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21. 发明申请

US20080118707A1 METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING 审中-公开
标题翻译：用于干蚀刻的图案掩模的方法和结构
公开(公告)号：US20080118707A1
公开(公告)日：2008-05-22
申请号：US11562442
申请日：2006-11-22
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee
IPC分类号： B32B3/00
CPC分类号： H01L27/14618 , H01L24/03 , H01L27/14683 , H01L2224/04042 , H01L2224/85013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01094 , H01L2924/30107 , H01L2924/3025 , Y10T428/24355
摘要： The present invention provides a structure for etching process. The structure has a mask for protecting an area of a wafer from being etched and a seal ring attached under a lower surface of the mask. The mask has at least one air opening to expose an area to be etched. Furthermore, the mask is attached on the wafer through the seal ring. In addition, the present invention provides also a method to form a mask for dry etching process. First, the present invention includes a step of providing a base material and coating the masking material on both sides of the base material. The next step is to pattern the masking material to form openings. Subsequently, the base material is etched through the openings to create at least one mask opening and a mask cavity. Finally, removing the mask material is performed.
摘要翻译：本发明提供蚀刻工艺的结构。该结构具有用于保护晶片的区域不被蚀刻的掩模和附着在掩模的下表面下方的密封环。掩模具有至少一个空气开口以暴露待蚀刻的区域。此外，掩模通过密封环附着在晶片上。此外，本发明还提供一种形成干法蚀刻工艺的掩模的方法。首先，本发明包括提供基材并在基材的两侧上涂覆掩模材料的步骤。下一步是将掩模材料图案化以形成开口。随后，通过开口蚀刻基材以产生至少一个掩模开口和掩模腔。最后，执行去除掩模材料。

22. 发明申请

US20060219167A1 Apparatus and method of vacuum metallic sintering for a semiconductor 审中-公开
标题翻译：用于半导体的真空金属烧结的装置和方法
公开(公告)号：US20060219167A1
公开(公告)日：2006-10-05
申请号：US11094279
申请日：2005-03-31
申请人： Hung-Lung Cheng , Hui-Chung Wu , Chi-Chen Lee
发明人： Hung-Lung Cheng , Hui-Chung Wu , Chi-Chen Lee
IPC分类号： H01L21/22
CPC分类号： H01L21/324 , H01L21/67017 , H01L21/67109 , H01L21/67754
摘要： An apparatus and method of vacuum metallic sintering for a semiconductor uses a quartz tube, a vacuum air-extracting apparatus, a furnace and a gas injection pipe. The metal sintered does not produce metal oxide in a vacuum established by the vacuum air-extracting apparatus. After sintering, a movable furnace can withdraw from the quartz tube immediately to decrease cooling time.
摘要翻译：用于半导体的真空金属烧结的装置和方法使用石英管，真空抽气装置，炉和气体注入管。烧结的金属在由真空抽气装置建立的真空中不产生金属氧化物。烧结后，立即从石英管退出可移动炉，减少冷却时间。

23. 发明申请

US20110134746A1 METHOD OF REDUCING INTERFERENCE BETWEEN TWO COMMUNICATION SYSTEMS OPERATING IN ADJACENT FREQUENCY BANDS 有权
标题翻译：减少两个通信系统在相邻频段操作的干扰的方法
公开(公告)号：US20110134746A1
公开(公告)日：2011-06-09
申请号：US12962623
申请日：2010-12-07
申请人： Tai-Cheng Liu , Chi-Chen Lee , Ming-Chun Cheng , Chun-Jen Tsai , Chia-Ming Chang , Ching-Hwa Yu
发明人： Tai-Cheng Liu , Chi-Chen Lee , Ming-Chun Cheng , Chun-Jen Tsai , Chia-Ming Chang , Ching-Hwa Yu
IPC分类号： H04J3/10
CPC分类号： H04L1/0001 , H04L1/1829
摘要： A method of reducing interference between two communication systems operating in adjacent frequency bands and coexisting in a communication device is provided, and the two communication systems are a first communication system using TDD and a second communication system which is content-based. The method includes deciding whether to perform an arbitration procedure on a downlink subframe of the first communication system according to a CINR of the first communication system and a RSSI of the second communication system; deciding whether to perform the arbitration procedure on an uplink subframe of the first communication system according to a transmit power of the first communication system and a RSSI value of the second communication system; and when deciding to perform the arbitration procedure on the downlink or uplink subframe, further deciding whether to send a specific packet to request one or more stations not to send packets to the second communication system.
摘要翻译：提供了减少在相邻频带中工作并且在通信设备中共存的两个通信系统之间的干扰的方法，并且两个通信系统是使用TDD的第一通信系统和基于内容的第二通信系统。该方法包括根据第一通信系统的CINR和第二通信系统的RSSI来决定是否对第一通信系统的下行链路子帧执行仲裁过程; 根据所述第一通信系统的发送功率和所述第二通信系统的RSSI值来决定是否对所述第一通信系统的上行链路子帧执行所述仲裁过程; 并且当决定在下行链路或上行链路子帧上执行仲裁过程时，进一步决定是否发送特定分组以请求一个或多个站不向第二通信系统发送分组。

24. 发明申请

US20110007719A1 METHOD FOR SETTING TRANSMISSION TIMING OF WIRELESS COMMUNICATION APPARATUS 审中-公开
标题翻译：用于设置无线通信设备传输时序的方法
公开(公告)号：US20110007719A1
公开(公告)日：2011-01-13
申请号：US12622442
申请日：2009-11-20
申请人： Chi-Chen Lee
发明人： Chi-Chen Lee
IPC分类号： H04J3/00
CPC分类号： H04J3/0682 , H04W24/00 , H04W36/08 , H04W56/0045
摘要： A method for setting an uplink transmission timing of a wireless communication apparatus, comprises: acquiring an initial uplink transmission advance timing by an initial ranging procedure during the wireless communication apparatus being served by SBS; receiving a downlink preamble signal from SBS; determining the downlink preamble signal receiving time at the wireless communication apparatus; and, setting an uplink transmission timing for the wireless communication apparatus according to the acquired initial uplink transmission advance timing and the downlink preamble signal receiving time. Another method comprises: acquiring an initial uplink transmission advance timing by an initial ranging procedure during the wireless communication apparatus being served by SBS; handing over the wireless communication apparatus to TBS from SBS; and, updating the uplink transmission timing for the wireless communication apparatus according to the acquired initial uplink transmission advance timing and the difference of receiving times of downlink preamble signals transmitted from SBS and TBS.
摘要翻译：一种用于设置无线通信装置的上行链路传输定时的方法，包括：在由SBS服务的无线通信装置期间，通过初始测距过程获取初始上行链路传输提前定时; 从SBS接收下行链路前导码信号; 确定在无线通信设备处的下行链路前导信号接收时间; 以及根据所获取的初始上行链路传输提前定时和下行链路前导信号接收时间来设置无线通信装置的上行链路传输定时。另一方法包括：在由SBS服务的无线通信设备期间，通过初始测距过程获取初始上行链路传输提前定时; 将无线通信设备从SBS切换到TBS; 以及根据所获取的初始上行链路传输提前定时和从SBS和TBS发送的下行链路前置信号的接收时间差，更新无线通信装置的上行链路传输定时。

25. 发明申请

US20090166873A1 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME 审中-公开
标题翻译：半导体器件封装的连接结构及其相关方法
公开(公告)号：US20090166873A1
公开(公告)日：2009-07-02
申请号：US11965157
申请日：2007-12-27
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Mon-Chin Tsai
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Mon-Chin Tsai
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L27/14618 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/24 , H01L24/29 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/12105 , H01L2224/24137 , H01L2224/73267 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/3512 , H01L2924/00
摘要： The interconnecting structure for a semiconductor die includes a die having bonding pads on an active surface; a core attached the side wall (edge) of the die by adhesion material; an isolating base adhered on the active surface of the die by adhesion glue; a through silicon via (TSV) open from the back side of the die to expose the bonding pads; a build up layer coupled between the bonding pads to terminal metal pads by the through silicon via; solder balls melted on terminal pads, wherein the terminal pads located on the core and/or the die.
摘要翻译：半导体管芯的互连结构包括：在有源表面上具有接合焊盘的管芯; 通过粘合材料将芯片的侧壁（边缘）附着在芯上; 通过粘合胶粘在模具的活性表面上的隔离基体; 从芯片的背面开口的通硅通孔（TSV）露出接合焊盘; 通过硅通孔将接合焊盘耦合到端子金属焊盘的堆积层; 焊球在端子焊盘上熔化，其中位于芯和/或模具上的端子焊盘。

26. 发明授权

US08630230B2 Method of reducing interference between two communication systems operating in adjacent frequency bands 有权
标题翻译：减少在相邻频带中工作的两个通信系统之间的干扰的方法
公开(公告)号：US08630230B2
公开(公告)日：2014-01-14
申请号：US12962623
申请日：2010-12-07
申请人： Tai-Cheng Liu , Chi-Chen Lee , Ming-Chun Cheng , Chun-Jen Tsai , Chia-Ming Chang , Ching-Hwa Yu
发明人： Tai-Cheng Liu , Chi-Chen Lee , Ming-Chun Cheng , Chun-Jen Tsai , Chia-Ming Chang , Ching-Hwa Yu
IPC分类号： H04W4/00
CPC分类号： H04L1/0001 , H04L1/1829
摘要： A method of reducing interference between two communication systems operating in adjacent frequency bands and coexisting in a communication device is provided, and the two communication systems are a first communication system and a second communication system. The method includes deciding whether to perform an arbitration procedure on a downlink subframe of the first communication system according to a CINR of the first communication system and a RSSI of the second communication system; deciding whether to perform the arbitration procedure on an uplink subframe of the first communication system according to a transmit power of the first communication system and a RSSI value of the second communication system; and when deciding to perform the arbitration procedure on the downlink or uplink subframe, further deciding whether to send a specific packet to request one or more stations not to send packets to the second communication system.
摘要翻译：提供了减少在相邻频带中工作并在通信设备中共存的两个通信系统之间的干扰的方法，并且两个通信系统是第一通信系统和第二通信系统。该方法包括根据第一通信系统的CINR和第二通信系统的RSSI来决定是否对第一通信系统的下行链路子帧执行仲裁过程; 根据所述第一通信系统的发送功率和所述第二通信系统的RSSI值来决定是否对所述第一通信系统的上行链路子帧执行所述仲裁过程; 并且当决定在下行链路或上行链路子帧上执行仲裁过程时，进一步决定是否发送特定分组以请求一个或多个站不向第二通信系统发送分组。

27. 发明申请

US20090176494A1 HANDOVER CONTROLLING PROCESS CAPABLE OF DETECTING LOST HANDOVER MESSAGE 审中-公开
标题翻译：检测失控消息的切换控制过程
公开(公告)号：US20090176494A1
公开(公告)日：2009-07-09
申请号：US12346895
申请日：2008-12-31
申请人： Chi-Chen Lee , Tsai-Pao Lee
发明人： Chi-Chen Lee , Tsai-Pao Lee
IPC分类号： H04W36/00
CPC分类号： H04W36/0055 , H04L1/18
摘要： The behavior of an MS and Serving BS is clarified in a situation where a handover message, such as a handover request message or an indication message, is lost. By setting a timer and an acknowledgement of the handover message, a handover control process is capable of detecting the loss of the handover message. When the loss is detected, the MS or the Serving BS can resend the lost message or perform some repairing steps to avoid asynchronous states of the MS and the Serving BS.
摘要翻译：在切换消息（例如切换请求消息或指示消息）丢失的情况下，MS和服务BS的行为被清楚。通过设置切换消息的定时器和确认，切换控制处理能够检测切换消息的丢失。当检测到丢失时，MS或服务BS可以重新发送丢失的消息或执行一些修复步骤以避免MS和服务BS的异步状态。

28. 发明申请

US20080157398A1 Semiconductor device package having pseudo chips 审中-公开
标题翻译：具有伪芯片的半导体器件封装
公开(公告)号：US20080157398A1
公开(公告)日：2008-07-03
申请号：US11819193
申请日：2007-06-26
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2221/68345 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/24 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/48227 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/01026 , H01L2924/00012
摘要： The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.
摘要翻译：本发明提供了一种具有伪芯片结构的半导体器件封装，包括：第一衬底，其具有形成在其上的通孔; 具有第一接合焊盘的第一管芯和分别设置在所述管芯内的第二接合焊盘的第二管芯，形成在所述第一和第二管芯之间的间隙中的粘合材料和所述第一基板的贯穿孔的所述管芯的侧壁; 再分配线被形成为分别将形成在第一基板上的第一接触焊盘耦合到第一接合焊盘和第二接合焊盘; 以及形成在再分配线上的保护层，第一管芯，第二管芯和第一基板。

29. 发明申请

US20080123673A1 METHOD FOR TRANSMITTING PACKET AND SYSTEM FOR MOBILE COMMUNICATION THEREOF AND MOBILE STATION 审中-公开
标题翻译：用于发送移动通信和移动站的分组和系统的方法
公开(公告)号：US20080123673A1
公开(公告)日：2008-05-29
申请号：US11756895
申请日：2007-06-01
申请人： Chi-Chen Lee
发明人： Chi-Chen Lee
IPC分类号： H04L12/56
CPC分类号： H04L1/1874 , H04L1/1887 , H04W36/0011 , H04W36/02
摘要： A method for transmitting packet is disclosed. The method is adopted in a system for mobile communication and the system including a mobile station and a network providing connection-oriented service. After optimizing the packet sequence number according to the connection service characteristics and the downlink packet sequence number in the mobile station and the network providing connection-oriented service, the out-of-date packets are deleted. Therefore, the transmission and retransmission of the out-of-date packets may be avoided and thereby reduce delays and decrease required bandwidth.
摘要翻译：公开了发送分组的方法。该方法在移动通信系统中采用，该系统包括移动台和提供面向连接的业务的网络。根据移动台的连接业务特性和下行分组序列号优化分组序列号，提供面向连接的业务的网络，删除过时的分组。因此，可以避免过时的分组的传输和重传，从而减少延迟并减少所需的带宽。

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