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    • 23. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120069626A1
    • 2012-03-22
    • US13215594
    • 2011-08-23
    • Takashi NakanoYukio TamaiNobuyoshi Awaya
    • Takashi NakanoYukio TamaiNobuyoshi Awaya
    • G11C11/00
    • G11C29/028G11C13/0007G11C13/0033G11C13/0035G11C2013/0083G11C2029/0409G11C2029/0411
    • The invention provides a semiconductor memory device including a variable resistance element capable of decreasing a variation of a resistance value of stored data due to a large number of times of switching operations and capable of performing a stable writing operation. The device has a circuit that applies a reforming voltage pulse to a memory cell including a variable resistance element of a degraded switching characteristic and a small read margin due to a large number of times of application of a write voltage pulse, to return each resistance state of the variable resistance element to an initial resistance state. By applying the reforming voltage pulse, the variable resistance element can recover at least one resistance state from a variation from the initial resistance state, and can recover the switching characteristic. Accordingly, there is obtained a semiconductor memory device in which a reduction of a read margin is suppressed.
    • 本发明提供了一种包括可变电阻元件的半导体存储器件,该可变电阻元件能够由于大量的开关操作而减少存储数据的电阻值的变化并且能够执行稳定的写入操作。 该装置具有电路,该电路将重整电压脉冲施加到由于施加写入电压脉冲的次数多的包括具有劣化的开关特性的可变电阻元件和小的读取余量的存储单元,以使每个电阻状态 的可变电阻元件到初始电阻状态。 通过施加重整电压脉冲,可变电阻元件可以从初始电阻状态的变化恢复至少一个电阻状态,并且可以恢复开关特性。 因此,获得了抑制读取余量的减小的半导体存储器件。
    • 25. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07433222B2
    • 2008-10-07
    • US11647329
    • 2006-12-29
    • Yasunari HosoiNobuyoshi AwayaIsao Inoue
    • Yasunari HosoiNobuyoshi AwayaIsao Inoue
    • G11C11/00
    • G11C13/0069G11C13/0007G11C13/003G11C2013/009G11C2213/31G11C2213/32G11C2213/72G11C2213/76G11C2213/79
    • A nonvolatile semiconductor device is configured so that a load circuit applying voltage to a variable resistive element is provided electrically connecting in series to the variable resistive element, a load resistive characteristic of the load circuit can be switched between two different characteristics. The two load resistive characteristics are selectively switched depending on whether a resistive characteristic of the variable resistive element transits from low resistance state to high resistance state, or vice versa, voltage necessary for transition from one of the two resistive characteristics to the other is applied by applying writing voltage to a serial circuit of the variable resistive element and load circuit. After the resistive characteristic of the variable resistive element transits from one to the other, voltage applied to the variable resistive element does not allow a resistive characteristic to return from the other to one depending on the selected load resistive characteristic.
    • 非易失性半导体器件被配置为使得向可变电阻元件施加电压的负载电路被提供为电连接到可变电阻元件,负载电路的负载电阻特性可以在两个不同特性之间切换。 根据可变电阻元件的电阻特性是否从低电阻状态转变为高电阻状态,反之亦然,两个负载电阻特性被选择性地切换,或者反过来,通过两个电阻特性之一转换到另一个电阻特性所需的电压被施加 对可变电阻元件和负载电路的串联电路施加写入电压。 在可变电阻元件的电阻特性从一个转变到另一个之后,施加到可变电阻元件的电压根据所选择的负载电阻特性不允许电阻特性从另一个返回到一个。
    • 26. 发明授权
    • Driving method of variable resistance element and memory device
    • 可变电阻元件和存储器件的驱动方法
    • US07236388B2
    • 2007-06-26
    • US11169535
    • 2005-06-28
    • Yasunari HosoiYukio TamaiKazuya IshiharaShinji KobayashiNobuyoshi Awaya
    • Yasunari HosoiYukio TamaiKazuya IshiharaShinji KobayashiNobuyoshi Awaya
    • G11C11/00
    • G11C29/50G11C13/0007G11C13/0069G11C29/50008G11C2013/009G11C2213/31
    • A variable resistance element is configured to be provided with a perovskite-type oxide between a first electrode and a second electrode, of which electric resistance between the first electrode and the second electrode is changed by applying a voltage pulse of a predetermined polarity between the first electrode and the second electrode, and the variable resistance element has a resistance hysteresis characteristic, in which a changing rate of a resistance value is changed from positive to negative with respect to increase of a cumulative pulse applying time in the application of the voltage pulse. The voltage pulse is applied to the variable resistance element so that the cumulative pulse applying time is not longer than a specific cumulative pulse applying time, in which the changing rate of the, resistance value is changed from positive to negative with respect to increase of the cumulative pulse applying time in the resistance hysteresis characteristic.
    • 可变电阻元件被配置为在第一电极和第二电极之间设置有钙钛矿型氧化物,其中通过在第一电极和第二电极之间施加预定极性的电压脉冲来改变第一电极和第二电极之间的电阻 电极和第二电极,并且可变电阻元件具有电阻滞后特性,其中电阻值的变化率相对于施加电压脉冲的累积脉冲施加时间的增加而从正变化到负。 电压脉冲被施加到可变电阻元件,使得累积脉冲施加时间不长于特定的累积脉冲施加时间,其中电阻值的变化率相对于增加的电阻值从正变化到负 累积脉冲施加时间在电阻滞后特性。
    • 28. 发明授权
    • Process for growing a thin metallic film
    • 生长薄金属薄膜的工艺
    • US5316796A
    • 1994-05-31
    • US665610
    • 1991-03-07
    • Nobuyoshi AwayaYoshinobu Arita
    • Nobuyoshi AwayaYoshinobu Arita
    • C23C16/18C23C16/44C23C16/448C23C16/455C23C16/04C23C16/06
    • C23C16/4557C23C16/18C23C16/4482C23C16/45565
    • A chemical vapor deposition process for growing a thin metallic film of copper or gold on a substrate includes providing a starting material composed of a .beta.-ketonato type metal complex of gold or copper in a heated container; preparing a carrier gas for the starting material which is composed of hydrogen as a reducing agent and at least one electron donating substance which bonds to and forms a molecular compound with the starting material by donating an electron to the starting material; passing a flow of the carrier gas through the heated container containing the starting material to form the molecular compound in situ and provide a flow of a gas mixture; introducing the flow of the gas mixture into a reaction chamber in which a substrate is positioned; and growing gold or copper on the substrate by thermally decomposing the molecular compound and any remaining starting material under temperature conditions effective therefor.
    • 用于在衬底上生长铜或金的薄金属膜的化学气相沉积方法包括在加热的容器中提供由β-酮型金属或铜的金属络合物组成的起始材料; 制备由氢气作为还原剂的起始材料的载气和通过向起始原料中提供电子而与原料结合并与原料形成分子化合物的至少一种给电子物质; 使载气的流动通过含有原料的加热容器,以便原位形成分子化合物并提供气体混合物流; 将气体混合物的流动引入到其中定位基板的反应室中; 并通过在有效的温度条件下热分解分子化合物和任何剩余的起始材料,在基底上生长金或铜。
    • 30. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08411488B2
    • 2013-04-02
    • US13233301
    • 2011-09-15
    • Suguru KawabataShinobu YamazakiKazuya IshiharaJunya OnishiNobuyoshi AwayaYukio Tamai
    • Suguru KawabataShinobu YamazakiKazuya IshiharaJunya OnishiNobuyoshi AwayaYukio Tamai
    • G11C11/00
    • G11C11/5685G11C13/0007G11C2013/0071G11C2013/0073G11C2013/0083G11C2213/79
    • A nonvolatile semiconductor memory device includes a memory cell array for storing user data provided by arranging memory cells each having a variable resistive element having a first electrode, a second electrode, and a variable resistor made of a metal oxide sandwiched between the first and second electrodes. The first and second electrodes are formed of a conductive material forming ohmic junction with the variable resistor and a conductive material forming non-ohmic junction with the variable resistor, respectively. The variable resistor changes between two or more different resistance states by applying a voltage between the electrodes. The resistance state after being changed is maintained in a nonvolatile manner. The variable resistive elements of all memory cells in the memory cell array are set to the highest of the two or more different resistance states in an unused state before the memory cell array is used to store the user data.
    • 非易失性半导体存储器件包括存储单元阵列,用于存储通过布置存储单元而提供的用户数据,每个存储单元具有可变电阻元件,该可变电阻元件具有第一电极,第二电极和夹在第一和第二电极之间的金属氧化物制成的可变电阻器 。 第一和第二电极由与可变电阻器形成欧姆结的导电材料和分别与可变电阻器形成非欧姆结的导电材料形成。 可变电阻器通过在电极之间施加电压而在两个或多个不同的电阻状态之间变化。 改变后的电阻状态保持非挥发性。 在存储单元阵列用于存储用户数据之前,将存储单元阵列中的所有存储单元的可变电阻元件设置为处于未使用状态的两个或多个不同电阻状态中的最高值。