专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20130293337A1 HIGH QUALITY FACTOR PLANAR INDUCTORS 审中-公开
标题翻译：高质量因子平面电感器
公开(公告)号：US20130293337A1
公开(公告)日：2013-11-07
申请号：US13463583
申请日：2012-05-03
申请人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
发明人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
IPC分类号： H01F5/00 , H01F41/04
CPC分类号： H01F5/003 , H01F41/041 , Y10T29/4902
摘要： This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate.
摘要翻译：本公开提供了与电感器相关的系统，方法和装置。一方面，平面电感器可以包括在衬底的表面上具有平面螺旋线圈形状的间隔物的衬底。设置在间隔件上的金属线可以是形成为平面螺旋线圈形状的平面电感器的金属线。间隔物可以在金属线和基底的表面之间。间隔物可以将衬底上的金属线提升。

22. 发明申请

US20130278609A1 ISOTROPICALLY-ETCHED CAVITIES FOR EVANESCENT-MODE ELECTROMAGNETIC-WAVE CAVITY RESONATORS 有权
标题翻译： EVEESCENT-MODE电磁波腔谐振器的等离子体蚀刻
公开(公告)号：US20130278609A1
公开(公告)日：2013-10-24
申请号：US13451385
申请日：2012-04-19
申请人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , Sang-June Park , Ravindra V. Shenoy
IPC分类号： G06T1/00 , B44C1/22 , H01P11/00 , H01P7/06
CPC分类号： H01P1/208 , H01P1/202 , H01P1/2084 , H01P7/04 , H01P7/06 , H01P11/007 , H01P11/008
摘要： This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a device includes an evanescent-mode electromagnetic-wave cavity resonator. In some implementations, the resonator includes an isotropically-etched cavity operable to support one or more evanescent electromagnetic wave modes. In some implementations, the resonator also includes a cavity ceiling arranged to form a volume in conjunction with the isotropically-etched cavity. In some implementations, the resonator also includes a capacitive tuning structure having a portion that is located at least partially within the volume so as to support the evanescent electromagnetic wave modes. In some implementations, a distal surface of the tuning structure is separated from the closest surface to it by a gap distance, a resonant electromagnetic wave mode of the cavity resonator being dependent at least partially on the gap distance.
摘要翻译：本公开提供了机电系统（EMS）谐振器结构，设备，装置，系统和相关过程的实现。在一个方面，一种器件包括ev逝模式电磁波谐振腔谐振器。在一些实施方案中，谐振器包括可操作以支持一个或多个ev逝电磁波模式的各向同性蚀刻的腔。在一些实施方案中，谐振器还包括空腔顶板，其被设置成与各向同性蚀刻的空腔结合形成体积。在一些实施方案中，谐振器还包括电容调谐结构，其具有至少部分地位于体积内的部分，以便支持渐逝电磁波模式。在一些实施方案中，调谐结构的远端表面与距离其最近的表面分开间隙距离，空腔谐振器的谐振电磁波模式至少部分地取决于间隙距离。

23. 发明申请

US20130278568A1 METAL-INSULATOR-METAL CAPACITORS ON GLASS SUBSTRATES 有权
公开(公告)号：US20130278568A1
公开(公告)日：2013-10-24
申请号：US13454978
申请日：2012-04-24
申请人： Jon Bradley Lasiter , Ravindra V. Shenoy , Donald William Kidwell
发明人： Jon Bradley Lasiter , Ravindra V. Shenoy , Donald William Kidwell
IPC分类号： G09G5/00 , H05K3/00 , H05K7/00 , H05K1/00 , H05K1/09
CPC分类号： H01G4/06 , G02B26/001 , H01G4/008 , H01G4/30 , H01L23/15 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L27/12 , H01L28/60 , H01L28/90 , H01L2224/131 , H01L2224/16225 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15311 , H05K1/0306 , H05K1/115 , H05K1/182 , Y10T29/49124 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.

24. 发明申请

US20130136280A1 MICROSPEAKER WITH PIEZOELECTRIC, METAL AND DIELECTRIC MEMBRANE 有权
标题翻译：具有压电，金属和介电膜的微型扬声器
公开(公告)号：US20130136280A1
公开(公告)日：2013-05-30
申请号：US13306397
申请日：2011-11-29
申请人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
发明人： Philip Jason Stephanou , David William Burns , Ravindra V. Shenoy
IPC分类号： H04R17/00 , H04R31/00
CPC分类号： H04R17/00 , G02B26/001 , G06F1/1626 , G06F1/1637 , H01L41/04 , H01L41/107 , H01L41/31 , H04R31/00 , H04R2201/003 , H04R2201/401 , H04R2499/15 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
摘要翻译：本公开提供了用于微型扬声器装置的系统，方法和装置。在一个方面，扬声器元件可以包括跨越扬声器腔的可变形介电膜。可变形电介质膜可以包括压电致动器和电介质层。当向压电致动器施加驱动信号时，电介质层可以偏转，产生声音。在一些实施方案中，可以在玻璃基板和盖玻璃之间封装一组扬声器元件。由扬声器元件产生的声音可以通过形成在盖玻璃上的扬声器格栅发射。

25. 发明申请

US20130135317A1 THIN BACK GLASS INTERCONNECT 有权
标题翻译：薄背玻璃互连
公开(公告)号：US20130135317A1
公开(公告)日：2013-05-30
申请号：US13306284
申请日：2011-11-29
申请人： Ravindra V. Shenoy
发明人： Ravindra V. Shenoy
IPC分类号： G06T1/00 , B32B38/10 , B32B37/02 , B05D3/00 , H01R13/02 , B05D5/00
CPC分类号： B81C1/00047 , B81B2203/0315 , B81B2207/092 , B81B2207/095 , B81C1/00301 , B81C2203/0127
摘要： This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (MEMS) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more MEMS devices on the device substrate. The cover glass can include one or more spin-on glass layers and electrically conductive routing and interconnects. The package can include a narrow seal surrounding the one or more encapsulated MEMS devices.
摘要翻译：本公开提供了用于提供封装的微机电系统（MEMS）装置的系统，方法和装置。在一个方面，封装可以包括接合到器件衬底的覆盖玻璃，所述覆盖玻璃包括集成的电连接并且被配置为将一个或多个MEMS器件封装在所述器件衬底上。盖玻璃可以包括一个或多个旋涂玻璃层和导电布线和互连。封装可以包括围绕一个或多个封装的MEMS器件的窄密封。

26. 发明申请

US20130050228A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050228A1
公开(公告)日：2013-02-28
申请号：US13221717
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G06T1/00 , H01L23/15 , H01L21/78 , H01L21/52
CPC分类号： H01L23/053 , B81B2201/047 , B81C1/0023 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L27/14609 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。

27. 发明申请

US20130050155A1 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开
标题翻译：作为基板材料的玻璃和用于MEMS和IC器件的最终封装
公开(公告)号：US20130050155A1
公开(公告)日：2013-02-28
申请号：US13221744
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
IPC分类号： G09G5/00 , H05K13/00 , H05K7/00
CPC分类号： B81B7/0067 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0109 , H01L2224/16 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
摘要翻译：本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。

28. 发明申请

US20120092350A1 WRAPAROUND ASSEMBLY FOR COMBINATION TOUCH, HANDWRITING AND FINGERPRINT SENSOR 失效
标题翻译：用于组合触摸，手写和指纹传感器的封装组件
公开(公告)号：US20120092350A1
公开(公告)日：2012-04-19
申请号：US13271065
申请日：2011-10-11
申请人： Srinivasan Kodaganallur Ganapathi , Nicholas Ian Buchan , Kurt Edward Petersen , Ravindra V. Shenoy , Peng Cheng Lin , Ericson Cheng
发明人： Srinivasan Kodaganallur Ganapathi , Nicholas Ian Buchan , Kurt Edward Petersen , Ravindra V. Shenoy , Peng Cheng Lin , Ericson Cheng
IPC分类号： G06T1/00 , H05K3/00 , H05K7/00
CPC分类号： G06F3/044 , G02B26/0833 , G06F3/03547 , G06F3/045 , G06F21/32 , G06F21/83 , G06F2203/04103 , G06F2203/04106 , G06K9/0002
摘要： This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
摘要翻译：本公开提供了用于组合的传感器装置的系统，方法和装置。在一些实施方式中，组合传感器装置包括环绕构型，其中上柔性衬底在延伸部分上具有图案化的导电材料，以允许信号线，电接地和功率的路由。可以将包括连接插座的一个或多个集成电路或无源组件安装到柔性层上以降低成本和复杂性。这样的实现可以消除柔性电缆并且可以允许无边框配置。

29. 发明授权

US5620611A Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads 失效
标题翻译：在制造焊盘的化学蚀刻期间改善均匀性并减少多余的底切的方法
公开(公告)号：US5620611A
公开(公告)日：1997-04-15
申请号：US659459
申请日：1996-06-06
申请人： Madhav Datta , Thomas S. Kanarsky , Michael B. Pike , Ravindra V. Shenoy
发明人： Madhav Datta , Thomas S. Kanarsky , Michael B. Pike , Ravindra V. Shenoy
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： Reduced undercutting of a titanium-tungsten layer in a ball limiting metallurgy (BLM) is achieved in the preparation of solder ball interconnect structures by removing metal oxide film which forms on the titanium-tungsten layer and etching the titanium-tungsten layer in different steps. Removing the metal oxide with an acid solution prior to etching the titanium-tungsten layer provides for a more uniform etch of the titanium-tungsten layer.
摘要翻译：通过去除在钛 - 钨层上形成的金属氧化物膜并以不同的步骤蚀刻钛 - 钨层，在制备焊球互连结构中实现了在极限极限冶金（BLM）中减少钛钨层的底切。在蚀刻钛 - 钨层之前用酸溶液去除金属氧化物提供对钛 - 钨层的更均匀的蚀刻。

30. 发明授权

US5456788A Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process 失效
标题翻译：用于无接触实时原位监测化学蚀刻工艺的方法和装置
公开(公告)号：US5456788A
公开(公告)日：1995-10-10
申请号：US414404
申请日：1995-03-31
申请人： Steven G. Barbee , Madhav Datta , Tony F. Heinz , Leping Li , Eugene H. Ratzlaff , Ravindra V. Shenoy
发明人： Steven G. Barbee , Madhav Datta , Tony F. Heinz , Leping Li , Eugene H. Ratzlaff , Ravindra V. Shenoy
IPC分类号： H01L21/66 , H01L21/306 , H01L21/3213 , C23F1/02
CPC分类号： H01L21/32135
摘要： A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing a base member having a reference surface; releasably securing the workpiece to the base member; providing at least two sensors disposed on the base member to be proximate to but not in contact with the outer perimeter of the workpiece surface; and monitoring an electrical characteristic between said at least two sensors, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process.
摘要翻译：公开了一种用于在用湿化学蚀刻剂蚀刻工件期间蚀刻工艺的原位化学蚀刻监测的非接触式方法和装置。该方法包括提供具有参考表面的基底构件的步骤; 将工件可释放地固定到基座构件上; 提供设置在所述基座构件上的至少两个传感器以接近但不与所述工件表面的外周接触; 以及监测所述至少两个传感器之间的电特性，其中电特性的规定变化表示蚀刻处理的规定条件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式