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    • 23. 发明申请
    • LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES
    • 发光二极管(LED)阵列包括直接连接和相关组件
    • US20120193649A1
    • 2012-08-02
    • US13027006
    • 2011-02-14
    • Matthew DonofrioJohn Adam EdmondHua-Shuang KongPeter S. AndrewsDavid Todd Emerson
    • Matthew DonofrioJohn Adam EdmondHua-Shuang KongPeter S. AndrewsDavid Todd Emerson
    • H01L27/15H01L21/82
    • H01L25/0753H01L33/505H01L33/62H01L2224/16
    • An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.
    • 电子设备可以包括具有包装基板面的封装基板,在封装基板面上具有多个导电焊盘。 第一发光二极管管芯可以桥接第一和第二导电焊盘。 更具体地,第一发光二极管管芯可以包括使用金属接合分别耦合到第一和第二导电焊盘的第一阳极和阴极触点。 此外,第一阳极接触件和第一焊盘之间以及第一阴极接触件和第二焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60%。 第二发光二极管管芯可以桥接第三和第四导电焊盘。 第二发光二极管管芯可以包括使用金属接合分别耦合到第三和第四导电焊盘的第二阳极和阴极触点。 第二阳极接触件和第二焊盘之间以及第二阴极接触件和第三焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60%。