专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07589952B2 Multilayer electronic device and method for manufacturing the same 有权
标题翻译：多层电子器件及其制造方法
公开(公告)号：US07589952B2
公开(公告)日：2009-09-15
申请号：US12109371
申请日：2008-04-25
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Tatsuo Kunishi
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Tatsuo Kunishi
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译：例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后，通过喷砂法或刷子抛光法。外部电极由通过电镀或无电镀形成的电镀膜限定。

22. 发明授权

US09165714B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US09165714B2
公开(公告)日：2015-10-20
申请号：US13479397
申请日：2012-05-24
申请人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
发明人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
IPC分类号： H01G4/228 , H01G2/20 , H01G4/008 , C25D5/12 , C25D3/30 , C25D3/12
CPC分类号： H01G4/008 , C25D3/12 , C25D3/30 , C25D5/12
摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.
摘要翻译：抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。端子电极的外部电极位于电子元件的第一和第二端面上。包含电镀Ni的第一电镀膜位于外部电极的表面上。第二镀膜位于第一镀膜的表面上。第二镀膜具有包括第一镀层和第二镀层的堆叠结构。第二镀层比第一镀层具有较低的致密化程度。

23. 发明授权

US08315036B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译：陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。

24. 发明授权

US08254081B2 Laminated ceramic electronic component and manufacturing method thereof 有权
标题翻译：层压陶瓷电子部件及其制造方法
公开(公告)号：US08254081B2
公开(公告)日：2012-08-28
申请号：US12617879
申请日：2009-11-13
申请人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
发明人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
IPC分类号： H01G4/00
CPC分类号： H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.
摘要翻译：在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度和组件主体。将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散。

25. 发明授权

US08194391B2 Multilayer ceramic electronic component and manufacturing method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08194391B2
公开(公告)日：2012-06-05
申请号：US12340570
申请日：2008-12-19
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： H01G4/20 , H01G4/06 , B05D5/12
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

26. 发明授权

US08149566B2 Laminated electronic component and manufacturing method therefor 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08149566B2
公开(公告)日：2012-04-03
申请号：US12781058
申请日：2010-05-17
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： H01G4/008
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露的表面上形成第一镀层，至少在第一镀层的表面上以及在第一镀层的表面上施加防水剂在第一镀层的端边缘所在的部件主体的外表面，然后在其上施加有防水剂的第一镀层上形成第二镀层。

27. 发明授权

US08139342B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

28. 发明授权

US08102640B2 Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component 有权
标题翻译：单片陶瓷电子元件及其制造方法
公开(公告)号：US08102640B2
公开(公告)日：2012-01-24
申请号：US12405405
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Tatsuo Kunishi , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Tatsuo Kunishi , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.
摘要翻译：单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。外部电极包括第一镀层和第二镀层。第一镀层与内部电极直接接触。第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。

29. 发明授权

US08094432B2 Multilayer ceramic electronic component and method for manufacturing the same 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08094432B2
公开(公告)日：2012-01-10
申请号：US12356648
申请日：2009-01-21
申请人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/06
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , H01G13/006
摘要： A method for manufacturing a multilayer ceramic electronic component includes a first substep of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated sublayer, and a second substep of heat-treating the laminate including the plated sublayer at a temperature of at least about 800° C., wherein a plated layer including a plurality of plated sublayers is formed by continuously performing at least two cycles of the first substep and the second substep.
摘要翻译：一种多层陶瓷电子部件的制造方法，其特征在于，在层叠体的规定表面露出的内部电极的一端形成沉积有特定金属的析出物的第一子步骤，使析出物凝集成连续的镀层，以及第二子步骤，其在至少约800℃的温度下对包含所述镀层的层压板进行热处理，其中通过连续地执行所述第一子步骤和所述第一子步骤的至少两个循环来形成包括多个电镀子层的镀层，第二子步。

30. 发明授权

US07765661B2 Method for manufacturing ceramic electronic component and planting bath 有权
标题翻译：制造陶瓷电子元件和种植浴的方法
公开(公告)号：US07765661B2
公开(公告)日：2010-08-03
申请号：US11909736
申请日：2006-02-01
申请人： Akihiro Motoki , Makoto Ogawa , Seiichi Matsumoto , Yoshihiko Takano , Tatsuo Kunishi
发明人： Akihiro Motoki , Makoto Ogawa , Seiichi Matsumoto , Yoshihiko Takano , Tatsuo Kunishi
IPC分类号： H01G7/00 , C25D5/00 , H01G4/008
CPC分类号： C25D5/54 , C25D3/30 , C25D11/34 , H01G4/005 , H01G4/1227 , H01G13/00 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/4902
摘要： A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.
摘要翻译：提供了具有优异的可焊性的陶瓷电子部件的制造方法。在该方法中，钡从陶瓷电子部件的洗脱以及陶瓷电子部件在镀锡中的粘附性降低。制造陶瓷电子部件的方法包括以下步骤：提供含钡陶瓷的电子部件，并在电子部件的外表面上形成电极，电极用锡电镀。在该方法中，镀锡中使用的镀浴的锡离子浓度A为0.03〜0.51mol / L，硫酸根离子浓度B为0.005〜0.31mol / L，摩尔比B / A小于1，pH范围为6.1至10.5。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式