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    • 21. 发明申请
    • Robust Cable Connectivity Test Receiver For High-Speed Data Receiver
    • 用于高速数据接收器的坚固的电缆连接测试接收器
    • US20080316930A1
    • 2008-12-25
    • US11766268
    • 2007-06-21
    • Huihao XuLouis L. HsuKevin G. KramerJames D. RockrohrMichael A. Sorna
    • Huihao XuLouis L. HsuKevin G. KramerJames D. RockrohrMichael A. Sorna
    • G01R31/08
    • G01R31/041G01R31/026
    • A system is provided for detecting a fault in a signal transmission path. In one embodiment, the system can include a variable amplitude signal attenuator which is operable to modify an input signal by variably attenuating a signal voltage swing of the input signal. Desirably, the input signal is attenuated only when transitioning from a high signal voltage level towards a low signal voltage level d variably, such that a larger high-to-low signal voltage swing is attenuated more than a smaller high-to-low signal voltage swing. Desirably, a comparator, which may apply hysteresis to the output signals, may detect a crossing of a reference voltage level by the modified input signal. In this way, when the comparator does not detect an expected crossing of the reference voltage level by the modified input signal, a determination can be made that a fault exists in the signal transmission path.
    • 提供了一种用于检测信号传输路径中的故障的系统。 在一个实施例中,系统可以包括可变幅度信号衰减器,其可操作以通过可变地衰减输入信号的信号电压摆幅来修改输入信号。 期望地,只有当从高信号电压电平转换到低信号电压电平d时,输入信号才被衰减,使得较高的高电平到低的信号电压摆幅比较小的高到低的信号电压衰减 摇摆。 期望地,可能对输出信号施加迟滞的比较器可以检测参考电压电平与修改的输入信号的交叉。 以这种方式,当比较器没有检测到通过修改的输入信号的参考电压电平的预期交叉时,可以确定在信号传输路径中存在故障。
    • 23. 发明申请
    • On-chip electromigration monitoring
    • 片上电迁移监测
    • US20080265931A1
    • 2008-10-30
    • US12215732
    • 2008-06-30
    • Louis L. HsuHayden C. CranfordOleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • Louis L. HsuHayden C. CranfordOleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • G01R31/26
    • G01R31/2858G01R31/2884G01R31/318533
    • A method is provided for monitoring interconnect resistance within a semiconductor chip assembly. A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.
    • 提供了一种用于监测半导体芯片组件内的互连电阻的方法。 半导体芯片组件可以包括具有暴露在半导体芯片的表面处的触点的半导体芯片和具有与触点导电连通的暴露端子的基板。 半导体芯片的多个受监测元件可以包括导电互连,每个导体互连通过半导体芯片内的布线互连半导体芯片的相应的一对节点。 在这种方法的示例中,在半导体芯片组件的寿命期间,跨越每个被监测元件的电压降与在半导体芯片上的相应参考元件上的参考电压降在多个不同时间进行比较。 以这种方式,当这种被监视的元件的电阻超过阈值时,可以检测它。 基于这种比较的结果,可以做出是否指示动作条件的决定。
    • 24. 发明授权
    • On-chip electromigration monitoring system
    • 片上电迁移监控系统
    • US07394273B2
    • 2008-07-01
    • US11306985
    • 2006-01-18
    • Louis L. HsuHayden C. Cranford, Jr.Oleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • Louis L. HsuHayden C. Cranford, Jr.Oleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • G01R31/02
    • G01R31/2858G01R31/2884G01R31/318533
    • A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
    • 提供一种封装的半导体芯片,其包括半导体芯片和封装元件。 半导体芯片包括多个半导体器件和设置在半导体芯片的外表面处的多个导电特征。 封装元件具有导电连接到半导体芯片的多个导电特征的多个外部特征。 半导体芯片包括被监视的元件,该元件包括将半导体芯片的第一节点与半导体芯片的第二节点导电互连的导电互连。 半导体芯片中的检测电路可操作以在封装的半导体芯片的寿命期间的多个不同时间将所监视的元件上的可变电压降与芯片上的参考元件上的参考电压降进行比较,以便检测何时 被监测元件的电阻超过阈值。
    • 28. 发明授权
    • On-chip electromigration monitoring
    • 片上电迁移监测
    • US07719302B2
    • 2010-05-18
    • US12215732
    • 2008-06-30
    • Louis L. HsuHayden C. Cranford, Jr.Oleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • Louis L. HsuHayden C. Cranford, Jr.Oleg GluschenkovJames S. MasonMichael A. SornaChih-Chao Yang
    • G01R31/02
    • G01R31/2858G01R31/2884G01R31/318533
    • A method is provided for monitoring interconnect resistance within a semiconductor chip assembly, A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.
    • 提供了一种用于监测半导体芯片组件内的互连电阻的方法。半导体芯片组件可以包括具有在半导体芯片的表面处露出的触点的半导体芯片和具有与触点导电连通的露出端子的基板。 半导体芯片的多个受监测元件可以包括导电互连,每个导体互连通过半导体芯片内的布线互连半导体芯片的相应的一对节点。 在这种方法的示例中,在半导体芯片组件的寿命期间,跨越每个被监测元件的电压降与在半导体芯片上的相应参考元件上的参考电压降在多个不同时间进行比较。 以这种方式,当这种被监视的元件的电阻超过阈值时,可以检测它。 基于这种比较的结果,可以做出是否指示动作条件的决定。
    • 29. 发明授权
    • Programmable impedance matching circuit and method
    • 可编程阻抗匹配电路及方法
    • US07145413B2
    • 2006-12-05
    • US10250177
    • 2003-06-10
    • Louis L. HsuJoseph NatonioDaniel W. StoraskaWilliam F. Washburn
    • Louis L. HsuJoseph NatonioDaniel W. StoraskaWilliam F. Washburn
    • H03H7/38
    • H03H7/38
    • As disclosed herein, a microelectronic circuit and method are provided for improving signal integrity at a transmission line. The circuit includes a programmably adjustable impedance matching circuit which is coupled to a transmission line which includes a programmably adjustable inductive element. The programmably adjustable impedance matching circuit is desirably provided on the same chip as a receiver or transmitter to which the transmission line is coupled, or alternatively, on an element packaged together with the chip that includes the receiver or transmitter. The impedance of the programmably adjustable impedance matching circuit is adjustable in response to control input to improve signal integrity at the transmission line.
    • 如本文所公开的,提供微电子电路和方法来改善传输线处的信号完整性。 该电路包括可编程调节的阻抗匹配电路,其耦合到包括可编程调节的电感元件的传输线。 可编程可调节阻抗匹配电路理想地设置在与传输线耦合的接收器或发射器相同的芯片上,或者替代地在与包括接收器或发射器的芯片一起封装的元件上。 可编程可调阻抗匹配电路的阻抗可以响应于控制输入而调节,以改善传输线处的信号完整性。