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    • 22. 发明授权
    • Laser measurement apparatus
    • 激光测量装置
    • US07196795B2
    • 2007-03-27
    • US10823166
    • 2004-04-13
    • Haruo UraMakoto OnoYasuomi Ohno
    • Haruo UraMakoto OnoYasuomi Ohno
    • G01N21/00
    • G01S7/4815G01S7/003G01S7/4812G01S7/4813G01S7/4818G01S7/497G01S17/36G01S17/42G01S17/87
    • A laser measurement apparatus for carrying out measurement using a laser beam that is capable of performing various types of measurement with a simple structure is provided. Optical signal processing units 103, 104, 105 output laser beams λ1, λ2, λ3 having different wavelengths via a common optical path A toward an object to be measured, and detect the laser beams being reflected by a corner cube 100 attached to the object to be measured. A control unit 102 controls motors 110, 111 so that the laser beams return to a predetermined position of a optical position sensing device 117 of an optical signal processing unit 103, according to which the direction of a reflecting mirror 112 is controlled so that the laser beams follow the object. The control unit 102 computes the distance to the object, or the shape, position, speed etc. of the object based on signals detected at the optical signal processing units 104, 105.
    • 提供了一种使用能够以简单结构进行各种测量的激光束进行测量的激光测量装置。 光信号处理单元103,104,105经由公共光路A朝向被测量物体输出具有不同波长的激光束λ1,λ2,λ3,并且检测激光束被附接到对象的角立方体100反射 待测。 控制单元102控制马达110,111,使得激光束返回到光信号处理单元103的光学位置检测装置117的预定位置,根据该光信号处理单元103,反射镜112的方向被控制,使得激光 梁跟随物体。 控制单元102基于在光信号处理单元104,105检测到的信号,计算物体的距离,物体的形状,位置,速度等。
    • 23. 发明申请
    • Method for manufacturing product formed with a plurality of parts and method for combining parts
    • 用多个部件制造产品的方法和组合部件的方法
    • US20060293775A1
    • 2006-12-28
    • US11513377
    • 2006-08-31
    • Makoto OnoYoichi NonakaHisaya Ishibashi
    • Makoto OnoYoichi NonakaHisaya Ishibashi
    • G06F19/00
    • G06Q10/04G06Q10/0631G06Q10/06395G06Q50/04Y02P90/30
    • This invention provides a parts-combining method that realizes production with high quality or a high yield for a product formed with a large number of parts, such as a magnetic storage device, multi-chip module, liquid-crystal display device, or printed-circuit board. A first step in this method is to enter an identification number group 21 of nondefective products whose manufacture has already been completed beforehand, an association table 22 of a product identification number group and a parts identification number group, a characteristic data group 23 of parts A with respect to identification numbers of the parts A and a characteristic data group 24 of parts B with respect to identification numbers of the parts B, and conduct a calculation process 11 for a nondefective product space. Next step is to, before a new product is manufactured, enter a characteristic data group 43 of parts A with respect to identification numbers of the parts A and a characteristic data group 44 of parts B with respect to identification numbers of the parts B, and conduct calculations on statistical distances and combinatorial computations between the parts as a calculation process 12. A final step is to output a combination table 13 that includes the identification numbers of the parts A and the identification numbers of the parts B.
    • 本发明提供了一种对于形成有大量部件的产品,例如磁存储装置,多芯片模块,液晶显示装置或印刷电路板,实现高品质或高成品率的生产的部件组合方法, 电路板。 该方法的第一步是输入预先已经完成制造的无缺陷产品的识别号码组21,产品识别号码组的关联表22和部件识别号码组,部分A的特征数据组23 相对于部分B的识别号和部分B的特征数据组24相对于部分B的识别号码,并对非缺陷产品空间进行计算处理11。 下一步是在制造新产品之前,相对于部件B的标识号和部件B的特征数据组44相对于部件B的识别号输入部件A的特征数据组43,以及 对作为计算处理12的部件之间的统计距离和组合计算进行计算。最后一步是输出包括部件A的识别号码和部件B的识别号码的组合表13。
    • 26. 发明授权
    • Method and system for providing useable images on a high resolution display when a 2D graphics window is utilized with a 3D graphics window
    • 当2D图形窗口与3D图形窗口一起使用时,在高分辨率显示器上提供可用图像的方法和系统
    • US07015920B2
    • 2006-03-21
    • US10427386
    • 2003-04-30
    • Makoto Ono
    • Makoto Ono
    • G09G5/36
    • G09G5/391G09G2340/0407
    • A graphics pipeline for use with a high resolution display is disclosed. The graphics pipeline comprises a frame buffer configuration. The frame buffer configuration includes a first mode area and a second mode area. The graphics pipeline further includes a display pipeline for obtaining data from the frame buffer configuration. The display pipeline includes a controller. The controller provides pixels from the first mode area to the display as is. Finally, the controller expands pixels from the second mode area and provides the expanded pixels to the display. Accordingly, a system and method in accordance with the present invention solves the GUI problem (small icon and small menu text) of high resolution display by allowing the 3D Graphics Window to display fine pitch pictures while being able to display images in the 2D graphics window in a useable form. The system and method in accordance does not depend on the types of drawing objects (line or surface), drawing order, and crossover.
    • 公开了一种用于高分辨率显示器的图形管线。 图形管线包括帧缓冲器配置。 帧缓冲器配置包括第一模式区域和第二模式区域。 图形管线还包括用于从帧缓冲器配置获得数据的显示管道。 显示管道包括控制器。 控制器提供从第一模式区域到显示器的像素。 最后,控制器从第二模式区域扩展像素并将扩展的像素提供给显示器。 因此,根据本发明的系统和方法通过允许3D图形窗口在2D图形窗口中显示图像的同时显示精细的间距图像来解决高分辨率显示的GUI问题(小图标和小菜单文本) 在一个可用的形式。 系统和方法不依赖于绘图对象(线或面)的类型,绘图顺序和交叉。
    • 28. 发明授权
    • Method and system for manufacturing semiconductor devices, and method
and system for inspecting semiconductor devices
    • 用于制造半导体器件的方法和系统以及用于检查半导体器件的方法和系统
    • US5801965A
    • 1998-09-01
    • US362763
    • 1994-12-22
    • Yuji TakagiHideaki DoiMakoto Ono
    • Yuji TakagiHideaki DoiMakoto Ono
    • G01B11/24G01N21/94G01R31/26H01L21/66G06F19/00
    • G01N21/94
    • The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.
    • 本发明涉及一种检查产品的方法和系统,包括从产品中提取缺陷,基于代表缺陷类比的提取缺陷的信息对缺陷进行分类,基于缺陷提取缺陷的特征数据 的缺陷分类结果,并将提取的缺陷的特征数据反馈进行检查。 该方法和系统的特征在于反馈所提取的缺陷特征数据以检查产品。 本发明还涉及一种制造半导体电气或电子设备的方法,包括从半导体电子或电子设备中提取缺陷,基于关于表示类似于缺陷的提取缺陷的信息来分类缺陷,提取特征 基于缺陷分类的结果的缺陷的数据,并将提取的缺陷的特征数据反馈到用于制造半导体电子或电子设备的装置。
    • 30. 发明授权
    • Method of inspecting thin film transistor liquid crystal substrate and
apparatus therefor
    • 检查薄膜晶体管液晶基板的方法及其装置
    • US5309108A
    • 1994-05-03
    • US921583
    • 1992-07-30
    • Shunji MaedaHitoshi KubotaMakoto Ono
    • Shunji MaedaHitoshi KubotaMakoto Ono
    • G06T7/00G09G3/00G01R31/02G06K9/00
    • G09G3/006G06T7/001G06T2207/10048G06T2207/30121
    • The invention relates to a method of inspecting and correcting a thin film transistor liquid crystal substrate and an apparatus therefor, where a plurality of scan lines and signal lines are connected electrically in common at each one terminal side respectively, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of applying voltage between the scan lines and the signal lines, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of stopping the voltage application, and the scan lines and the signal lines relating to variation of the heating state are detected from difference or quotient between an infrared image at the voltage applying state and an infrared image at the stopping state of voltage application, thereby a pixel address with a shortcircuit defect occurring is specified. If an image part being equal to the set threshold value or more does not exist in the difference infrared image in the pixel address, a wiring pattern position in the pixel address is detected from a visible image of the pixel address, and this wiring pattern and one from a neighboring pixel address are compared to detect a short circuit defect which can be removed by laser.
    • 本发明涉及一种薄膜晶体管液晶基板的检查和校正方法及其装置,其中多个扫描线和信号线分别在每个一个端子侧共同电连接,并且在该像素之外的红外图像 在从施加扫描线和信号线之间的电压的时间点经过规定时间之后检测域,并且在从停止施加电压的时间点经过规定时间之后检测像素域外的红外图像 ,并且在电压施加状态下的红外图像与在施加电压的停止状态的红外图像之间的差或商检测与加热状态的变化相关的扫描线和信号线,从而具有短路的像素地址 指定缺陷发生。 如果像素地址中的差异红外图像中不存在等于设定阈值的图像部分,则从像素地址的可视图像检测像素地址中的布线图案位置,并且该布线图案和 比较来自相邻像素地址的一个,以检测可以通过激光去除的短路缺陷。