且涂覆到光纤（117）上，从而将光纤（117）固定到模制材料上。

23. 发明授权

US5384873A Optical interface unit and method of making 失效
标题翻译：光接口单元及其制作方法
公开(公告)号：US5384873A
公开(公告)日：1995-01-24
申请号：US131175
申请日：1993-10-04
申请人： Christopher K. Y. Chun , Shun-Meen Kuo
发明人： Christopher K. Y. Chun , Shun-Meen Kuo
IPC分类号： G02B6/42 , G02B6/28
CPC分类号： G02B6/4292 , G02B6/4214 , G02B6/4249
摘要： A plurality of electrical traces and a light emitting device having a working portion is disposed on an interconnect substrate. A first optical portion having a first surface, a second surface, and a tapered surface is disposed onto the interconnect substrate. The first surface of the optical portion covers the working portion of the light emitting device, a second surface of the first optical portion is positioned parallel to the working portion of the light emitting device, and the tapered surface extends from the second surface toward the working portion of the light emitting device for guiding light emitted from the working portion of the light emitting device to the second surface.
摘要翻译：多个电迹线和具有工作部分的发光器件设置在互连衬底上。具有第一表面，第二表面和锥形表面的第一光学部分设置在互连基板上。光学部分的第一表面覆盖发光器件的工作部分，第一光学部分的第二表面平行于发光器件的工作部分定位，锥形表面从第二表面延伸到工作用于将从发光装置的工作部分发射的光引导到第二表面的发光装置的一部分。

24. 发明授权

US5493437A External communication link for a credit card pager 失效
标题翻译：信用卡寻呼机的外部通信链路
公开(公告)号：US5493437A
公开(公告)日：1996-02-20
申请号：US119635
申请日：1993-09-13
申请人： Michael S. Lebby , Shun-Meen Kuo
发明人： Michael S. Lebby , Shun-Meen Kuo
IPC分类号： H04B10/12 , G08B5/22 , H04B10/10 , H04B10/13 , H04B10/135 , H04B10/14 , H04Q7/14 , H04B10/00
CPC分类号： H04B10/1143 , G08B5/228 , H04B10/40
摘要： A credit card pager having a casing surrounding a substrate and electronic circuitry mounted on the substrate. An information connection including at least one molded waveguide having a core with a photonic device mounted at one end and a second end of the core being positioned on the substrate to be accessible exterior of the casing so as to communicate optical information signals therethrough.
摘要翻译：具有围绕基板的壳体和安装在基板上的电子电路的信用卡寻呼机。一种信息连接，包括至少一个模制波导，其具有安装在一端的具有光子器件的芯的核心，并且芯的第二端位于基板上，以便可触及外壳的外部，以便通过其传送光学信息信号。

25. 发明授权

US06630725B1 Electronic component and method of manufacture 有权
标题翻译：电子元件及制造方法
公开(公告)号：US06630725B1
公开(公告)日：2003-10-07
申请号：US09684576
申请日：2000-10-06
申请人： Shun-Meen Kuo , Darrel R. Frear
发明人： Shun-Meen Kuo , Darrel R. Frear
IPC分类号： H01L23552
CPC分类号： B81C1/00269 , H01L23/10 , H01L24/81 , H01L24/97 , H01L2224/81801 , H01L2224/97 , H01L2924/01033 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/30107 , H01L2924/3025 , H01L2224/81
摘要： An electronic component includes a substrate (210, 1510), a device (221, 222) supported by the substrate and including a first bond pad (223, 224, 225, 226), and a cap (231, 232, 631, 731, 732, 1531, 1532) overlying the substrate. The cap includes a second bond pad (241, 242, 243, 244) at an outside surface of the cap, a third bond pad (245, 246, 247, 248) at an inside surface of the cap and electrically coupled to the first bond pad, and an electrically conductive via (251, 252, 254, 751, 752, 753, 754) extending through the cap and electrically coupling together the second and third bond pads.
摘要翻译：电子部件包括基板（210,1510），由基板支撑并包括第一接合焊盘（223,224,225,226）的盖子（231,232,631,731），732,1531,1532）。所述盖包括在所述盖的外表面处的第二接合焊盘（241,242,243,244），在所述盖的内表面处的第三接合焊盘（245,246,247,248），并且电耦合到所述第一接合焊盘接合焊盘和延伸穿过盖并电连接在一起的第二和第三接合焊盘的导电通孔（251,252,254,751,752,753,754）。

26. 发明授权

US06794101B2 Micro-electro-mechanical device and method of making 有权
标题翻译：微机电装置及其制造方法
公开(公告)号：US06794101B2
公开(公告)日：2004-09-21
申请号：US10159909
申请日：2002-05-31
申请人： Lianjun Liu , Jenn-Hwa Huang , Lei Mercado , Shun-Meen Kuo
发明人： Lianjun Liu , Jenn-Hwa Huang , Lei Mercado , Shun-Meen Kuo
IPC分类号： G03G1304
CPC分类号： H01P1/127 , H01H59/0009 , H01H2001/0084
摘要： A micro-electro-mechanical device (10) including a shorting bar (40) having a first portion (42) electrically coupled to a first input/output signal line (34) and a second portion (43) electrically uncoupled to a second input/output signal line (36). Shorting bar (40) is coupled to a moveable end (49) of a cantilever structure (44). Thus, preferably only the second portion (43) of shorting bar (40) needs to be actuated to be electrically coupled to the second input/output signal line (36).
摘要翻译：一种微电子机械装置（10），包括具有电耦合到第一输入/输出信号线（34）的第一部分（42）的短路棒（40）和与第二输入端 /输出信号线（36）。短杆（40）联接到悬臂结构（44）的可移动端（49）。因此，优选仅需要致动短路棒（40）的第二部分（43）以电耦合到第二输入/输出信号线（36）。

27. 发明授权

US5146416A Method and apparatus for accurately measuring thickness of a semiconductor die bond material 失效
标题翻译：准确测量半导体管芯接合材料厚度的方法和装置
公开(公告)号：US5146416A
公开(公告)日：1992-09-08
申请号：US663508
申请日：1991-03-04
申请人： Shun-Meen Kuo
发明人： Shun-Meen Kuo
IPC分类号： G01B5/06
CPC分类号： G01B5/06
摘要： A method for measuring die bond material (27) used to bond a semiconductor die (26) to a lead frame (28). The semiconductor die (26) height is measured on the lead frame (28). Die bond material (27) is placed onto the lead frame (28) and the semiconductor die (26) is pressed into the die bond material (27). The height of the semiconductor die (26) on the die bond material (27) is measured again. Thickness of the die bond material (27) is obtained by subtraction of the two heights.
摘要翻译：一种用于测量用于将半导体管芯（26）接合到引线框架（28）的管芯接合材料（27）的方法。在引线框架（28）上测量半导体管芯（26）的高度。将芯片接合材料（27）放置在引线框架（28）上，半导体管芯（26）被压入管芯接合材料（27）。再次测量芯片接合材料（27）上的半导体管芯（26）的高度。通过减去两个高度获得管芯接合材料（27）的厚度。

28. 发明授权

US07920987B2 Device under test de-embedding 有权
标题翻译：被测设备去嵌入
公开(公告)号：US07920987B2
公开(公告)日：2011-04-05
申请号：US12037333
申请日：2008-02-26
申请人： Shun-Meen Kuo , Marcel N. Tutt
发明人： Shun-Meen Kuo , Marcel N. Tutt
IPC分类号： G21C17/00
CPC分类号： G01R31/2822 , G01R27/28
摘要： A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.
摘要翻译：确定被测设备（DUT）的固有电特性的方法包括确定包括设备的测试结构的测试测量集合以及确定多个解嵌测试结构的测试测量结果。基于测试测量，使用开放式和三步式去嵌入处理来确定DUT测量。 DUT测量被组合以确定不完美误差，其用于调整四端口去嵌入方法的计算。经调整的计算提供了对测试结构中的寄生元件的更精确的测量，从而改进了器件的固有电特性的确定。

29. 发明申请

US20090216480A1 DEVICE UNDER TEST DE-EMBEDDING 有权
标题翻译：测试去嵌入设备
公开(公告)号：US20090216480A1
公开(公告)日：2009-08-27
申请号：US12037333
申请日：2008-02-26
申请人： Shun-Meen Kuo , Marcel N. Tutt
发明人： Shun-Meen Kuo , Marcel N. Tutt
IPC分类号： G01R31/28
CPC分类号： G01R31/2822 , G01R27/28
摘要： A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.
摘要翻译：确定被测设备（DUT）的固有电特性的方法包括确定包括设备的测试结构的测试测量集合以及确定多个解嵌测试结构的测试测量结果。基于测试测量，使用开放式和三步式去嵌入处理来确定DUT测量。 DUT测量被组合以确定不完美误差，其用于调整四端口去嵌入方法的计算。经调整的计算提供了对测试结构中的寄生元件的更精确的测量，从而改进了器件的固有电特性的确定。

30. 发明授权

US06482289B1 Nonconductive laminate for coupling substrates and method therefor 失效
标题翻译：用于耦合衬底的非导电层压板及其方法
公开(公告)号：US06482289B1
公开(公告)日：2002-11-19
申请号：US08540139
申请日：1995-10-06
申请人： Treliant Fang , Melissa E. Grupen-Shemansky , Shun-Meen Kuo
发明人： Treliant Fang , Melissa E. Grupen-Shemansky , Shun-Meen Kuo
IPC分类号： B32B3100
CPC分类号： H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/2919 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/321 , H05K3/4069 , H05K2201/0394 , H05K2201/09472 , H05K2201/10674 , H05K2201/10977 , H05K2203/1189 , Y10T428/31515 , H01L2924/00 , H01L2224/0401
摘要： An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.
摘要翻译：用于连接两个基板的组件和方法使用非导电层压体，当在湿润时用导电浆润湿时，其是相容的。因此，可以一起执行非导电层压体和导电浆料的固化。非导电层压体还在比以前可用的时间短的时间内固化，因此通过暴露于固化温度而产生的对半导体器件的应力被额外地降低。

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