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21. 发明授权

US07484451B1 Bionic body armor 有权
标题翻译：仿生体装甲
公开(公告)号：US07484451B1
公开(公告)日：2009-02-03
申请号：US12059507
申请日：2008-03-31
申请人： Thomas E. Morf , Jonas R. Weiss
发明人： Thomas E. Morf , Jonas R. Weiss
IPC分类号： F41H5/007
CPC分类号： F41H5/007
摘要： A method of protecting a target from a projectile propelled from a firearm comprises detecting an approaching projectile, continuously monitoring the projectile and transmitting an actual position of the projectile to a controller, computing an estimated projectile trajectory based upon the actual position of the projectile, determining an actual position of a target with a plurality of position sensors and a plurality of attitude sensors, determining whether the estimated projectile trajectory coincides with the actual position of the target, and triggering a plurality of muscle stimulators operably coupled to the controller and to the target when the estimated projectile trajectory coincides with the actual position of the target, wherein the muscle stimulators stimulate the target to move in a predefined manner, and wherein the target moves by an amount sufficient to avoid any contact with the approaching projectile. The projectile may be detected in the detecting step by emitting an electromagnetic wave from a projectile detector and receiving the electromagnetic wave after the electromagnetic wave has been reflected back toward the projectile detector by the projectile.
摘要翻译：保护目标免受从火器推射的射弹的一种方法包括检测接近的射弹，连续监测射弹并将射弹的实际位置传送给控制器，根据射弹的实际位置计算估计的射弹轨迹，确定具有多个位置传感器和多个姿态传感器的目标的实际位置，确定所述估计的射弹轨迹是否与所述目标的实际位置一致，以及触发可操作地耦合到所述控制器和所述目标的多个肌肉刺激器当估计的射弹轨迹与目标的实际位置一致时，其中肌肉刺激器以预定的方式刺激目标移动，并且其中目标移动足以避免与接近射弹的任何接触的量。可以在检测步骤中通过从射弹检测器发射电磁波并在电磁波被射弹反射回射弹检测器之后接收电磁波，从而在检测步骤中检测出弹丸。

22. 发明申请

US20080251870A1 DETECTOR FOR DETECTING ELECTROMAGNETIC WAVES 有权
标题翻译：用于检测电磁波的检测器
公开(公告)号：US20080251870A1
公开(公告)日：2008-10-16
申请号：US11774087
申请日：2007-07-06
申请人： Thomas E. Morf , Martin Leo Schmatz , Jonas R. Weiss
发明人： Thomas E. Morf , Martin Leo Schmatz , Jonas R. Weiss
IPC分类号： H01L31/00
CPC分类号： H01L31/08 , H01L27/1446 , H01Q9/27
摘要： A detector for detecting electromagnetic waves, the detector having an antenna for receiving the electromagnetic waves, a semiconductor element, wherein a termination section of the semiconductor element establishes a termination resistor of the antenna, wherein the termination section is provided for heating a temperature-sensitive part of the semiconductor element, wherein the semiconductor element comprises a temperature-dependent characteristic that is dependent from the temperature of the temperature sensitive part and a measurement unit for measuring the temperature-dependent characteristic of the semiconductor element.
摘要翻译：一种用于检测电磁波的检测器，具有用于接收电磁波的天线的检测器，半导体元件，其中半导体元件的端接部分建立天线的终端电阻器，其中终端部分用于加热温度敏感半导体元件的一部分，其中半导体元件包括取决于温度敏感部分的温度的温度依赖特性和用于测量半导体元件的温度依赖特性的测量单元。

23. 发明申请

US20120147559A1 INTEGRATED CIRCUIT PACKAGE CONNECTED TO AN OPTICAL DATA TRANSMISSION MEDIUM USING A COOLANT 有权
标题翻译：使用冷却液连接到光学数据传输介质的集成电路封装
公开(公告)号：US20120147559A1
公开(公告)日：2012-06-14
申请号：US13312583
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： H05K7/20
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/122
摘要： An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.
摘要翻译：集成电路耦合器件包括集成电路封装; 以及连接到集成电路封装的光学数据传输介质，并且包括适于在操作中从集成电路封装件移除热量的可移动冷却剂。

24. 发明授权

US08805132B2 Integrated circuit package connected to a data transmission medium 有权
标题翻译：集成电路封装连接到数据传输介质
公开(公告)号：US08805132B2
公开(公告)日：2014-08-12
申请号：US13312327
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： G02B6/12 , G02B6/26 , H01L23/02 , H01L23/48 , H01L23/52 , H01L21/00 , G02B6/43 , H01L25/065 , H01L23/522
CPC分类号： G02B6/43 , H01L23/3128 , H01L23/481 , H01L23/5226 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L2224/03464 , H01L2224/0401 , H01L2224/05009 , H01L2224/051 , H01L2224/05147 , H01L2224/05184 , H01L2224/05655 , H01L2224/131 , H01L2224/14183 , H01L2224/16145 , H01L2224/16195 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06551 , H01L2225/06565 , H01L2924/14 , H01L2924/1533 , H01L2924/014
摘要： An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.
摘要翻译：集成电路耦合装置包括具有以3D叠层排列的N个集成电路层（L1-LN）的集成电路封装; 以及具有n个数据传输层（111-1）的数据传输介质，其中n≥1且N≥2，并且其中所述N个集成电路层可电连接到所述n个数据传输层。

25. 发明申请

US20120189243A1 TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY 有权
标题翻译：通过整合电路的光学层传输热量
公开(公告)号：US20120189243A1
公开(公告)日：2012-07-26
申请号：US13010184
申请日：2011-01-20
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： G02B6/12 , G06F17/50
CPC分类号： H01L23/367 , G02B6/12 , G02B6/122 , G02B6/4269 , G02B6/4272 , G02B6/43 , G02B2006/12147 , G06F17/5022 , G06F17/5068 , G06F17/5077 , H01L2224/16225 , H01L2924/15311
摘要： An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.
摘要翻译：集成电路结构至少包括第一和第二区域。光学层包括光波导。导热材料将热量从至少第二区域传递通过光学层到散热器。

26. 发明授权

US08989532B2 Integrated circuit package connected to an optical data transmission medium using a coolant 有权
标题翻译：使用冷却剂连接到光学数据传输介质的集成电路封装
公开(公告)号：US08989532B2
公开(公告)日：2015-03-24
申请号：US13312583
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： G02B6/12 , G02B6/43 , G02B6/122
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/122
摘要： An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.
摘要翻译：集成电路耦合器件包括集成电路封装; 以及连接到集成电路封装的光学数据传输介质，并且包括适于在操作中从集成电路封装件移除热量的可移动冷却剂。

27. 发明授权

US08873919B2 Particle filled polymer waveguide 有权
标题翻译：颗粒填充聚合物波导
公开(公告)号：US08873919B2
公开(公告)日：2014-10-28
申请号：US13312570
申请日：2011-12-06
申请人： Roger F. Dangel , Thilo H. Stoeferle , Jonas R. Weiss
发明人： Roger F. Dangel , Thilo H. Stoeferle , Jonas R. Weiss
IPC分类号： G02B6/10 , G02B6/122
CPC分类号： G02B6/1221
摘要： A polymer waveguide including a polymer matrix and particles, wherein the particles are embedded in the polymer matrix and have lower optical bulk losses than the polymer matrix.
摘要翻译：包括聚合物基质和颗粒的聚合物波导，其中所述颗粒嵌入聚合物基质中并且具有比聚合物基质更低的光学体积损失。

28. 发明授权

US09064080B2 Transferring heat through an optical layer of integrated circuitry 有权
标题翻译：通过集成电路的光学层传输热量
公开(公告)号：US09064080B2
公开(公告)日：2015-06-23
申请号：US13010184
申请日：2011-01-20
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： G02B6/12 , G06F17/50 , G02B6/42 , G02B6/43
CPC分类号： H01L23/367 , G02B6/12 , G02B6/122 , G02B6/4269 , G02B6/4272 , G02B6/43 , G02B2006/12147 , G06F17/5022 , G06F17/5068 , G06F17/5077 , H01L2224/16225 , H01L2924/15311
摘要： An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.
摘要翻译：集成电路结构至少包括第一和第二区域。光学层包括光波导。导热材料将热量从至少第二区域传递通过光学层到散热器。

29. 发明申请

US20110138600A1 Electro-optical Assembly Fabrication 有权
标题翻译：电光装配制造
公开(公告)号：US20110138600A1
公开(公告)日：2011-06-16
申请号：US12876543
申请日：2010-09-07
申请人： Stefano Sergio Oggioni , Jonas R. Weiss , Bert Jan Offrein
发明人： Stefano Sergio Oggioni , Jonas R. Weiss , Bert Jan Offrein
IPC分类号： B23P11/00 , B23P19/00
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要翻译：倒装式连接器通过水平地定位包括波导的基板的柔性部分来制造光学组件，波导在基板的一个端部边缘处露出; 弯曲柔性基板的一部分以将波导暴露端放置在大致垂直的位置; 将包含光学部件的接合头垂直地定位在波导暴露的衬底边缘上以将光学部件与暴露的波导光学匹配; 并将光学部件可固定地安装到基板边缘。

30. 发明申请

US20090039916A1 Systems and Apparatus for Providing a Multi-Mode Memory Interface 审中-公开
标题翻译：用于提供多模式存储器接口的系统和装置
公开(公告)号：US20090039916A1
公开(公告)日：2009-02-12
申请号：US11834926
申请日：2007-08-07
申请人： Peter Buchmann , Christian I. Menolfi , Martin L. Schmatz , Thomas H. Toifl , Jonas R. Weiss
发明人： Peter Buchmann , Christian I. Menolfi , Martin L. Schmatz , Thomas H. Toifl , Jonas R. Weiss
IPC分类号： G06F7/38
CPC分类号： G11C7/1045 , G11C5/066 , G11C7/1051 , G11C7/1057 , G11C7/1078 , G11C7/1084 , G11C7/109
摘要： An integrated circuit for a memory input/output (I/O) pin has five different modes of operation. The memory chip is enabled to operate with unbuffered (or registered) dual inline memory modules (DIMMs) as well as fully buffered DIMMs. A T-coil circuit equalizes the capacitive loading of the high-speed functions. An exemplary embodiment provides a memory chip containing a multi-functional physical I/O circuit that can act as power or ground; as a DDR2 or DDR3 interface; as a high-speed differential receiver; or as a high-speed differential transmitter.
摘要翻译：用于存储器输入/输出（I / O）引脚的集成电路具有五种不同的操作模式。内存芯片可以使用无缓冲（或注册）双列直插式内存模块（DIMM）以及完全缓冲的DIMM进行操作。 T型线圈电路可以均衡高速功能的电容负载。示例性实施例提供了包含可用作电源或接地的多功能物理I / O电路的存储器芯片; 作为DDR2或DDR3接口; 作为高速差分接收机; 或作为高速差分变送器。

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