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21. 发明授权

US07959261B2 Micro-fluid ejection devices having reduced input/output addressable heaters 有权
标题翻译：具有减少的输入/输出可寻址加热器的微流体喷射装置
公开(公告)号：US07959261B2
公开(公告)日：2011-06-14
申请号：US11745545
申请日：2007-05-08
申请人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
发明人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14129 , B41J2/14072 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1642 , B41J2/1646 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates.
摘要翻译：微流体喷射装置，用于制造微流体喷射的方法，具有在第一基板上具有N个致动器的微流体喷射头和能够在第二基板上驱动N个致动器的逻辑。喷头在第一和第二基板之间也具有少于N个电连接。

22. 发明授权

US07937835B2 Composite ceramic substrate for micro-fluid ejection head 有权
标题翻译：用于微流体喷射头的复合陶瓷基板
公开(公告)号：US07937835B2
公开(公告)日：2011-05-10
申请号：US12697308
申请日：2010-02-01
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B21H1/08 , B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译：一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

23. 发明申请

US20090189954A1 INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS 有权
标题翻译：具有保护连接的墨水喷射结构
公开(公告)号：US20090189954A1
公开(公告)日：2009-07-30
申请号：US12021375
申请日：2008-01-29
申请人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/01
CPC分类号： B41J2/17553 , B41J2/17526
摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.
摘要翻译：喷墨结构包括具有第一表面和第二表面的基底。加热器芯片安装到基板的第二表面，并且包括第一组电触头。打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。第三表面安装到基板的第二表面。第四表面具有通过引线键合连接到第一组电触点的第二组电触头。第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。

24. 发明申请

US20080299361A1 Composite Ceramic Substrate For Micro-Fluid Ejection Head 失效
标题翻译：微流体喷射头复合陶瓷基板
公开(公告)号：US20080299361A1
公开(公告)日：2008-12-04
申请号：US11757573
申请日：2007-06-04
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/01
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译：一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

25. 发明授权

US07018503B2 Manufacturing method for ink jet pen 有权
公开(公告)号：US07018503B2
公开(公告)日：2006-03-28
申请号：US10408543
申请日：2003-04-07
申请人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
发明人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
IPC分类号： B32B7/14
CPC分类号： B41J2/1607 , B41J2/14024 , B41J2/1601 , B41J2/1623 , B41J2002/14362 , B41J2202/20 , Y10T29/42 , Y10T29/49083 , Y10T29/4913 , Y10T29/49401
摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

26. 发明授权

US06210522B1 Adhesive bonding laminates 有权
标题翻译：粘合层压板
公开(公告)号：US06210522B1
公开(公告)日：2001-04-03
申请号：US09333455
申请日：1999-06-15
申请人： Jeanne Marie Saldanha Singh , Paul Timothy Spivey
发明人： Jeanne Marie Saldanha Singh , Paul Timothy Spivey
IPC分类号： B41J216
CPC分类号： B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/365 , B32B27/40 , B32B37/12 , B32B2457/08 , B41J2/16 , B41J2/1603 , B41J2/1623 , C09J5/00 , C09J5/06 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2400/163 , C09J2461/00 , C09J2469/00 , C09J2475/00 , H05K1/0393 , H05K3/0061 , H05K3/386 , H05K2201/0195 , Y10S428/901 , Y10T428/287
摘要： An adhesive bonding laminate includes a first thermoplastic adhesive film that is capable of adhesively bonding to an epoxy coating and a second thermoset adhesive film that is capable of adhesively bonding to a passivated surface of a substrate. The first thermoplastic adhesive film is adhesively bonded to the second thermoset adhesive film. Ink jet printheads, ink jet print cartridges and methods of attaching a flexible circuit to substrate employ the adhesive bonding laminate.
摘要翻译：粘合层压体包括能够粘合到环氧树脂涂层上的第一热塑性粘合剂膜和能够粘合到基材的钝化表面上的第二热固性粘合剂膜。第一热塑性粘合剂膜粘合到第二热固性粘合剂膜上。喷墨打印头，喷墨打印墨盒和将柔性电路连接到基板的方法采用粘合剂粘结层压体。

27. 发明授权

US5953032A Method for forming and inspecting a barrier layer of an ink jet print cartridge 失效
标题翻译：用于形成和检查喷墨打印墨盒的阻挡层的方法
公开(公告)号：US5953032A
公开(公告)日：1999-09-14
申请号：US872509
申请日：1997-06-10
申请人： Leea Danielle Haarz , Tonya Harris Jackson , Jeanne Marie Saldanha Singh
发明人： Leea Danielle Haarz , Tonya Harris Jackson , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/175 , B41J2/16
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623
摘要： A process is provided for forming a barrier layer over one or more extending sections of a flexible circuit and one or more bond pads of a print cartridge printhead using an encapsulant material and subsequently inspecting the print cartridge to determine if the encapsulant material has been properly placed on the print cartridge. The process involves providing an inspection mark on an orifice plate of the printhead before the barrier layer is formed. After the barrier layer has been formed, an inspection is made to determine if the barrier layer extends beyond the inspection mark and contacts a second portion of the print cartridge. If it does, then the print cartridge is unacceptable. If not, then the print cartridge is acceptable. Alternatively, the location of the barrier layer may be considered unacceptable if it contacts any portion of the inspection mark even though it may not contact the second portion of the print cartridge.
摘要翻译：提供了一种方法，用于在柔性电路的一个或多个延伸部分和打印墨盒打印头的一个或多个接合焊盘之间使用密封材料形成阻挡层，随后检查打印墨盒以确定密封剂材料是否已经被正确放置在打印碳粉盒上。该方法包括在形成阻挡层之前在打印头的孔板上提供检查标记。在形成阻挡层之后，进行检查以确定阻挡层是否延伸超过检查标记并接触打印碳粉盒的第二部分。如果是，则打印墨盒是不可接受的。如果没有，那么打印墨盒是可以接受的。或者，如果阻挡层的位置接触到检查标记的任何部分，即使其不接触打印碳粉盒的第二部分，也可认为是不可接受的。

28. 发明授权

US08500242B2 Micro-fluid ejection head 失效
标题翻译：微流体喷头
公开(公告)号：US08500242B2
公开(公告)日：2013-08-06
申请号：US12974725
申请日：2010-12-21
申请人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
发明人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
IPC分类号： B41J2/145
CPC分类号： B41J2/155
摘要： A micro-fluid ejection head for a printer is disclosed. The micro-fluid ejection head comprises a plurality of printhead modules. Each of the plurality of printhead modules comprises an ejection chip for ejecting fluid. The micro-fluid ejection head further comprises a support frame to mount the plurality of printhead modules for creating a lengthy array of the plurality of printhead modules. The support frame is electrically coupled with the plurality of printhead modules for allowing the plurality of printhead modules to receive data and electrical power.
摘要翻译：公开了一种用于打印机的微流体喷射头。微流体喷射头包括多个打印头模块。多个打印头模块中的每一个包括用于喷射流体的喷射芯片。微流体喷射头还包括支撑框架以安装多个打印头模块，用于创建多个打印头模块的冗长阵列。支撑框架与多个打印头模块电耦合，以允许多个打印头模块接收数据和电力。

29. 发明申请

US20120236076A1 PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS 有权
标题翻译：用于组装原理的标题和方法
公开(公告)号：US20120236076A1
公开(公告)日：2012-09-20
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/145 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

30. 发明申请

US20120182355A1 DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRATE HAVING IMPROVED THIXOTROPIC PROPERTIES 有权
标题翻译：具有改进的三面体性能的平坦基材上的硅芯片布置的附件组合物
公开(公告)号：US20120182355A1
公开(公告)日：2012-07-19
申请号：US13008428
申请日：2011-01-18
申请人： David Graham , Jeanne Marie Saldanha Singh , Richard D. Wells , Joel Provence
发明人： David Graham , Jeanne Marie Saldanha Singh , Richard D. Wells , Joel Provence
IPC分类号： B41J2/05 , H01L21/50 , C08L63/00
CPC分类号： B41J2/01 , B41J2/0458 , C08G59/306 , C08G59/56 , C08K5/5415 , C09J163/00 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83855 , H01L2924/00013 , H01L2924/10253 , H01L2924/15787 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
摘要翻译：使用芯片附着组合物将硅芯片粘合在平坦的基板上。芯片附着组合物包括具有刚性主链的可交联环氧树脂，环氧硅氧烷树脂，热解法二氧化硅填料，胺固化剂和硅烷偶联剂。芯片附着组合物在形成喷墨打印头组件时将硅加热器芯片粘合在平坦陶瓷基板上是特别有用的。芯片附着组合物允许将硅加热器芯片精确地放置在平坦的陶瓷基板上并显示出良好的耐油墨性。

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